Organosilicon wire enamel with thermal level up to 155 DEG C or above and preparation method of organosilicon wire enamel
A technology of silicone varnish and wire varnish, applied in the field of enameled wire varnish, which can solve the problems of heat resistance lower than 120°C, difficult to meet different environments, insufficient strength, etc., and achieve excellent medium resistance, excellent adhesion and consistency Good results
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[0013] The silicone wire enamelling enamel satisfying the heat level of 155°C and above is made of the following raw materials in parts by weight (kg): E-44 epoxy resin 13, nano-aluminum oxide 5, dimethylaminoethyl acrylate 3. Nylon 12 10, phenolic epoxy resin 10, silicone resin 5, titanate coupling agent TMC-TTS 6, m-aminomethylamine 8, magnesium hydroxide 8, hexamethylphosphoric triamide 4, dysprosium oxide 3. Additive 9, m-p-cresol 80, xylene 100;
[0014] The auxiliary agent is made of the following raw materials in parts by weight (kg): 0.2 nanometer mica powder, crosslinking agent TAC1, lauryl dimethyl amine oxide 1, methyltriethoxysilane 2, silane coupling agent KH550 2 , dimethylaminopropylamine 2, triethyl citrate 5, dipentaerythritol hexaacrylate 5, propyl gallate 2, coix seed oil 1; the preparation method is to mix the materials, heat to 60-70°C, and stir to react 30-40 minutes, that is.
[0015] The preparation method comprises the following steps:
[0016] (1) ...
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