Thermosetting resin composition and method for manufacturing prepreg and laminated board by using thermosetting resin composition
A technology of a resin composition and a manufacturing method, applied in the fields of thermosetting resin compositions, manufacturing prepregs and laminates for printed circuits, can solve problems such as loss of dielectric properties of cyanate resins, and achieve low dielectric loss factor and excellent flame retardancy. properties, good dielectric properties
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[0024] Example 1
[0025] Take 40 parts of dicyclopentadiene (DCPD) epoxy resin (XD-1000, Nippon Kayaku), 40 parts of bisphenol A cyanate ester resin (BA-3000S, Lonza), and diaminodiphenylmethane type Bima Lyimide resin (Hubei Huashuo) 20 parts, hydroxyl-terminated polyphenylene ether (SABIC, SA90) 20 parts, zinc isooctanoate (Shanghai Changfeng Chemical) 0.05 parts, ethylene bistetrabromophthalimide 16 parts of amine (BT-93W Yabao), 50 parts of spherical silica (SFP-30M, DENKA), and methyl ethyl ketone solvent to adjust the solid content of the resin composition to 60wt%.
[0026] The thermosetting resin composition was impregnated and coated on E-type glass cloth (2116, unit weight 104g / m 2 ), and bake in an oven at 170°C for 4 minutes to prepare a prepreg with a resin content of 50%.
[0027] The prepared prepreg with a resin content of 50% was laminated with a copper foil on top and bottom, and pressed in a vacuum hot press to obtain a copper clad laminate. The specific pressin...
Example Embodiment
[0029] Example 2
[0030] Take 50 parts of biphenyl type epoxy resin (NC-3000, Nippon Kayaku), 30 parts of bisphenol A type cyanate resin (CY-1, Jiangdu Wuqiao Resin Factory), and diaminodiphenylmethane type bismaleyl Imine resin (Hubei Huashuo) 30 parts, hydroxyl-terminated polyphenylene ether (SABIC, SA90) 30 parts, cobalt isooctanoate (Shanghai Changfeng Chemical) 0.03 parts, aluminum hypophosphite (OP935, Clariant, Germany) 18 parts , Fused silica powder (Lianyungang Donghai silica powder) 40 parts, boehmite (BS100, Kahe lime) 20 parts, with methyl ethyl ketone solvent to adjust the solid content of the resin composition to 60wt%.
[0031] The preparation methods of the prepreg and copper clad laminate are the same as in Example 1.
[0032] The performance of the copper clad laminate is shown in Table 1.
Example Embodiment
[0033] Example 3
[0034] Take 30 parts of dicyclopentadiene (DCPD) epoxy resin (XD-1000, Nippon Kayaku), 50 parts of dicyclopentadiene cyanate resin (CY-3, Jiangdu Wuqiao Resin Factory), and diaminodiphenyl Methane-type bismaleimide resin (Hubei Huashuo) 20 parts, hydroxyl-terminated polyphenylene ether (SABIC, SA90) 40 parts, zinc isooctanoate (Shanghai Changfeng Chemical) 0.15 parts, PX-200 (Japan Da Ba Chemistry) 21 parts, spherical silica (SFP-30M, DENKA) 50 parts, and methyl ethyl ketone solvent is used to adjust the solid content of the resin composition to 60wt%.
[0035] The preparation methods of the prepreg and copper clad laminate are the same as in Example 1.
[0036] The performance of the copper clad laminate is shown in Table 1.
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