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Thermosetting resin composition and method for manufacturing prepreg and laminated board by using thermosetting resin composition

A technology of a resin composition and a manufacturing method, applied in the fields of thermosetting resin compositions, manufacturing prepregs and laminates for printed circuits, can solve problems such as loss of dielectric properties of cyanate resins, and achieve low dielectric loss factor and excellent flame retardancy. properties, good dielectric properties

Inactive Publication Date: 2014-07-23
ZHEJIANG WAZAM NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with cyanate resin, the resin composition has a certain improvement in toughness and moisture resistance, but greatly loses the dielectric properties of cyanate resin

Method used

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  • Thermosetting resin composition and method for manufacturing prepreg and laminated board by using thermosetting resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Take 40 parts of dicyclopentadiene (DCPD) type epoxy resin (XD-1000, Nippon Kayaku), 40 parts of bisphenol A type cyanate resin (BA-3000S, Lonza), 40 parts of diaminodiphenylmethane type double horse 20 parts of imide resin (Hubei Huashuo), 20 parts of hydroxyl-terminated polyphenylene ether (SABIC, SA90), 0.05 parts of zinc isooctanoate (Shanghai Changfeng Chemical Industry), ethylene bis-tetrabromophthaloyl 16 parts of amine (BT-93W Yabao), 50 parts of spherical silica (SFP-30M, DENKA), and adjust the solid content of the resin composition to 60wt% with butanone solvent.

[0026] The thermosetting resin composition is impregnated and coated on E-type glass cloth (2116, unit weight 104g / m 2 ) and baked in an oven at 170°C for 4 minutes to obtain a prepreg with a resin content of 50%.

[0027] The prepared prepreg with a resin content of 50% was stacked with a copper foil on top and bottom, and pressed in a vacuum hot press to obtain a copper-clad laminate. The specif...

Embodiment 2

[0030] Take 50 parts of biphenyl type epoxy resin (NC-3000, Nippon Kayaku), 30 parts of bisphenol A type cyanate resin (CY-1, Jiangdu Wuqiao Resin Factory), 30 parts of diaminodiphenylmethane type bismaleyl 30 parts of imine resin (Hubei Huashuo), 30 parts of hydroxyl-terminated polyphenylene ether (SABIC, SA90), 0.03 parts of cobalt isooctanoate (Shanghai Changfeng Chemical Industry), 18 parts of aluminum hypophosphite (OP935, Clariant, Germany) 1. 40 parts of fused silica powder (Lianyungang Donghai silica powder), 20 parts of boehmite (BS100, Hehe lime), the solid content of the resin composition is adjusted to 60wt% with butanone solvent.

[0031] The preparation methods of the prepreg and the copper-clad laminate are the same as in Example 1.

[0032] The properties of copper clad laminates are shown in Table 1.

Embodiment 3

[0034] Take 30 parts of dicyclopentadiene (DCPD) type epoxy resin (XD-1000, Nippon Kayaku), 50 parts of dicyclopentadiene type cyanate resin (CY-3, Jiangdu Wuqiao Resin Factory), diaminodiphenyl Methane-type bismaleimide resin (Hubei Huashuo) 20 parts, hydroxyl-terminated polyphenylene ether (SABIC, SA90) 40 parts, zinc isooctanoate (Shanghai Changfeng Chemical) 0.15 parts, PX-200 (Japan Daihachi) chemical) 21 parts, spherical silica (SFP-30M, DENKA) 50 parts, the solid content of the resin composition was adjusted to 60wt% with butanone solvent.

[0035] The preparation methods of the prepreg and the copper-clad laminate are the same as in Example 1.

[0036] The properties of copper clad laminates are shown in Table 1.

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Abstract

The present invention discloses a thermosetting resin composition and a method for manufacturing a prepreg and a laminated board by using the thermosetting resin composition. The thermosetting resin composition is prepared by dispersing the following components in an organic solvent, wherein the components comprise, by weight, 10-80 parts of an epoxy resin, 10-60 parts of cyanate, 10-60 parts of bismaleimide, 10-50 parts of polyphenylene oxide, 0.01-1.0 part of a curing accelerator, 1-40 parts of a fire retardation agent, and 0-100 parts of an inorganic filler, and the solid content of the resin composition is 30-70 wt%. The prepared prepreg and the metal foil-clad laminated board have characteristics of good heat resistance, good wet heat resistance, high glass-transition temperature, low water absorption rate, low dielectric constant, low dielectric loss factor and the like.

Description

technical field [0001] The invention belongs to the technical field of polymer composite material manufacturing, and in particular relates to a thermosetting resin composition and a method for manufacturing a prepreg and a printed circuit laminate using the resin composition. Background technique [0002] In recent years, with the development of high-performance and high-function computers and communication equipment, the speed of electronic signal transmission is required to be faster and faster, the capacity of signal transmission is larger and larger, and signal processing is developing in the direction of high frequency. Therefore, higher requirements are put forward for the material of the circuit substrate, that is, the circuit substrate is required to have a lower dielectric constant and a lower dielectric loss factor. [0003] Ordinary FR-4 copper clad laminates use bisphenol A epoxy resin (Dk=3.6, Df=0.025) as their main resin system, and the dielectric constant and...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L79/08C08L79/04C08L71/12C08K5/06C08K5/03C08K3/32C08K5/3492C08K5/521C08K5/5399C08K7/18B32B27/04B32B27/38B32B15/092
Inventor 沈宗华潘锦平董辉姜欢欢虞德坤
Owner ZHEJIANG WAZAM NEW MATERIAL CO LTD
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