Method for manufacturing super-hydrophobic silicon substrate

A technology of superhydrophobicity and manufacturing method, which is applied in the direction of manufacturing microstructure devices, coatings, microstructure devices, etc., can solve problems such as theoretical analysis of unfavorable substrate surface wettability, and achieve low cost, simple process, and anti-corrosion The effect of the adhesion function

Active Publication Date: 2013-06-26
PEKING UNIV
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  • Abstract
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AI Technical Summary

Problems solved by technology

Although this can improve the roughness of the substrate surface, it is not conducive to the theoretical analysis of the wettability of the substrate surface.

Method used

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  • Method for manufacturing super-hydrophobic silicon substrate
  • Method for manufacturing super-hydrophobic silicon substrate
  • Method for manufacturing super-hydrophobic silicon substrate

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Embodiment Construction

[0021] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0022] A kind of superhydrophobic silicon substrate manufacturing method of the present invention, comprises the following steps:

[0023] 1) if figure 1 As shown, a 4-inch n-type silicon substrate 1 with a 100 crystal orientation is subjected to photolithography and etching on the silicon substrate 1 through a traditional microelectronics process, and an array of micron-level silicon pillars 2 is processed; the size of the silicon pillars 2 Consider the size of the polystyrene nanoparticles 3 fixed on the silicon pillar 2 when imitating the nano-protrusions on the surface of the real lotus leaf. When the diameter of the polystyrene nanoparticles 3 is 700nm, the reference diameter of the silicon pillar 2 is designed to be 20 μm. The height of the etched silicon pillar 2 is 20 μm, so that the polystyrene nanoparticles 3 with a diameter of 700 nm can b...

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Abstract

The invention relates to a method for manufacturing a super-hydrophobic silicon substrate. The method comprises the following steps of: photoetching and etching the silicon substrate through a traditional microelectronic process, thus processing a silicon column array in a micro scale; etching the silicon substrate by an oxygen plasma etching method; diluting and proportioning a nano-particle solution by deionized water, thus obtaining nano-particle suspension; soaking a silicon substrate structure subjected to hydrophilization treatment in the nano-particle suspension, and naturally evaporating the nano-particle suspension at room temperature in an evaporation table, or adding nitrogen to the nano-particle suspension for accelerating evaporation; etching nano-particles which are densely arranged on the surface of the structure by the oxygen plasma etching method within controlled reaction time, thus obtaining nano-particles of proper sizes; and settling intrinsically weak hydrophobic poly-p-xylylene by a chemical vapor deposition method, so that the poly-p-xylylene completely settles on the surface of the silicon substrate, and the final super-hydrophobic substrate is obtained. The micro-nano double-layer hierarchical composite structure is prepared by the micro-nano processing technique, the method is simple in process and high in periodicity, and the raw materials are easily available.

Description

technical field [0001] The invention relates to a method for manufacturing a superhydrophobic silicon substrate, in particular to a method for manufacturing a superhydrophobic silicon substrate that utilizes the self-assembly phenomenon induced by evaporation of nanoparticles to prepare a micro-nano composite hierarchical structure. Background technique [0002] Superhydrophobicity is one of the most concerned wetting phenomena. Wetting means that the liquid can spread on the solid surface, and the contact surface has a tendency to expand. The distribution of liquid on solid will form three-phase intersection of solid, liquid and gas. At the junction, the angle between the solid-liquid interface and the liquid interior to the gas-liquid interface is called the contact angle. After the solid substrate is tilted at a certain angle, the liquid may start to roll or slide on the solid surface, and the minimum inclination angle that can make the liquid roll or slide is the rolli...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00
Inventor 吴文刚王诣斐杨增飞钱闯
Owner PEKING UNIV
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