Adsorption carrier for evaporation material for evaporation of anti-fouling film

A technology of adsorption carrier and evaporation material, applied in vacuum evaporation coating, metal material coating process, sputtering coating and other directions, can solve the problems of broken steel wool, anti-fouling film spots, limiting the absorption of organic substances, etc. To achieve the effect of improving friction resistance and ensuring uniformity

Active Publication Date: 2013-07-17

OPTORUN SHANGHAI CO LTD

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AI-Extracted Technical Summary

Problems solved by technology

The porous ceramic sintered body contains many impurities, and these impurities are the main reason for the deterioration of the characteristics of the evaporation material, so it is unfavorable to the friction resistance and uniformity of the antifouling film; the steel wool is p...

Method used

[0028] The thermal conductivity of the adsorption carrier determines the rate at which the adsorption carrier heats up and the rate at which heat diffuses in the adsorption carrier, thus directly affecting the evaporation rate of the evaporation material. The smaller the thermal conductivity of the adsorption carrier, the slower the evaporation material is heated, and the slower the evaporation rate; on the contrary, the larger the thermal conductivity, the faster the evaporation material is heated, and the faster the evaporation rate. During the coating process, as shown in Figure 3, the coating substrate is fixed on the bracket above the vacuum chamber. In order to increase the uniformity of the coating, the bracket rotates at a constant speed or at a certain speed under the action of the driving mechanism. The rotation speed of the bracket is set depending on the model of the coating device, the type and size of the substrate, and the like. The evaporation speed of the evaporation material needs to match the rotation speed of the support. If the evaporation speed is too fast or too slow, the uniformity of the coating film and the performance of the antifouling film will be affected. The adsorption carrier provided by the present invention can select raw materials with appropriate thermal conductivity according to the requirements of the coating equipment, and control the evaporation rate of the evaporation material through the thermal conductivity of the adsorption carrier to match the rotation speed of the substrate support. Because the evaporation rate of the evaporation material adsorbed and carried in the adsorption carrier can be controlled, the uniformity and friction resistance of the formed antifouling film can be improved. T...

Abstract

The invention provides an adsorption carrier for an evaporation material for evaporation of an anti-fouling film. The adsorption carrier is a sintered body of metal powder, and the metal powder is one or a metal mixture of at least two selected from iron, stainless steel, copper and aluminum. The adsorption carrier provided by the invention has the advantages that the adsorption carrier does not contain impurities and can ensure that the impurities can not be produced by melting during the film plating process under high-vacuum and high-temperature conditions, and the adsorption carrier can not perform chemical reaction with the evaporation material which is adsorbed and carried by the adsorption carrier; a sintering raw material with appropriate heat conductivity can be selected according to the demands of film plating equipment, so that the uniformity of film plating is ensured; and the anti-fouling film which is obtained by using the adsorption carrier provided by the invention to perform vacuum evaporation can greatly improve the wear resistance and is better than the anti-fouling film which is obtained by evaporation by using the adsorption carrier in the prior art.

Application Domain

Vacuum evaporation coatingSputtering coating +1

Technology Topic

ChemistryAluminium +10

Image

Examples

Experimental program(5)

Example Embodiment

[0038] Example 1

[0039] In this embodiment, a sintered body formed from a single metal iron is selected. The melting point of metallic iron is 1535℃, and the sintering temperature is 1000℃—1500℃. Will not react with evaporation materials. And has good ductility and thermal conductivity, low price, suitable for batch industrial production.

[0040] Table 2

[0041]

[0042] Table 2 is the friction test result table of the antifouling film evaporated by the adsorption carrier of this embodiment. The water droplet contact angle of the antifouling film after 0-27000 rubs is recorded. It can be seen that when the adsorption carrier of this embodiment is used, the antifouling After the film is rubbed for 17000 times, the water droplet contact angle of the antifouling film still meets the requirements, and the number of frictions far exceeds the number of frictions of the antifouling film evaporated by the adsorption carrier in the prior art.

Example Embodiment

[0043] Example 2

[0044] In this embodiment, a sintered body formed from a single metal material stainless steel is selected. Stainless steel is an alloy with iron and chromium as the main elements. It is also divided into different types of stainless steels because it contains nickel, carbon, molybdenum, titanium, columbium, and selenium. Generally speaking, stainless steel has a high melting point, a sintering temperature of 1000°C to 1350°C, high strength, and a wide range of uses.

[0045] table 3

[0046]

[0047] Table 3 is the friction test result table of the antifouling film evaporated by the adsorption carrier of this embodiment. The water droplet contact angle of the antifouling film after rubbing 0-34000 times is recorded. It can be seen that when the adsorption carrier of this embodiment is used, the antifouling After the film is rubbed 29,000 times, the water droplet contact angle of the antifouling film still meets the requirements, and the number of frictions far exceeds the number of frictions of the antifouling film evaporated by the adsorption carrier in the prior art.

Example Embodiment

[0048] Example 3

[0049] In this embodiment, a sintered body formed from a single metal copper is selected. The melting point of metallic copper is about 1083°C, which is lower than that of iron and stainless steel. For the sintered body obtained from copper as a raw material, the sintering temperature is relatively low, ranging from 500°C to 1050°C, so the sintering process is relatively simple.

[0050] Table 4

[0051]

[0052] Table 4 is the friction test result table of the antifouling film evaporated by the adsorption carrier of this embodiment. The water droplet contact angle of the antifouling film after 0-37000 rubs is recorded. It can be seen that when the adsorption carrier of this embodiment is used, the antifouling After the film is rubbed to 26000 times, the water droplet contact angle of the anti-fouling film still meets the requirements, and with the subsequent increase in the number of frictions, the change of the water droplet contact angle is very small, and the number of frictions far exceeds that of the prior art adsorption carrier The number of rubbing of the deposited antifouling film.

PUM

Property	Measurement	Unit
Melting point	1535.0	°C
Melting point	1083.0	°C
Melting point	660.0	°C

Description & Claims & Application Information

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