Preparation method for N-shaped back-junction solar cell

A solar cell, N-type technology, applied in the field of solar cells, can solve problems such as the impact of silicon chip minority carrier life, complex cell preparation process, and affect efficiency, and achieve the effect of improving photoelectric conversion efficiency, suitable for popularization and application, and low cost

Active Publication Date: 2014-07-02
CSI CELLS CO LTD
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Problems solved by technology

However, due to the diffraction of diffusion, when phosphorus is diffused on the front surface, part of the phosphorus doping will be formed on the back surface, and when boron is diffused on the back surface, boron diffraction will be formed on the front surface, so the diffusion must be done on the side that does not need to be diffused. Silicon oxide or silicon nitride is u...

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  • Preparation method for N-shaped back-junction solar cell

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Embodiment 1

[0030] see figure 1 Shown, a kind of preparation method of N-type back junction solar cell comprises the steps:

[0031] (1) Cleaning; double-sided polishing of the back surface and front surface of the N-type silicon wafer; polishing can be carried out in pure tetramethylammonium hydroxide solution;

[0032] (2) Carrying out boron diffusion to the above-mentioned N-type silicon wafer;

[0033] The boron diffusion adopts the boron tribromide liquid source diffusion method, and the boron diffusion uses boron tribromide as the source high-temperature diffusion in a tube furnace, which can be inserted into a single piece or double pieces;

[0034] First deposit boron tribromide with oxygen at 950°C for 30 minutes, then advance without power supply for 30 minutes under an oxygen atmosphere, then cool down to 850°C and oxidize for 40 minutes, and grow an oxide layer on the front and back surfaces of the silicon wafer; The thickness of the oxide layer is at least 20 nanometers;

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Abstract

The invention discloses a preparation method for an N-shaped back-junction solar cell. The preparation method comprises the following steps: (1) cleaning and polishing; (2) diffusing boron and growing an oxidation layers on the front surface and the back surface of a silicon wafer; (3) etching the edge and the front surface of the silicon wafer to obtain a silicon wafer with the oxidation layer on the front surface removed; (4) conducting texturization on the front surface of the silicon wafer through tetramethyl ammonium hydroxide solution; (5) injecting ions; (6) activating at high temperature; (7) depositing silicon nitride on the two surfaces; (8) forming a point contact opening in the back surface of the silicon wafer; (9) printing an aluminum electrode and a silver electrode, and jointly sintering the aluminum electrode and the silver electrode to form metallization contact. According to the preparation method for the N-shaped back-junction solar cell, the oxidation layer retained on the back surface serves as a blocking layer to conduct texturization on the front surface, texturization on the front surface is achieved while the passivation effect of the oxidation layer on the back face is not influenced. In addition, the oxidation layer retained on the back surface serves as a passivation layer, and the oxidation layer or deposited aluminium oxide do not need to be formed at high temperature again, so that the processing steps are greatly simplified.

Description

technical field [0001] The invention relates to a preparation method of an N-type back-junction solar cell, belonging to the technical field of solar cells. Background technique [0002] Conventional fossil fuels are being exhausted day by day. Among the existing sustainable energy sources, solar energy is undoubtedly the cleanest, most common and most potential alternative energy source. Solar power generation devices, also known as solar cells or photovoltaic cells, can directly convert solar energy into electrical energy. The principle of power generation is based on the photovoltaic effect of semiconductor PN junctions. In the prior art, types of silicon wafers mainly include P-type silicon wafers and N-type silicon wafers. Among them, the minority carrier lifetime of N-type silicon wafer is long, and the corresponding recombination is low, so the PN junction of the battery can be prepared on the back of the battery, so there is no dead layer on the front of the battery...

Claims

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Application Information

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IPC IPC(8): H01L31/18
CPCH01L31/02363Y02E10/50Y02P70/50
Inventor 刘运宇王栩生章灵军
Owner CSI CELLS CO LTD
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