High-efficiency grinding material for semiconductor material chips

Abstract

The invention discloses a high-efficiency grinding material for semiconductor material chips, which comprises the following components in parts by weight: 1-9 parts of wax solvent, 14-25 parts of pickling agent, 1-3 parts of phosphating solution, 1-3 parts of passivation solution, 1-3 parts of vitrification agent, 4-8 parts of calcium hydroxide, 7-10 parts of barium hydroxide octahydrate, 7-16 parts of sodium hydroxide, 7-10 parts of potassium sodium tartrate, 7-9 parts of hydrogen peroxide, 1-3 parts of zinc sulfate, 2-4 parts of magnesium sulfate, 3-8 parts of calcium stearate, 4-13 parts of stearic acid and 1 part of dispersant. The chemical mechanical grinding material for semiconductor chips has the advantages of lower dielectric layer wear rate and lower corrosivity, can promote the stability of grinding granules, and remains higher tungsten removal rate. Since the action intensity of mechanical fornce is relatively lowered, the problems of pit, corrosion, loss of the dielectric layer and the like are reduced.

Description

technical field [0001] The invention relates to a high-efficiency abrasive for semiconductor material chips. Background technique [0002] In the processing and manufacturing process of semiconductor chips, with the gradual popularization of the embedded (damascene) process (a process that is quite cheap and can build a denser component structure on a silicon chip), the metal wires in the chip It is also necessary to perform chemical mechanical planarization (CMP, chemical mechanical planarization) polishing. Tungsten is widely used in the process of manufacturing semiconductor chips because of its excellent filling performance of through holes and trenches, low electron migration and resistance, and excellent corrosion resistance. Such as metal contacts, through-hole wires and interlayer interconnection lines. Traditionally, tungsten can be etched by plasma, called tungsten etch back. However, tungsten etch-back is a process with high cost and great environmental polluti...

AI Technical Summary

Problems solved by technology

However, tungsten etch-back is a process with high cost and great environmental pollution.