Low temperature glass phosphor and preparation method thereof

Abstract

The invention provides a low temperature glass phosphor, comprising a low temperature glass material and a fluorescent powder, wherein the low temperature glass material is composed of silica (SiO2), alumina (Al2O3) and sodium oxide (Na2O) of a soda glass system, or is composed of phosphoric pentoxide (P2O5), tin oxide (SnO) and barium oxide (BaO) of a phosphatic glass system. The invention further provides a method for preparing the low temperature glass phosphor, comprising: a penetrated low temperature sintering step, a water quenching forming step, a grinding step, a mixing pre-burning step, a mixing grinding step and a hot pressing forming step. The low temperature glass phosphor can reduces glass conversion temperature, glass softening temperature and glass initial crystallization temperature, and can form optical glass according with a grade requirement for a white light LED module.

Description

technical field [0001] The invention relates to an LED packaging material, in particular to a low-temperature glass phosphor applied to a white LED module and formed by sintering at a low temperature and a preparation method thereof. Background technique [0002] In recent years, white light-emitting diodes (WLEDs) have gradually replaced traditional bulb light sources due to their many advantages such as long service life, small size, and good luminous efficiency. [0003] At present, one of the main methods of high-power white LED packaging process is to use a blue light chip with polymer fluorescent glue coated on the blue light chip, so that the blue light passes through the polymer fluorescent glue to form a white light source; among them, the polymer fluorescent glue Contains yttrium aluminum garnet (Yttrium Aluminum Garnet, YAG) phosphor and silica gel; however, due to the increasing popularity of light-emitting diodes in white light lighting, the required brightness ...

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Problems solved by technology

[0003] At present, one of the main methods of high-power white LED packaging process is to use a blue light chip with polymer fluorescent glue coated on the blue light chip, so that the blue light passes through the polymer fluorescent glue to form a white light source; among them, the polymer fluorescent glue Contains yttrium aluminum garnet (Yttrium Aluminum Garnet, YAG) phosphor and silica gel; however, due to the increasing popularity of light-emitting diodes in white light lighting, the required brightness and power also increase, and the power consumption of blue light chips is proportional to heat energy Therefore, when the Blu-ray chip is used in a high-brightness occasion and requires extremely high power, the heat generated on the surface of the Blu-ray chip will cause the rapid aging of the silica gel, which will lead to aggravated lumen loss of the light source, serious chromaticity drift and quality poor stability

[0004] Since glass has good light penetration and has the ability to mix evenly with fluorescent powder, some inventors proposed to replace silica gel with fluorescent powder and mix and sinter with glass materials with better heat resistance to form a glass material with both glass characteristics and phosphor powder. Glass phosphors with fluorescent properties can greatly improve the thermal effect caused by the inherent limitations of polymer materials, and obtain LED packaging materials that are not easily affected by the heat energy emitted by LED chips and cause aging phenomena; however, the processing temperature of glass materials is generally at 1000 ° C The above, in addition to increasing the difficulty in the manufacturing process, will also cause the lattice structure of the phosphor to lose its fluorescence ability due to high temperature damage;

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