Copper base material cleaning agent and preparation method thereof

Abstract

The invention provides a copper base material cleaning agent. The copper base material cleaning agent is composed of, by weight, 0.05%-2% of organic acid activators, 0.05%-1% of a nonionic surface activator, 0.01%-0.6% of an anion surface activator, 0.005%-0.2% of an antioxidant, 0.005%-0.2% of a chelating agent, and the balance deionized water. In addition, the invention discloses a preparation method of the copper base material cleaning agent. The copper base material cleaning agent is free of attenuation and controlling over the attenuation, can be directly used, does not contain heavy metal, is free of residues and can meet the processing requirements for copper before hot dipping; the surface of a copper base material processed by the cleaning agent is pure and is free of dark spots, oil contaminations, fingerprints and the like; accessories obtained after tinplating are free of exposed copper, dark spots and other defects, and the surfaces of the accessories are smooth.

Description

technical field

[0001] The invention belongs to the technical field of chemical cleaning, and in particular relates to a copper substrate cleaning agent and a preparation method thereof. Background technique

[0002] According to the different pretreatment methods for surface metal plating, the substrate pretreatment process can be divided into solvent method and protective gas reduction method. The solvent method is to use the chemical action of the solvent to protect the surface of the copper that has been degreased and derusted before immersing it in the plating solution and to further activate it to ensure that the plating solution and the surface of the clean copper substrate are infiltrated, and through chemical The reaction and diffusion form the alloy layer. The method has simple equipment, low cost, easy operation and easy learning, flexible production, and can be mass-produced, and can be adjusted at any time according to the product batch. Therefore, it is of gr...

Examples

Embodiment 1

[0025] The cleaning agent for copper substrate in this embodiment is made of the following raw materials in mass percentage: 0.05% organic acid activator, 1% nonionic surfactant, 0.6% anionic surfactant, 0.005% antioxidant, and 0.005% chelating agent , the balance is deionized water; the organic acid activator is citric acid; the nonionic surfactant is alkylphenol polyoxyethylene ether; the anionic surfactant is sodium dodecylbenzenesulfonate; The antioxidant is tolutriazole; the chelating agent is EDTA disodium salt.

[0026] The preparation method of the copper substrate cleaning agent of the present embodiment is:

[0027] Step 1, dissolving the organic acid activator in deionized water to obtain a colorless and transparent solution A;

[0028] Step 2, adding nonionic surfactant, anionic surfactant and chelating agent into deionized water, stirring evenly to obtain colorless and transparent solution B;

[0029] Step 3: Mix the solution A described in step 1 with the solut...

Embodiment 2

[0032] The copper substrate cleaning agent of the present embodiment is the same as that of Embodiment 1, wherein the difference is: the organic acid activator is glutaric acid, itaconic acid, acetic acid, o-hydroxybenzoic acid, sebacic acid, oxalic acid, apple acid or succinic acid, or at least two of citric acid, glutaric acid, itaconic acid, acetic acid, o-hydroxybenzoic acid, sebacic acid, oxalic acid, malic acid and succinic acid; the nonionic surfactant is Fatty alcohol polyoxyethylene ether, fatty acid polyoxyethylene ester, pentaerythritol fatty acid ester, sucrose fatty acid ester, sorbitan fatty acid ester or coconut oil fatty acid diethanolamide, or fatty alcohol polyoxyethylene ether, alkylphenol At least two of polyoxyethylene ether, fatty acid polyoxyethylene ester, pentaerythritol fatty acid ester, sucrose fatty acid ester, sorbitan fatty acid ester and coconut oil fatty acid diethanolamide; Alkyl sodium sulfate or sodium dodecylbenzenesulfonate and sodium laury...

Embodiment 3

[0036] The cleaning agent for copper substrate in this embodiment is made of the following raw materials in mass percentage: 2% organic acid activator, 0.05% nonionic surfactant, 0.01% anionic surfactant, 0.2% antioxidant, and 0.2% chelating agent , the balance is deionized water; the organic acid activator is succinic acid; the nonionic surfactant is coconut oil fatty acid diethanolamide; the anionic surfactant is sodium dodecylbenzenesulfonate and Dialkyl sodium sulfate; The antioxidant is benzotriazole; The chelating agent is EDTA disodium salt and EDTA.

[0037] The preparation method of this embodiment is the same as that of Example 1.

[0038] The cleaning agent in this embodiment does not need to be diluted and controlled dilution, can be used directly, does not contain heavy metals, has no residue, and can meet the requirements for copper treatment before hot-dip plating. The surface of the copper base material treated with the cleaning agent of this embodiment is cle...

technical field

[0001] The invention belongs to the technical field of chemical cleaning, and in particular relates to a copper substrate cleaning agent and a preparation method thereof. Background technique

[0002] According to the different pretreatment methods for surface metal plating, the substrate pretreatment process can be divided into solvent method and protective gas reduction method. The solvent method is to use the chemical action of the solvent to protect the surface of the copper that has been degreased and derusted before immersing it in the plating solution and to further activate it to ensure that the plating solution and the surface of the clean copper substrate are infiltrated, and through chemical The reaction and diffusion form the alloy layer. The method has simple equipment, low cost, easy operation and easy learning, flexible production, and can be mass-produced, and can be adjusted at any time according to the product batch. Therefore, it is of gr...

Examples

Embodiment 1

[0025] The cleaning agent for copper substrate in this embodiment is made of the following raw materials in mass percentage: 0.05% organic acid activator, 1% nonionic surfactant, 0.6% anionic surfactant, 0.005% antioxidant, and 0.005% chelating agent , the balance is deionized water; the organic acid activator is citric acid; the nonionic surfactant is alkylphenol polyoxyethylene ether; the anionic surfactant is sodium dodecylbenzenesulfonate; The antioxidant is tolutriazole; the chelating agent is EDTA disodium salt.

[0026] The preparation method of the copper substrate cleaning agent of the present embodiment is:

[0027] Step 1, dissolving the organic acid activator in deionized water to obtain a colorless and transparent solution A;

[0028] Step 2, adding nonionic surfactant, anionic surfactant and chelating agent into deionized water, stirring evenly to obtain colorless and transparent solution B;

[0029] Step 3: Mix the solution A described in step 1 with the solut...

Embodiment 2

[0032] The copper substrate cleaning agent of the present embodiment is the same as that of Embodiment 1, wherein the difference is: the organic acid activator is glutaric acid, itaconic acid, acetic acid, o-hydroxybenzoic acid, sebacic acid, oxalic acid, apple acid or succinic acid, or at least two of citric acid, glutaric acid, itaconic acid, acetic acid, o-hydroxybenzoic acid, sebacic acid, oxalic acid, malic acid and succinic acid; the nonionic surfactant is Fatty alcohol polyoxyethylene ether, fatty acid polyoxyethylene ester, pentaerythritol fatty acid ester, sucrose fatty acid ester, sorbitan fatty acid ester or coconut oil fatty acid diethanolamide, or fatty alcohol polyoxyethylene ether, alkylphenol At least two of polyoxyethylene ether, fatty acid polyoxyethylene ester, pentaerythritol fatty acid ester, sucrose fatty acid ester, sorbitan fatty acid ester and coconut oil fatty acid diethanolamide; Alkyl sodium sulfate or sodium dodecylbenzenesulfonate and sodium laury...

Embodiment 3

[0036] The cleaning agent for copper substrate in this embodiment is made of the following raw materials in mass percentage: 2% organic acid activator, 0.05% nonionic surfactant, 0.01% anionic surfactant, 0.2% antioxidant, and 0.2% chelating agent , the balance is deionized water; the organic acid activator is succinic acid; the nonionic surfactant is coconut oil fatty acid diethanolamide; the anionic surfactant is sodium dodecylbenzenesulfonate and Dialkyl sodium sulfate; The antioxidant is benzotriazole; The chelating agent is EDTA disodium salt and EDTA.

[0037] The preparation method of this embodiment is the same as that of Example 1.

[0038] The cleaning agent in this embodiment does not need to be diluted and controlled dilution, can be used directly, does not contain heavy metals, has no residue, and can meet the requirements for copper treatment before hot-dip plating. The surface of the copper base material treated with the cleaning agent of this embodiment is cle...