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Photosensitive resin composition, cured product thereof, and printed circuit board

A photosensitive resin and composition technology, applied in printed circuit parts, epoxy coatings, optics, etc., can solve problems such as through-hole floating, coating film overflow, shortening working time, etc.

Active Publication Date: 2016-01-13
TAIYO INK SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, for example, when using the above-mentioned conventional liquid solder resist composition in such a manner that it is directly filled on a circuit board having a through-hole, there is a problem that the formed solder resist film is likely to cause the following phenomenon: the solder is leveled. Floating around the hole (hereinafter referred to as "cavitation"); or overflow of the coating film filled in the through hole during post-curing and solder leveling (hereinafter referred to as "burst hole")
[0006] However, the above-mentioned process method using a thermosetting composition cannot shorten the working time, and the efficiency is poor. In addition, the method of not filling the large-diameter holes only exists when flux and solder are soldered. possible on the surface, which may cause a decrease in the reliability of the printed circuit board

Method used

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  • Photosensitive resin composition, cured product thereof, and printed circuit board
  • Photosensitive resin composition, cured product thereof, and printed circuit board

Examples

Experimental program
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Effect test

Synthetic example 1

[0094] 86 parts of 1,4-cyclohexanedicarboxylic acid and 378 parts of Bisphenol A epoxy resin (Mitsubishi Chemical Corporation make, EPIKOTE828, epoxy equivalent: 189 g / equivalent) was dissolved at 110°C with stirring in a nitrogen atmosphere. Thereafter, 0.3 parts of triphenylphosphine was added, the temperature in the reaction container was raised to 150° C., and the reaction was carried out for about 90 minutes while maintaining the temperature at 150° C. to obtain an epoxy compound having an epoxy equivalent of 464 g / equivalent. Next, cool the temperature in the flask to 40°C, add 390 parts of carbitol acetate, heat to dissolve, add 0.46 parts of methylhydroquinone and 1.38 parts of triphenylphosphine, heat to 95-105°C, slowly drop 72 parts of acrylic acid, reacted for 16 hours. The reaction product was cooled to 80-90° C., 190 parts of tetrahydrophthalic anhydride was added, and reacted for 8 hours. The carboxyl group-containing photosensitive resin thus obtained had a n...

Synthetic example 2

[0096] 214 parts of EPICLONN-695 of cresol novolak type epoxy resin (manufactured by Dainippon Ink Chemical Industry Co., Ltd., epoxy equivalent=214) are put into a four-necked flask with a stirrer and a reflux condenser, and 103 parts of carbites are added. Alcohol acetate and 103 parts of petroleum-based hydrocarbon solvents (trade name: Cactus Fine SF-01 manufactured by Japan Energy Corporation) were heated and dissolved. Next, 0.1 part of hydroquinone as a polymerization inhibitor and 2.0 parts of triphenylphosphine as a reaction catalyst were added. The mixture was heated to 95-105°C, 72 parts of acrylic acid was slowly added dropwise, and reacted for 16 hours. Cool the obtained reaction product to 80-90°C, add 91.2 parts of tetrahydrophthalic anhydride, react for 8 hours, take it out after cooling. The carboxyl group-containing photopolymerizable unsaturated compound thus obtained had a nonvolatile content of 65%, and an acid value of solid matter of 87.5 mgKOH / g. Here...

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Abstract

The present invention provides a photosensitive resin composition excellent in heat resistance, blast hole resistance, cavitation resistance, and crack resistance, a cured product thereof, and a printed circuit board. The photosensitive resin composition of the present invention is characterized by containing (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a diluting solvent, and (D) having two or more ethylenically unsaturated groups in one molecule. and (E) a thermosetting component having two or more cyclic ether groups and / or cyclic thioether groups in one molecule, as carboxyl group-containing resin (A), including carboxyl group-containing resin (A-1) , the carboxyl-containing resin (A-1) is the esterification product of the epoxy group generated by the esterification reaction of at least one bisphenol-type epoxy compound (a) and the unsaturated carboxylic acid (b) with saturated or The unsaturated polybasic acid anhydride (c) is obtained by reacting, and the average epoxy equivalent of the thermosetting component (E) is 200 or more.

Description

technical field [0001] The present invention relates to an alkali-developing type photosensitive resin composition suitable for forming a solder resist film of a printed circuit board and its cured product, and particularly relates to a photosensitive resin composition capable of forming an image by ultraviolet exposure and development with a dilute alkaline aqueous solution, especially An alkali-developing type photosensitive resin composition and its cured product, which are excellent in heat resistance, anti-hole property, anti-cavitation property and crack resistance, and can obtain a cured coating film, and printed circuit boards. Background technique [0002] At present, some printed circuit boards for civilian use and most of the solder resists for industrial printed circuit boards are made of high-precision and high-density solder resists, which are formed by developing images after exposure to ultraviolet rays, and finally cured by heat and light irradiation ( Mainl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/027C08L63/02H05K1/02
CPCG03F7/032G03F7/0388Y10T428/31529G03F7/027B32B37/14C09D133/10C09D163/04B32B2255/26B32B2255/06B05D2202/00C09D163/00
Inventor 加藤贤治
Owner TAIYO INK SUZHOU
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