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Preparation method of high-adhesion adhesive-free flexible copper-clad plates

A flexible copper clad laminate and glue type technology is applied in the field of preparation of high-adhesion non-adhesive flexible copper clad laminates, and can solve the problems that ultra-thin flexible copper clad laminates cannot be obtained, large-scale continuous production is difficult, and production costs are high. , to achieve the effects of good solubility and film formation, low production cost and low post-processing temperature

Inactive Publication Date: 2013-05-15
HUNAN UNIV OF ARTS & SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its disadvantages are: due to the many processes, it is difficult to carry out large-scale continuous production, and the production cost is high, and ultra-thin flexible copper clad laminates cannot be obtained (Xinshi Gu et al., Printed Circuit Information, 2004, 4: 29-33)
However, common polyimide resins are difficult to dissolve in conventional solvents, and soluble polyimide resins used as base film materials for adhesive-free flexible copper-clad laminates must also meet specific performance requirements, such as excellent heat resistance properties, high mechanical properties, high adhesion and good dimensional stability and low water absorption

Method used

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  • Preparation method of high-adhesion adhesive-free flexible copper-clad plates
  • Preparation method of high-adhesion adhesive-free flexible copper-clad plates
  • Preparation method of high-adhesion adhesive-free flexible copper-clad plates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] with N 2 In a 500 mL four-neck flask with a vent tube, a thermometer and a mechanical stirrer, under N 2 In the atmosphere, first add 5.6066 g (0.025 mol) of BIA and 7.4050 g (0.025 mol) of DMBB, and then add 250 g of NMP. After the diamine is completely dissolved, add 14.7112 g (0.05 mol) of BPDA. at 0 o C for 6 hours to generate the corresponding polyamic acid. Then add an appropriate amount of xylene to keep the reflux temperature at 150 o C. After continuing to heat for 24 hours, the xylene was completely distilled off, and the heating was stopped. After cooling down naturally, the reaction solution was poured into high-speed stirring methanol to obtain a precipitate. The obtained precipitate was thoroughly washed successively with methanol and anhydrous ether, filtered, dried naturally, and then dried in vacuum at 120°C for 24 hours to obtain polyimide powder. Using NMP as the mobile phase, the number average molecular weight (Mn) was 121325 and the weight aver...

Embodiment 2

[0033] with N 2 In a 500 mL four-neck flask with a vent tube, a thermometer and a mechanical stirrer, under N 2 In the atmosphere, first add 6.7279 g (0.030 mol) of BIA and 7.0040 g (0.0020 mol) of DFBB, and then add 250 g of NMP. After the diamine is completely dissolved, add 15.5320 g (0.05 mol) of ODPA. at 15 o C for 8 hours to generate the corresponding polyamic acid. Add an appropriate amount of chlorobenzene to keep the reflux temperature at 180 o C. After continuing to heat for 18 hours, the chlorobenzene was completely distilled off, and the heating was stopped. After cooling down naturally, the reaction liquid was poured into high-speed stirring methanol to obtain a precipitate. The obtained precipitate was thoroughly washed successively with methanol and anhydrous ether, filtered, dried naturally, and then dried in vacuum at 120°C for 24 hours to obtain polyimide powder. Using NMP as the mobile phase, the number average molecular weight (Mn) was 78325 and the wei...

Embodiment 3

[0036] with N 2 In a 500 mL four-neck flask with a vent tube, a thermometer and a mechanical stirrer, under N 2 In the atmosphere, first add 7.8493 g (0.0350 mol) of BIA and 5.3741 g (0.0150 mol) of DPBB, and then add 250 g of NMP. After the diamine is completely dissolved, add 16.1325 g (0.0500 mol) of BTDA. at 40 o C for 10 hours to generate the corresponding polyamic acid. Then add an appropriate amount of xylene to keep the reflux temperature at 160 o C. After continuing to heat for 48 hours, completely distill out the xylene, stop heating, wait for it to cool naturally, pour the reaction solution into high-speed stirring methanol, and obtain a precipitate. The obtained precipitate was thoroughly washed successively with methanol and anhydrous ether, filtered, dried naturally, and then dried in vacuum at 120°C for 24 hours to obtain polyimide powder. Using NMP as the mobile phase, the number average molecular weight (Mn) was 58354 and the weight average molecular weigh...

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Abstract

The invention discloses a preparation method of high-adhesion adhesive-free flexible copper-clad plates, and the preparation method comprises the following steps: firstly, dissolving a mixture of a benzimidazole structure containing aromatic diamine monomer (I) and a benzoxazine and benzoxazole structure containing aromatic diamine monomer (II) into N-methyl-2-pyrrolidone (NMP), and then adding an aromatic diamine monomer (III) into the obtained mixture so as to obtain an intermediate polyamide acid; then, adding water-carrying agents dimethyl benzene and chlorobenzene into the intermediate polyamide acid so as to obtain a polyimide solution; and removing the water-carrying agents through steaming, and pouring reaction liquid into methanol so as to obtain a precipitate; and completely washing, filtering and drying the precipitate through the methanol and anhydrous diethyl ether so as to obtain polyimide powder, preparing the polyimide powder into a solution, coating the obtained solution on a copper foil, and in a high-temperature drying tunnel, in the presence of nitrogen, removing solvents so as to obtain a high-adhesion adhesive-free flexible copper-clad plate. A product prepared by using the method disclosed by the invention has the characteristics of high peel strength and no crimping, and a resin layer cladded on a copper foil is excellent in mechanical properties and heat resistance and low in water absorption.

Description

technical field [0001] The invention directly adopts highly soluble polyimide powder preparation solution to coat and prepare high-adhesive non-adhesive flexible copper-clad laminates, and specifically relates to the preparation of a highly soluble polyimide resin and the preparation of high-adhesive coatings by using it The method of adhesive-free flexible copper clad laminates. Background technique [0002] As a special basic material for electronic interconnection, flexible printed circuit (FPC) has the distinctive characteristics of thinness, lightness and flexible structure. In addition to static bending, it can also be used for dynamic bending, curling and folding, etc. . In recent years, with the rapid development of the electronic industry, electronic products are further developed towards the direction of miniaturization, light weight and high density assembly. This development trend directly promotes the extensive use of flexible printed circuits in almost all hi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/06B32B15/08C08G73/10
Inventor 庄永兵周诗彪肖安国
Owner HUNAN UNIV OF ARTS & SCI
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