Copper-silver micro-nano multi-stage structure super-hydrophobic surface and production method thereof

A super-hydrophobic surface, silver micro-nano technology, applied in the direction of microstructure technology, microstructure devices, manufacturing microstructure devices, etc., can solve the problems of molecular failure, hydrophobic film easy to fall off, easy to fall off, etc., to achieve good stability, preparation The method is simple and the hydrophobic performance is good

Inactive Publication Date: 2014-02-19
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, there have been related reports on the preparation of super-hydrophobic surfaces. Most of the super-hydrophobic surfaces formed by oxidation of metals are not acid-resistant and soft and easy to fall off, while other super-hydrophobic surfaces of polymers are under high temperature conditions due to molecular Fluidity can easily lead to failure; in addition, there are some superhydrophobic materials that do not have sufficient interfacial bonding strength, and the hydrophobic film is easy to fall off and fail after a period of use
These defects greatly restrict the practical application of superhydrophobic surface materials.

Method used

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  • Copper-silver micro-nano multi-stage structure super-hydrophobic surface and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The following method is used to prepare a super-hydrophobic surface with metallic copper-silver micro-nano hierarchical structure:

[0031] (1) Select copper sheet as the metal substrate, and degrease and pickle the surface;

[0032] (2) Put the metal substrate treated in step (1) in PdCl with a concentration of 0.15g / L 2 Activation treatment in solution;

[0033] (3) Put the metal substrate activated in step (2) into the electroless plating solution for chemical deposition. The composition and concentration of the chemical deposition solution are: copper sulfate 0.05 mol / L, nickel sulfate 0.008 mol / L, Trisodium citrate 0.08mol / L, boric acid 0.5mol / L, sodium hypophosphite 0.4 mol / L, and polyethylene glycol 15ppm, adjust pH to 9 with sodium hydroxide, chemical deposition temperature is 50°C, chemical deposition The time is 25 minutes;

[0034] (4) The metal substrate obtained by copper chemical deposition in step (3) is washed with deionized water, then dried, and the...

Embodiment 2

[0046] According to the method of Example 1, the concentration of the n-hexadecanethiol solution is changed to 0.03mol / L, and the metal copper silver micro-nano multi-level structure superhydrophobic surface prepared has a contact angle with water of 165 °, and a rolling angle less than 10°.

[0047]

Embodiment 3

[0049] The following method is used to prepare the super-hydrophobic surface of metallic copper-silver micro-nano hierarchical structure:

[0050] (1) Aluminum sheet is selected as the metal substrate, and its surface is degreased and pickled;

[0051] (2) Put the metal substrate treated in step (1) in 0.35g / L PdCl 2 Activation treatment in solution;

[0052] (3) Place the metal substrate activated in step (2) in the copper plating chemical deposition solution for chemical deposition. The composition and concentration of the copper plating chemical deposition solution are: copper chloride 0.02 mol / L, nickel chloride 0.01mol / L, malic acid 0.08mol / L, boric acid 0.2mol / L, sodium hypophosphite 0.2mol / L, and polypropylene glycol 5ppm, adjust the pH to 8 with potassium hydroxide, the temperature of chemical deposition is 20 ℃, chemical Deposition time is 60min;

[0053] (4) The metal substrate obtained by copper chemical deposition in step (3) is washed with deionized water, then...

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Abstract

The invention discloses a copper-silver micro-nano multi-stage structure super-hydrophobic surface formed on a metal base surface. The copper-silver micro-nano multi-stage structure super-hydrophobic surface comprises a copper-sliver micro-nano multi-stage structure and a hydrophobic film. The hydrophobic film is self-fitted on the surface of the copper-sliver micro-nano multi-stage structure. The copper-sliver micro-nano multi-stage structure comprises a plurality of copper-sliver micro-nano cones which longitudinally grow perpendicular to a metal base and which are tightly arranged. The hydrophobic film is self-composed of low surface energy material. Compared with common self-assemblies, the copper-silver micro-nano multi-stage structure super-hydrophobic surface has the advantages that sulfydryl of hydrophobe long-chain mercaptan and outermost silver ions of the copper-sliver micro-nano multi-stage structure form a coordinate bond having a large stable constant, and accordingly, the copper-silver micro-nano multi-stage structure super-hydrophobic surface is well stable, resistant to acid, alkali, organic solutions, high temperature and low temperature.

Description

technical field [0001] The invention belongs to the field of preparation of micron and / or nanostructures on solid surfaces, and in particular relates to a metallic copper-silver micronano multilevel structure super-hydrophobic surface and a preparation method thereof. Background technique [0002] In nature, the lotus leaf effect has attracted the attention of more and more researchers. The formation of the lotus leaf effect is mainly controlled by two factors, one is the surface morphology, and the other is the chemical state of the surface. A study by Y T Cheng (Nanotechnology, 17(5), 1359-1362) showed that the surface of the lotus leaf has a secondary microstructure, that is, a microstructure with a diameter of 5-9 μm and a height of 1-20 μm, and the distribution diameter of the microstructure is about 124nm nano-scale fuzzy structure, and indicated to contain low surface energy waxy. Studies have shown that the contact angle of the lotus leaf with multi-level structure...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B1/00B81C1/00
Inventor 余喆吟李明吴蕴雯徐岚
Owner SHANGHAI JIAO TONG UNIV
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