Method for preparing water-soluble molecular self-assembly film type metal protective agent

Abstract

The invention discloses a method for preparing a water-soluble molecular self-assembly film type metal protective agent. The method comprises the following steps: A, mixing water and an organic solvent of which the mass ratio is (0.5-1.5);10, uniformly stirring, and preparing a mixed solvent; B, adding an emulsifier which accounts for 30-50 percent of the mass of the mixed solvent in the step A, uniformly stirring, and preparing a mixture; C, adding a film agent which accounts for 12-20 percent of the mass of the mixture in the step B, uniformly stirring, and further preparing a mixed solution; and D, adding a surfactant which accounts for 1.5-2.0 percent of the mass of the mixed solution and a reducing agent which accounts for 0.1-0.5 percent of the mass of the mixed solution in the step C, heating under water bath conditions at the temperature of 51-58 DEG C, controlling the temperature of the mixed solution, continuously stirring for 90-150 minutes, thereby obtaining the water-soluble molecular self-assembly film type metal protective agent. The method is simple in process, low in energy consumption and environmental friendly, a molecular self-assembly film can be formed on the metal surface through the protective agent, and the metal is effectively prevented from discoloring. The method is simple in process and large-scale production is easy to realize.

Description

technical field [0001] The invention relates to the field of metal protective agents, in particular to a preparation method of a water-soluble molecular self-assembled film type metal protective agent. A water-soluble molecular self-assembled film-type metal protective agent prepared by this technology can be used for metal coatings of various electroplating process devices, and anti-corrosion protection of various metal cultural relics. Background technique [0002] Common platinum, gold, silver, nickel, copper, and aluminum have resistivities of 10.6, 2.4, 1.58, 6.8, 1.67, and 2.66 μΩ cm, respectively, while the thermal conductivity of these platinum, gold, silver, nickel, copper, and aluminum are respectively 0.72, 3.17, 4.29, 0.91, 4.01, 2.37 W·cm -1 ·K -1 , it can be seen that compared with the comprehensive resistivity and thermal conductivity, gold and silver have better thermal conductivity and thermal conductivity. In addition, gold and silver also have many exce...

AI Technical Summary

Problems solved by technology

[0008] First, although alloy technology has good effects on metal protection and anti-discoloration, the composition of the alloy has very strict requirements, the manufacturing process of the alloy is also very complicated, and the cost of raw materials and manufacturing technology are high. It is only used on high-level key components, and it is difficult to be suitable for large-scale industrial applications

[0009] Second, the electroplating technology is the same as the alloy technology. Although it has a good effect of preventing metal discoloration and rust prevention, the electroplating process conditions are relatively harsh and the technical requirements are relatively high. The application is obviously limited, and the corresponding protection technology needs to be additionally used after electroplating. Therefore, the practical application of electroplating technology is also greatly restricted.

[0010] Third, chemical treatment agents used in technologies such as chemical passivation and galvanic passivation either contain heavy metal ions (Cr 3+ , CrO 4 2- etc.) problems such as environmental pollution, or there are restrictions on the consumption of electric energy and the process of electrochemical technology, and the use process may always produce more waste, pollutants and toxic products or consume more energy or process technology itself Defects such as demanding

[0011] Fourth, the existing metal surface anti-corrosion coating treatment technologies (such as organic adsorption passivation layer, resin coating, plasma polymerized film, etc.) either have complicated use process or limited range of use, or the synthesis of protective agents The cycle is long, or the process is complicated, the cost of production raw materials and production technology is high, or the use process causes environmental pollution or the protection effect on metals is not obvious, etc., it is difficult to be widely used, and it is difficult to achieve large-scale industrial production

[0012] Fifth, due to the use of complex chemical reactions or raw materials with high molecular weight or high melting point in the existing preparation and production technology of water-soluble metal protective agents, there are also complex preparation and reaction processes or complex use processes (such as application The Chinese patent No. 201310212527.6 includes 7~8 or more more complicated preparation steps), and the reaction temperature is relatively high (such as the Chinese patent No. ZL200710075422.5, the control temperature of the process technology for preparing water-soluble silver protective agent is not lower than 60°C (see the abstract of its specification for details); the reaction reflux temperature of the Chinese patented technology with application number 201310212527.6 is 85-90°C, 100-103°C) and other deficiencies, which directly increase the equipment and process requirements for the preparation of protective agents, high energy consumption, Undoubtedly, the manufacturing cost and the use cost will directly increase

[0013] Sixth, the protective effect of the existing water-soluble metal protective agent is not ideal, and the scope of application of the protective agent is not wide

The technology of this invention obviously has many types of raw materials, relatively complicated process, and obviously high cost of production technology, and its protective agent is only suitable for the protection of electronic components. Obviously, the scope of application is not wide, and its defects and deficiencies are obvious.

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