A copper-based superhydrophobic surface with low coefficient of friction and preparation method thereof
A low-friction coefficient, super-hydrophobic surface technology, applied in the direction of liquid chemical plating, coating, metal material coating technology, etc., can solve the problems of unstable and easy decomposition of hydrogen peroxide, complex electrochemical process, complex methods, etc. and medicines are cheap and easy to obtain, hydrophobic performance and tribological performance are improved, and the preparation method is simple
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Examples
Embodiment 1
[0029] (1) Take copper flakes (produced by Sinopharm Group) with a thickness of 0.15-0.25mm and a purity of 99.99% as the copper-based material, and use 1mol L -1 Nitric acid was used for deoxidation film treatment for 10s, then washed with deionized water, dried with nitrogen gas, and set aside.
[0030] (2) Soak the copper sheet treated in step (1) at 40°C in hydrochloric acid with a concentration of 2mol L -1 and ammonium persulfate concentration is 0.1mol L -1 The etching reaction was carried out for 1 h in the mixed solution, and a solid surface with a micron-scale pit structure was obtained.
[0031] (3) Soak the copper sheet treated in step (2) in 0.00031mol L at 23°C -1 silver nitrate solution for 5 hours, washed with deionized water, and dried to obtain a copper sheet with a micron-scale pit structure and a rough structure of submicron / nano-scale metallic silver particles.
[0032] (4) Through surface modification, the copper sheet with micron-scale pit structure a...
Embodiment 2
[0035] (1) Take copper with a thickness of 1.5-2mm and a purity of 99% as the substrate, and use 1mol L -1 Nitric acid was used for deoxidation film treatment for 10 seconds, cleaned, and dried with nitrogen gas for later use.
[0036] (2) Soak the copper treated in step (1) in hydrochloric acid with a concentration of 4mol L at a temperature of 10°C -1 , the concentration of potassium persulfate is 0.5mol L -1 The etching reaction was carried out in the mixed solution of 2h, and a solid surface with a micron-scale pit structure was obtained.
[0037] (3) Soak the copper sheet treated in step (2) at 10°C in a concentration of 0.0002mol L -1 in the silver nitrate solution for 4 hours, washed with deionized water, and dried to obtain copper with a micron-scale pit structure and a rough structure of submicron / nano-scale metallic silver particles.
[0038] (4) Using surface modification, the copper with micron-scale pit structure and sub-micron / nano-scale metal silver particle ...
Embodiment 3
[0041] (1) Take a copper sheet (produced by Sinopharm Group) with a thickness of 0.15-0.25mm and a purity of 99.99% as the substrate, and use 1mol L -1 Nitric acid was used for deoxidation film treatment for 10 seconds, cleaned, and dried with nitrogen gas for later use.
[0042] (2) Soak the copper sheet treated in step (1) in hydrochloric acid with a concentration of 2mol L at a temperature of 23°C -1 , the concentration of ammonium persulfate is 0.1mol L -1 4h in the mixed etching solution to obtain a solid surface with a micron-scale pit structure;
[0043] (3) Soak the copper sheet treated in step (2) in 0.00031mol L at 23°C -1 In the silver nitrate solution for 5h, wash with deionized water to obtain a copper sheet with a micron-scale pit structure and a rough structure of submicron / nano-scale metallic silver particles;
[0044] (4) Using surface modification, the copper sheet with micron-scale pit structure and sub-micron / nano-scale metal silver particle rough struct...
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Abstract
Description
Claims
Application Information
- IPC
- C23F17/00; C23F1/00; C23C18/42
- Inventors
- 陈新华; 李佩佩