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Three-dimensional boron nitride foam and preparation method thereof

A boron nitride, hexagonal boron nitride technology, applied in chemical instruments and methods, nitrogen compounds, inorganic chemistry, etc., to achieve the effect of excellent performance

Active Publication Date: 2013-08-07
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Technical problem to be solved: Aiming at the shortcoming that the existing boron nitride nano-film can only meet its basic requirements as a base or insulating layer, the present invention provides a three-dimensional Boron nitride foam and its preparation method

Method used

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  • Three-dimensional boron nitride foam and preparation method thereof
  • Three-dimensional boron nitride foam and preparation method thereof
  • Three-dimensional boron nitride foam and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] First, weigh 0.5g of borane ammonium complex and place it in a non-working oven, place nickel foam with a size of 20mm×100mm×1.6mm in the central area of ​​the tube furnace, turn on the vacuum pump, and pass the flow through the flowmeter The hydrogen gas is 10 mL / min, heated to 1000°C at a rate of 10°C / min and kept for 30 minutes, then the oven is heated to 100°C to preheat the reaction source, and the boron nitride film is grown for 60 minutes. After the end, the tube furnace was turned on, and the temperature was rapidly cooled to room temperature at a speed of 100°C / min.

[0024] Then, the anisole solution of polymethyl methacrylate (4wt%) was added dropwise to the surface of foamed nickel with a boron nitride film, dried and placed in a 3mol / L hydrochloric acid solution, and placed at 80°C 10h to dissolve nickel foam. After washing with deionized water, the sample was placed in air at 700°C and heated for 30 min to remove polymethyl methacrylate on the surface of ...

Embodiment 2

[0028] First, weigh 0.5g of borane ammonium complex and place it in a non-working oven, place nickel foam with a size of 50mm×5mm×1.6mm in the central area of ​​the tube furnace, turn on the vacuum pump, and pass the flow through the flow meter The hydrogen gas is 10 mL / min, and the hydrogen gas is heated to 1200°C at a rate of 10°C / min and kept for 30 minutes, then the oven is heated to 120°C to preheat the reaction source, and then the boron nitride film is grown for 60 minutes. After the end, the tube furnace was turned on and cooled slowly to room temperature at a rate of 10°C / min.

[0029] Then, the ethyl lactate solution of polypropylene (2wt%) was added dropwise to the surface of nickel foam with a boron nitride film, dried and placed in a 5mol / L ferric chloride solution, and placed at 90°C for 5h Dissolves nickel foam. After washing with deionized water, the samples were heated in air at 800°C for 10 min to remove the polypropylene on the boron nitride surface.

[00...

Embodiment 3

[0032] First, weigh 0.5g of borane ammonium complex and place it in a non-working oven, place nickel foam with a size of 20mm×100mm×1.6mm in the central area of ​​the tube furnace, turn on the vacuum pump, and pass the flow through the flowmeter It is a mixed gas of hydrogen and argon at 50 mL / min, where the volume ratio of hydrogen is 20%, and the hydrogen is heated to 800°C at a speed of 10°C / min and kept for 30 minutes, and then the temperature of the oven is raised to 80°C to preheat the reaction source. After heating, the boron nitride thin film starts to grow, and the growth time is 120min. After the end, the tube furnace was turned on and cooled slowly to room temperature at a rate of 10°C / min.

[0033] Then, the anisole solution of polystyrene (4wt%) was added dropwise to the surface of nickel foam with a boron nitride film, dried and placed in 1mol / L nitric acid solution, and placed at 60°C for 20h to dissolve the foam nickel. After washing with deionized water, the...

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Abstract

The invention relates to three-dimensional boron nitride foam and a preparation method of the three-dimensional boron nitride foam. The preparation method comprises the following steps of: heating a borane ammonia complex serving as a solid-state source in an independent container to reach a specific temperature in order to decompose the solid-state source into a gas-state source through the chemical vapor deposition process; dispersing to the surface of a metal bubble template; cracking and depositing to form a three-dimensional boron nitride film network structure; cooling the three-dimensional boron nitride film network structure; continuously dispensing a high-molecular polymer layer; removing the metal template through a corrosive liquid; and removing the high-molecular polymer layer at a high temperature, thus obtaining three-dimensional boron nitride foam. The method is simple and convenient in operation, low in requirement on equipment and high in yield; the prepared boron nitride foam is in form of a net shaped structure in which hollow hexagonal boron nitride thin-wall tubes are interconnected; and the prepared boron nitride foam has outstanding characteristics of low density, high thermal stability, elastic recovery after compressing, low Young modulus and the like, therefore, the foundation is provided for the boron nitride foam to be applied in the fields of high-temperature environment, catalyst carriers, mechanics sensing, insulation and the like.

Description

technical field [0001] The invention relates to the technical field of inorganic synthesis, in particular to an ultra-light three-dimensional boron nitride foam material and its chemical vapor deposition preparation technology. Background technique [0002] Ultra-light hollow materials are widely used in many aspects such as heat insulation, sound absorption, shock resistance, energy absorption and catalyst carrier. At present, there are only a few hollow materials with a density lower than 10mg / cm 3 , including silica aerogels, carbon nanotube-based hollow materials, three-dimensional graphene foams, and metal array frameworks. However, these materials will collapse, decompose or oxidize in an environment with a temperature higher than 600 ° C, which limits the application of such materials in extreme environments. [0003] Hexagonal boron nitride is a wide bandgap insulator with a direct bandgap of 5.97eV, and has excellent mechanical and optical properties. The most im...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B21/064
Inventor 郭万林殷俊李雪梅
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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