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Carbon glue embedded resistance paste and preparation method of carbon glue embedded resistance material

A technology of buried resistance and carbon glue is applied in the field of preparation of graphite/epoxy resin type resistance paste compound, which can solve the problems affecting the performance of embedded resistance circuit boards, poor stability of resistance value of carbon glue resistance, etc. The effect of good thermal and storage stability, excellent mechanical properties, and excellent thermal properties

Inactive Publication Date: 2015-09-09
GUANGDONG DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, one of the most critical issues related to carbon screen printing resistance inks that are not covered by the above patent technologies is: the resistance drift (increase in resistance value) caused by the interface corrosion between copper and carbon powder, making the carbon screen resistance in high temperature and high humidity The resistance stability in the environment is very poor, generally greater than 20%, which seriously affects the performance of the embedded resistor circuit board in some harsh environments
Obviously, the latter method is easier to operate in terms of technology. However, in the face of thousands of stabilizers of all kinds, finding a suitable stabilization accelerator can effectively prevent the occurrence of resistance drift. easy thing

Method used

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  • Carbon glue embedded resistance paste and preparation method of carbon glue embedded resistance material
  • Carbon glue embedded resistance paste and preparation method of carbon glue embedded resistance material
  • Carbon glue embedded resistance paste and preparation method of carbon glue embedded resistance material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The formula is as follows:

[0033]

[0034]

[0035] According to the above formula, the preparation and curing of carbon rubber resistor paste are completed according to the following process:

[0036] (1). Add 15g of graphite / 10g of carbon black mixture into the 5% butyl titanate (5g) solution prepared in alcohol, stir well until the solvent evaporates; at the same time, weigh 100g of o-methyl novolac epoxy resin (ECN ), 33g of ethylene glycol diglycidyl ether and 25g of carboxyl-terminated liquid nitrile rubber were soaked in a constant temperature water bath at 80°C for 1h; (2). The graphite / carbon black conductive powder treated with the coupling agent was placed in a vacuum oven Dry at 110°C for 1 hour; at the same time, quickly stir the resin solution with electric agitator for 1 hour; (3). Add the dried graphite / carbon black conductive powder to the rapidly stirred resin solution several times, and at the same time, add a small amount of other additives ...

Embodiment 2

[0046] The difference between this example and Example 1 is only that: the addition of graphite / carbon black is changed to 3 parts / 2 parts, and other components are unchanged. The performance of the cured resistance sample strip obtained by testing is as follows:

[0047] Resistivity: 650Ω.cm;

[0048] Square resistance accuracy error: ≤10%;

[0049] Moisture and heat resistance: after 85%RH / 85℃ / 500 hours, the change of resistance value is less than 10%;

[0050] Solder resistance: 260℃ / 5s / 3 times, resistance change is less than 10%;

[0051] Temperature coefficient of resistance (TCR): TCR≤200ppm / ℃;

[0052] Slurry storage period (at room temperature): ≥12 months;

[0053] Bending strength: 76.53MPa;

[0054] Bending strain: 1.83%.

Embodiment 3

[0056] The difference between this example and Example 1 is only that: the addition of graphite / carbon black is changed to 0.9 part / 0.6 part, and other components are unchanged, and the performance of the obtained cured object resistance sample strip is as follows:

[0057] Resistivity: 1900Ω.cm;

[0058] Square resistance accuracy error: ≤10%;

[0059] Moisture and heat resistance: after 85%RH / 85℃ / 500 hours, the change of resistance value is less than 10%;

[0060] Solder resistance: 260℃ / 5s / 3 times, resistance change is less than 10%;

[0061] Temperature coefficient of resistance (TCR): TCR≤200ppm / ℃;

[0062] Slurry storage period (at room temperature): ≥12 months;

[0063] Bending strength: 70.42MPa;

[0064] Bending strain: 1.68%.

[0065] From the above three examples, it can be seen that according to the above formulations, the resistance of the cured carbon glue with accurate resistance, stability and excellent mechanical properties can be obtained. The resistance...

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Abstract

Disclosed are a carbon glue embedded resistance paste and a preparation method for a carbon glue embedded resistance material. The carbon glue embedded resistor paste comprises: a bonding resin, a conductive filler, a curing agent, accelerant, a coupling agent and stable accelerant, wherein the bonding resin is an O-Methyl phenolic epoxy resin; the conducting filler is a mixture of graphite and carbon black; and the stable accelerant is a mixture consisting of benzotriazole (BTA) and methylbenzotriazole (TTA). The method is a preparation method for the above-mentioned paste. Compared with the prior art, the carbon glue resistance material obtained according to the above-mentioned formula has the advantages of a wide range of resistance values, high accuracy, good environment stability, heat resistance and storage stability, and excellent mechanical performance, thereby meeting the requirements of material characteristics of embedding resistors in circuit boards well.

Description

technical field [0001] The invention relates to the preparation of a graphite / epoxy resin type resistance slurry compound, in particular to a preparation method of a carbon glue embedded resistance slurry and a carbon glue embedded resistance material. Background technique [0002] Among the components mounted on the PCB, resistor components have the most solder joints, accounting for more than half of the mounted components. Especially in mobile phones, most of the mounted components other than resistor components are tending to be denser. One of the solutions for high-density parts installation is the resistor element. Embedding the resistor inside the PCB can save a lot of surface area and space on the PCB, and can also avoid unnecessary parasitic inductance and Parasitic capacitance can make signal transmission more complete. At present, there are several methods for embedding resistors inside PCBs: etching Ni-P resistive layer method, screen printing resistive ink meth...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/00H01C17/00
CPCH01C17/0652H01C17/0658
Inventor 刘萍张双庆
Owner GUANGDONG DANBOND TECH
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