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A kind of low percolation threshold high thermal stability carbon nanotube ternary composite material and preparation method thereof

A high thermal stability, carbon nanotube technology, applied in the field of polymer composite materials, can solve the problems of high melt viscosity, poor solvent resistance, unoptimistic processing fluidity, etc., achieve low percolation threshold, excellent electrical conductivity, easy to use. Effects of industrial production operations

Inactive Publication Date: 2016-02-03
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the amorphous structure of TPI determines its poor solvent resistance, and the melt viscosity of TPI is high, and the processing fluidity is not optimistic.

Method used

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  • A kind of low percolation threshold high thermal stability carbon nanotube ternary composite material and preparation method thereof
  • A kind of low percolation threshold high thermal stability carbon nanotube ternary composite material and preparation method thereof
  • A kind of low percolation threshold high thermal stability carbon nanotube ternary composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Dry polyetheretherketone and thermoplastic polyimide with a melt index of 100g / 10min and a logarithmic reduced viscosity of 0.63 at 180°C for 3 hours. The conductive composite material contains 49.95wt% poly Ether ether ketone, 49.95wt% of thermoplastic polyimide, and 0.1wt% of double-walled carbon nanotubes were pre-mixed in a high-speed mixer for 2 minutes to obtain composite material powder. Add the above composite material powder into a twin-screw extruder and melt and extrude at 360 ° C to obtain a conductive composite material with a weight percentage of carbon nanotubes of 0.1 wt % and a mass ratio of polyether ether ketone to polyimide of 5:5 . After melt extrusion, granulation yields pellets.

[0020] Finally, the pellets were dried and then injection molded (Mini‐Jet injection molding machine, injection molding temperature 380 ° C), injection molded into a circular sample with a diameter of 20 mm and a thickness of 2 mm, and was tested with an Agilent 4294A p...

Embodiment 2

[0023]Dry polyether ether ketone and thermoplastic polyimide with a melt index of 100g / 10min and a logarithmic reduced viscosity of 0.63 at 180°C for 3 hours. The conductive composite material contains 49.5wt% poly Ether ether ketone, 49.5wt% of thermoplastic polyimide, and 1.0wt% of double-walled carbon nanotubes were pre-mixed in a high-speed mixer for 2 minutes to obtain composite material powder. Add the above composite material powder into a twin-screw extruder and melt and extrude at 360°C to obtain a conductive composite material with a weight percentage of carbon nanotubes of 1.0 wt%, and a mass ratio of polyetheretherketone and polyimide of 5:5 . After melt extrusion, granulation yields pellets.

[0024] Finally, the pellets were dried and then injection molded (Mini‐Jet injection molding machine, injection molding temperature 380 ° C), injection molded into a circular sample with a diameter of 20 mm and a thickness of 2 mm, and was tested with an Agilent 4294A preci...

Embodiment 3

[0026] Dry polyether ether ketone and thermoplastic polyimide with a melt index of 100g / 10min and a logarithmic reduced viscosity of 0.63 at 180°C for 3 hours. The conductive composite material contains 48.5wt% poly Ether ether ketone, 48.5wt% of thermoplastic polyimide, and 3.0wt% of double-walled carbon nanotubes were pre-mixed in a high-speed mixer for 2 minutes to obtain composite material powder. Add the above composite material powder into a twin-screw extruder and melt and extrude at 360°C to obtain a conductive composite material with a weight percentage of carbon nanotubes of 3.0wt% and a mass ratio of polyether ether ketone to polyimide of 5:5 . After melt extrusion, granulation yields pellets.

[0027] Finally, the pellets were dried and then injection molded (Mini‐Jet injection molding machine, injection molding temperature 380 ° C), injection molded into a circular sample with a diameter of 20 mm and a thickness of 2 mm, and was tested with an Agilent 4294A preci...

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Abstract

The invention relates to a ternary conductive composite material with a low percolation threshold and high thermal stability and a preparation method thereof and belongs to the field of polymer conductive composite materials. A blend of polyether ether ketone and thermoplastic polyimide is taken as a polymer matrix and the mass ratio of the two types of resin is (4: 6) to (6: 4); carbon nanotubes are taken as conductive filler and account for 0.1-3.0wt% of the total mass of the composite material. In the composite material prepared by the preparation method disclosed by the invention, the carbon nanotubes are selectively distributed in polyimide through scanning electron microscopy, the polymer matrix forms a bicontinuous structure, the percolation threshold of the composite material is as low as 0.2-1.0wt%, the alternating current conductivity at the frequency of 10<3>Hz is 5.0*10<-10> to 2.0*10<-1>S / m, the energy storage modulus of the composite material in a high-temperature zone of 200-240 DEG C is 740-900Mpa and the composite material has great high-temperature using performance and can be widely applied in the fields of conductive, anti-static and electromagnetic shielding materials and the like of aerospace.

Description

technical field [0001] The invention belongs to the technical field of polymer composite materials, and specifically relates to a ternary conductive material with low percolation threshold and high thermal stability, which uses polyether ether ketone and polyimide blend as the matrix, and uses carbon nanotubes as the conductive filler. Composite materials and methods for their preparation. Background technique [0002] Conductive materials have attracted extensive research interest due to their application value in electromagnetic shielding, electrochromic displays, photoelectric conversion, and antistatic materials. Compared with traditional metal conductive materials, polymer-based conductive materials have the advantages of light weight, corrosion resistance, and easy processing. Among them, characteristic engineering plastics (polyether ether ketone, polyether sulfone, polyimide, etc.) are considered to be good substitutes for metal materials in the aerospace field beca...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/16C08L79/08C08K7/00C08K3/04B29C47/92B29C48/92
CPCB29B7/46B29B7/72B29B7/7461B29B9/06B29B2009/125B29C48/40B29C48/92B29C2948/92266B29C2948/926B29C2948/92619B29C2948/92638B29C2948/92647B29C2948/92695B29C2948/92704
Inventor 姜振华高聪张淑玲林宇津韩冰王贵宾
Owner JILIN UNIV
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