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Method for processing Beryllium copper plate strip for secondary electronic emission

A secondary electron emission and processing method technology, which is applied in the field of material processing method protection, can solve the problems of high emission performance and low impurity content, and achieve the effect of good tissue uniformity, good adhesion, and easy removal

Inactive Publication Date: 2013-05-15
CENT SOUTH UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Beryllium bronze alloy, after treatment, forms a thin layer of beryllium oxide on the surface, which is the main layer of secondary electron emitter, so the content of beryllium and impurity elements in beryllium bronze alloy determines the secondary electron emission performance of beryllium copper alloy At present, the beryllium copper alloy on the market mainly contains 1.5wt.%~2.0wt.%, and the content of impurity elements is high, but the accuracy of beryllium copper alloy based on electron emission requires high secondary electron emission performance of the alloy, and the error Small, but commercially available common materials cannot meet its requirements. A beryllium bronze material with high beryllium content and low impurity content is required. The main requirements of this material are: the beryllium content is 2.7%~3.0wt.%, and the impurity content is controlled at Below 0.1wt.%, the composition of the strip alloy is uniform

Method used

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  • Method for processing Beryllium copper plate strip for secondary electronic emission

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Experimental program
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Effect test

Embodiment 1

[0017] Embodiment 1: Cu-2.7Be plate manufacture

[0018] (1) Mix a certain proportion of copper powder and beryllium-copper master alloy, and perform mechanical alloying in an omnidirectional planetary ball mill. The ball-to-material ratio is 10:1, the medium is alcohol, and the ball milling time is 10h.

[0019] The mixed powder is plasticized and extruded, and the binder is paraffin-edible oil-polyethylene glycol, wherein the volume fraction of paraffin wax is 50%, the volume fraction of edible oil is 20%, and the volume fraction of polyethylene glycol The volume fraction is 30%.

[0020] (2) After degreasing, it is sintered at 880°C under hydrogen and oxygen atmosphere, and the sintering time is 5h, and the ingot with a thickness of 3mm is made, and its composition is Be: 2.7%, Ni: 0.21wt.%, Fe : 0.058wt.%, Al: 0.013wt.%, Si: 0.028wt.%, Pb: 0.0020wt.%, Cd: 0.0020wt.%, Zn: 0.0020wt.%, the sum of other impurity elements is 0.43wt. %, the rest is Cu.

[0021] (3) Plastici...

Embodiment 2

[0023] Embodiment 2: Cu-2.7Be plate manufacture

[0024] The ingot billet is manufactured by the traditional vacuum melting process, the billet is heated to 760°C, kept for 0.5h, and then rolled. Pickling is carried out every three passes, and annealing is carried out in each pass in the middle. The annealing temperature is 750°C, and the reduction of each pass is controlled at about 30%, and finally rolled into a plate with a thickness of 0.15mm.

Embodiment 3

[0025] Embodiment 3: Cu-2.8Be plate manufacture

[0026] (1) Mix a certain proportion of copper powder and beryllium-copper master alloy, and carry out mechanical alloying in an omnidirectional planetary ball mill with a ball-to-material ratio of 15:1, the medium is alcohol, and the ball milling time is 15 hours.

[0027] (2) Plasticizing and extruding the mixed powder, the binder is paraffin-edible oil-polyethylene glycol, wherein the volume fraction of paraffin wax is 60%, the volume fraction of edible oil is 20%, polyethylene glycol The volume fraction of diol is 20%. After degreasing, it is sintered at 880°C under the atmosphere of hydrogen and oxygen, and the sintering time is 5h, and the ingot with a thickness of 3mm is made, and its composition is Be: 2.8%, Ni: 0.21wt.%, Fe: 0.058wt .%, Al: 0.013wt.%, Si: 0.028wt.%, Pb: 0.0020wt.%, Cd: 0.0020wt.%, Zn: 0.0020wt.%, the sum of other impurity elements is 0.43wt.%, the rest For Cu.

[0028] (3) Plasticized extrusion is ...

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Abstract

The invention provides a method for processing beryllium copper plate strips for secondary electronic emission. The composition proportion of the sheet material comprises: by weight, 2.7-3.0 % of beryllium, 0.31% or less than 0.31% of nickel, 0.058% or less than 0.058% of ferrum, 0.013% or less than 0.013% of aluminum, 0.028 % or less than 0.028 % of silicon, 0.0020 % or less than 0.0020 % of plumbum, 0.0020 % or less than 0.0020 % of cadmium, 0.0020 % or less than 0.0020 % of zinc, and 0.43 % or less than 0.43 % of the sum of other impurity elements, and the balance copper. The particular rolling technology includes the steps: using methods of plasticization and extrusion to manufacture blanks; heating the blanks and preserving heat; matching with the middle annealing technology and acid-washing, conducting multi-pass rolling on a rolling machine; and after rolling is conducted, conducting corresponding heat treatment to obtain the sheet materials with corresponding standards. A secondary electronic emission peak value of beryllium copper plate and strip emitting can reach more than 10 which is far more than a level of a peak value which is 6.

Description

technical field [0001] The invention proposes a method for processing a beryllium-copper alloy strip for secondary electron emission, which belongs to the field of material processing method protection. technical background [0002] Beryllium bronze alloy is a wrought and castable alloy, which belongs to the copper-based alloy strengthened by aging precipitation. After quenching and aging treatment, it has high strength, hardness, elastic limit, and good stability. It has corrosion resistance, wear resistance, and It has a series of advantages such as fatigue, low temperature resistance, non-magnetic, good electrical and thermal conductivity, and no sparks when impacted. It is known as the "king of colored elastic materials". Beryllium bronze alloy has good secondary electron emission performance and is widely used in various fields such as electronic appliances, communication instruments, aerospace, petrochemical, metallurgical mines, automobile household appliances, machin...

Claims

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Application Information

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IPC IPC(8): B22F3/20C22F1/08C22C9/00
Inventor 刘楚明朱戴博韩坦陈志永万迎春肖宏超
Owner CENT SOUTH UNIV
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