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Method for preparing polyimide thin film with low friction coefficient and high cohesive force

A polyimide film, low friction coefficient technology, applied in the formulation of low friction coefficient high adhesion polyamic acid preparation, low friction coefficient high adhesion polyimide film manufacturing field, can solve the problem of polyamide The problems of low surface energy, poor bonding performance and poor hydrophilicity of imine film can improve the performance and reliability of the use process, strong bonding force and high insulation.

Inactive Publication Date: 2014-05-07
TIANJIN TIANYUAN ELECTRONICS MATERIAL +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It has fundamentally changed the problems of low surface energy, poor hydrophilicity, poor bonding performance with other materials, high friction between film layers, and relative motion that is not smooth and causes adhesion of polyimide films.

Method used

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  • Method for preparing polyimide thin film with low friction coefficient and high cohesive force

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036]Add 750kg of N,N-dimethylacetamide to the storage tank at a temperature of 10±2°C, add 7kg of filler calcium phosphate, 10kg of nano-scale organic silicon, and 3kg of dispersant during the resin synthesis process. It is mixed evenly with a polyamic acid solution with a solid content of 20% and a viscosity of 250,000 at a mass ratio of 1:7.5. After filtering and natural defoaming, it is sprayed by an extrusion touch head device and placed in a width of 50~ On a 70cm mirror steel belt (the inside is a closed clean system), it is dried at a speed of 6m / min at 75°C, 130°C, and 175°C to form a film, and then part of the thermally imidized film is passed through a peeling roller The steel strip is peeled off, and then sent into a high-temperature furnace with five temperature sections of 300°C, 350°C, 400°C, 450°C and 250°C through biaxial stretching (stretch ratio is 1.10) for complete imidization treatment. The amount of residual solvent is 0.1% to 1.0%. Finally, the polyimi...

Embodiment 2

[0038] Add 750kg of N,N-dimethylacetamide to the storage tank at a temperature of 10±2°C, add 7kg of filler calcium phosphate, 15kg of nano-scale organic silicon, and 3kg of dispersant during the resin synthesis process. After mixing evenly, press It is mixed with a polyamic acid solution with a solid content of 20% and a viscosity of 250,000 at a mass ratio of 1:6. After filtering and natural defoaming, it is sprayed by an extrusion touch head device and placed in a width of 50~ On a 70cm mirror steel belt (the inside is a closed clean system), it is dried at a speed of 6m / min at 75°C, 130°C, and 175°C to form a film, and then part of the thermally imidized film is passed through a peeling roller The steel strip is peeled off, and then sent into a high-temperature furnace with five temperature sections of 300°C, 350°C, 400°C, 450°C and 250°C through biaxial stretching (stretch ratio is 1.10) for complete imidization treatment. The amount of residual solvent is 0.1% to 1.0%. F...

Embodiment 3

[0040] Add 750kg of N,N-dimethylacetamide to the storage tank with a temperature of 10±2°C, add 17kg of filler calcium phosphate and 3kg of dispersant during the resin synthesis process, stir and mix evenly, according to its solid content of 20 The polyamic acid solution with a viscosity of 250,000% is 1:7.5 mass ratio. After mixing evenly, after filtering and defoaming naturally, it is casted by an extrusion touch head device and placed on a mirror steel belt with a width of 50-70cm. (The inside is a closed clean system), drying at a speed of 6m / min in three stages of 75°C, 130°C, and 175°C to form a film, and then part of the thermally imidized film is peeled off the steel strip by a peeling roller, and then After biaxial stretching (stretch ratio 1.10), it is sent into a high-temperature furnace with five temperature sections at 300°C, 350°C, 400°C, 450°C and 250°C for complete imidization treatment, and the residual solvent in the film is 0.1%. ~1.0%, and finally treated w...

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Abstract

The invention discloses a method for preparing a polyimide thin film with low friction coefficient and high cohesive force, and belongs to the technical field of electronic thin film insulating material preparation. During the preparation process, a composition of a filtering material and a dispersing agent of which the mass ratio is (10:1)-(1:1) is used, the filtering material is microscale or nanoscale spherical organosilicone, silicate, aluminum-oxygen compound or calcium phosphate filtering material and the like; the dispersing agent is polyphosphate or polyacrylic acid compound or composition; every 100 parts of a polyamide acid resin liquid (solid content) by weight uses 10-20 parts of the composition of the filtering material and the dispersing agent by weight. Through the addition of the microscale filtering material, the internal performance of the thin film is improved, the surface roughness of the thin film is increased, the mechanical occlusion action of the thin film and the coating surface and the adhesive force of the thin film and the coating are enhanced, the wettability and the adhesion are greatly improved, so that the working efficiency is effectively improved, the product quality is optimized, and the suitability and the reliability of the thin film in various fields can be improved.

Description

technical field [0001] The invention relates to a manufacturing technology of a polyimide film with a low coefficient of friction and high cohesion, in particular to a method for preparing a formula of polyamic acid with a low coefficient of friction and high cohesion, belonging to the field of special polymer materials. Background technique [0002] With the development of cutting-edge new technologies such as the aerospace industry and the electronics industry, the demand for polyimide films continues to expand. At this stage, there are many technical problems in the development of polyimide film products in my country: the electronic industry requires the quality of polyimide film, especially the surface quality of the film is very high, so the steel strip is required to be a mirror steel strip. However, due to the very high smoothness of the mirror steel strip, the Ra value reaches 0.02, the surface of the produced film is very smooth, and the film layers are easy to sti...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08K7/16C08K5/54C08K3/32C08J5/18C08L79/08C08L33/00B32B15/08B32B15/20
Inventor 张玉谦滕国荣李秀铭
Owner TIANJIN TIANYUAN ELECTRONICS MATERIAL
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