A method for changing the surface energy of electroformed structures
A structural surface and electroforming technology, applied in electroforming, electrolytic process, electrolytic inorganic material coating, etc., can solve problems such as low thermal conductivity, complicated process, and decreased operation controllability, so as to improve mass transfer and heat transfer capacity , Improve the effect of transport capacity
Inactive Publication Date: 2016-01-06
DALIAN UNIV OF TECH
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Problems solved by technology
The micro-heat pipes in the above methods are mostly manufactured by macroscopic methods, so processes such as welding and sintering can be used. When the micro-heat pipes are manufactured by the MEMS method, the controllability of the above-mentioned process methods decreases and is no longer applicable.
MEMS micro heat pipes use copper and copper mesh mixed liquid-absorbing core [C.J.Oshman, Fabrication and testing of flat polymer microheatpipe, Transducer2009, DenverUSA], but the process is complicated, and due to the presence of polymer materials, the thermal conductivity is not high
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[0014] The specific embodiments of the present invention will be described in detail below in conjunction with the technical solutions and accompanying drawings.
[0015] Step 1: Obtain a metal seed layer 2 with a thickness of 150 nm on the surface of the silicon wafer 3 by sputtering. Then, apply SU-8 photoresist 1. When applying SU-8 photoresist 1, pre-coat with a uniform machine at a speed of 500rpm for 15s, and then spin coat at a speed of 2000rpm for 45s to obtain a thickness of 100μm. Pre-bake the SU-8 glue at 85°C for 90 minutes, bake the SU-8 glue at 85°C for 5 minutes after photolithography on a photolithography machine, and then develop it to obtain the patterned SU-8 glue 4.
[0016] Step 2: In the electroforming machine, electroform copper on the patterned SU-8 glue 4, the composition of the electroforming solution is: the concentration of copper sulfate is 70g / L, the concentration of sulfuric acid is 200g / L, and the brightener is 0.1ml / L, leveling agent 1ml / L, e...
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Abstract
The invention discloses a method for changing surface energy of an electroforming structure, and belongs to the field of manufacturing of metal microstructures. The specific method is as follows: sputtering a metal seed layer on the surface of a silicon wafer, wherein the thickness of the metal seed layer is 50-300 nm; coating a photoresist on the metal seed layer to obtain an electroforming channel die, wherein the thickness of the photoresist is 100-900 microns; electroforming in the electroforming channel die to remove the photoresist to obtain a silicon wafer metal microstructure, wherein the thickness of the electroformed metal is smaller than or equal to the height of the electroforming channel die; selectively electrospray depositing graphene on the silicon wafer metal microstructure, wherein the thickness of the graphene is 3-100 nm; putting the silicon wafer metal microstructure deposited with the graphene in an electroforming groove, filling a reverse current to obtain a micro nano structure of 5 nm to 1 micron on the silicon wafer metal microstructure, and regulating and controlling the surface energy of the electroforming structure of the region. The method disclosed by the invention is used for improving the transportation capacity of a working medium in a heat pipe and improving the mass and heat transfer capability of the type of devices.
Description
technical field [0001] The invention belongs to the field of metal microstructure manufacturing, and relates to a method for changing the surface energy of an electroforming structure, which is applied to control the liquid flow and heat flow transport characteristics of a microfluidic device. Background technique [0002] Microfluidic technology refers to the processing or manipulation of liquids with a capacity of nanoliters or smaller in submicron channels. The manufacture of microfluidic devices is usually realized by MEMS processing technology. For example, the microchannels of silicon microfluidic devices are obtained by wet etching or dry etching, and the microchannels of metal microfluidic devices are obtained by electroforming. The above-mentioned devices have good application prospects in many fields, such as chemical synthesis, biochemical analysis, drug detection, mass transfer and heat transfer, etc., but they are still in the early stage of development, and man...
Claims
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IPC IPC(8): C23F17/00C25D1/00C25D9/04C23C14/34C23C14/16
Inventor 罗怡王晓东王大志刘继光查文邹靓靓于贝珂
Owner DALIAN UNIV OF TECH