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Resin composition, covering film, laminate, resin coated copper foil and binding sheet

A resin composition, laminate technology, applied in the direction of coatings, adhesives, layered products, etc., can solve the problems of low dielectric properties, difficult parts for FPC, low polarity, etc., to achieve high adhesion, solder resistance, etc. Excellent paste reflow properties and excellent electrical properties

Active Publication Date: 2013-12-18
ARISAWA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, since the base film with low dielectric properties has low polarity, when conventional epoxy resin adhesives or acrylic resin adhesives are used, the adhesive force is weak. FPC components such as laminates are difficult

Method used

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  • Resin composition, covering film, laminate, resin coated copper foil and binding sheet
  • Resin composition, covering film, laminate, resin coated copper foil and binding sheet
  • Resin composition, covering film, laminate, resin coated copper foil and binding sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0110] Hereinafter, the present invention will be further specifically described by way of examples and comparative examples, but the present invention is not limited to these examples.

[0111] In Examples and Comparative Examples, measurements and evaluations of various physical properties were performed by the following methods.

[0112] Hydroxyl equivalent

[0113] Measurement was performed in accordance with JIS K1557-1. Specifically, measurement was performed as follows.

[0114] 10 mL of acetic anhydride solution (prepared with 400 mL of ethyl acetate, 4 g of perchloric acid, and 50 mL of acetic anhydride) was added to 3 g of the sample, and stirred for 15 minutes. 2 mL of water and 10 mL of a pyridine aqueous solution (prepared with 300 mL of pyridine and 100 mL of water) were added, followed by stirring for 5 minutes. Then, another 10 mL of aqueous pyridine was added.

[0115] The hydroxyl equivalent was calculated by titration with an ethanol solution of 0.5 mol / ...

manufacture example 1

[0208] A 1000 mL stainless steel autoclave was filled with 340 parts by mass of butyl acetate, 132 parts by mass of vinyl pivalate, 62 parts by mass of hydroxybutyl vinyl ether, 36 parts by mass of ethyl vinyl ether, and 2 parts by mass of crotonic acid And 7 mass parts of diisopropyl peroxydicarbonates were degassed under reduced pressure after cooling to 0 degreeC. Fill the obtained mixture with 30 parts by mass of hexafluoropropylene, heat to 40° C. with stirring, and allow them to react for 24 hours. The pressure in the reactor increases from 5 kg / cm 2 down to 2kg / cm 2 The reaction was stopped at a certain time, and fluororesin A1 was obtained.

[0209] The obtained fluororesin A1 was analyzed by 19F-NMR, 1H-NMR and combustion method, and it was found that it contained 11.1% of hexafluoropropylene units, 21.9% of ethyl vinyl ether units, and 44.0% of vinyl pivalate units by moles. 1. A copolymer of 22.0% hydroxybutyl vinyl ether unit and 1.0 / % crotonic acid unit, the flu...

manufacture example 2～6

[0210] Manufacturing Examples 2-6, Comparative Examples 1-5

[0211] Fluororesins A2 to A6 and B1 to B5 were obtained in the same manner as in Example 1 except that the filling amount of the monomer was changed.

[0212] Table 1 shows the composition, fluorine content, hydroxyl equivalent, and carboxyl equivalent of the obtained fluororesin.

[0213] Table 1

[0214]

[0215] Manufacture of resin composition for FPC

[0216] In Examples and Comparative Examples, the following base films were used.

[0217] Liquid crystal polymer film (LCP) (manufactured by Kuraray, Vecster, thickness 25 μm)

[0218] Syndiotactic polystyrene (SPS) (manufactured by Idemitsu Kosan Co., Ltd., Xarec, thickness 25 μm)

[0219] Polyphenylene sulfide (PPS) (manufactured by Toray Corporation, Torayner, thickness 25 μm).

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Abstract

The present invention provides a resin composition, a covering film, a laminate, a resin coated copper foil and a binding sheet. Furthermore the invention aims to provide the resin composition for a flexible printed circuit board, which has the advantages of high adhesiveness, high solder reflow resistance and excellent electric characteristic on condition that a substrate film with low dielectric properties is used. The resin composition for the flexible printed circuit board of the invention comprises a fluororesin and an isocyanate compound, and is characterized in that: the fluororesin has a content of 1 to 50% by mass, and a hydroxyl equivalent of 300 to 5500 g / equivalent.

Description

technical field [0001] The present invention relates to a resin composition for a flexible printed wiring board, a cover film containing the composition, a laminate, a resin-coated copper foil, and an adhesive sheet. Background technique [0002] In recent years, along with the increase in the speed of the transmission signal on the printed wiring board, the increase in the frequency of the signal is also progressing. At the same time, the demand for low dielectric characteristics (low dielectric constant, low dielectric loss) in the high frequency region is increasing for printed wiring boards. In response to such a request, liquid crystal polymers (LCP), syndiotactic polystyrene, polystyrene, etc. Substrate films such as phenylene sulfide to replace the previous polyimide and polyethylene terephthalate films. [0003] However, since the base film with low dielectric properties has low polarity, when conventional epoxy resin adhesives or acrylic resin adhesives are used, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J127/12C09J11/06B32B15/08B32B15/20H05K1/02
CPCC08G18/58C08G18/6279C08G18/4063C09J175/04Y10T428/2804C09J175/14B32B7/12B32B15/092B32B2255/26
Inventor 内山明吉川和男田井诚岩野畅行
Owner ARISAWA MFG CO LTD
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