Method for preparing transparent conductive FTO/Ag/FTO composite film
A transparent conductive and composite film technology, applied in ion implantation plating, metal material coating process, coating, etc., can solve the problems of high cost of gold and platinum, difficulty in obtaining low resistivity FTO film, etc., and achieve the reduction of film resistance , good application prospects, simple preparation process
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Embodiment 1
[0027] (1) Prepare SnO by standard isostatic solid-state reaction synthesis process 1.92 f 0.16 target. Press SnO with an electronic balance 1.92 f 0.16 The stoichiometric ratio of the corresponding elements weighed SnO 2 and SnF 2 The powder raw material has a purity of 99.9%. After fully mixing, pre-press molding (50MPa), then use cold isostatic pressing (200MPa), and finally place in an electric furnace and gradually raise the temperature to 200°C for 10 hours, then gradually raise the temperature to 1000°C for 2 hours, and fire FTO target.
[0028] (2) Put the FTO target material and the Ag target material together into the vacuum chamber;
[0029] Then, the quartz substrate was ultrasonically cleaned with acetone, absolute ethanol and deionized water, dried with high-purity nitrogen, and placed in a vacuum chamber; the distance between the FTO target and the quartz substrate was 60 mm.
[0030] (3) Pump the background vacuum of the magnetron sputtering system to 1...
Embodiment 2
[0037] (1) Prepare SnO by standard isostatic solid-state reaction synthesis process 1.92 f 0.16 target. Press SnO with an electronic balance 1.92 f 0.16 The stoichiometric ratio of the corresponding elements weighed SnO 2 and SnF 2 The powder raw material has a purity of 99.9%. After fully mixing, pre-press molding (50MPa), then use cold isostatic pressing (200MPa), and finally place in an electric furnace and gradually raise the temperature to 200°C for 10 hours, then gradually raise the temperature to 1000°C for 2 hours, and fire FTO target.
[0038] (2) Put the FTO target material and the Ag target material together into the vacuum chamber;
[0039] Then, the quartz substrate was ultrasonically cleaned with acetone, absolute ethanol and deionized water, dried with high-purity nitrogen, and placed in a vacuum chamber; the distance between the FTO target and the quartz substrate was 60 mm.
[0040] (3) Pump the background vacuum of the magnetron sputtering system to 1...
Embodiment 3
[0045] (1) Prepare SnO by standard isostatic solid-state reaction synthesis process 1.92 f 0.16 target. Press SnO with an electronic balance 1.92 f 0.16 The stoichiometric ratio of the corresponding elements weighed SnO 2 and SnF 2 The powder raw material has a purity of 99.9%. After fully mixing, pre-press molding (50MPa), then use cold isostatic pressing (200MPa), and finally put it in an electric furnace and gradually raise the temperature to 200°C for 10 hours, then gradually raise the temperature to 1000°C for 2 hours, and fire FTO target.
[0046] (2) Put the FTO target material and the Ag target material into the vacuum chamber together.
[0047] Then, the quartz substrate was ultrasonically cleaned with acetone, absolute ethanol and deionized water, dried with high-purity nitrogen, and placed in a vacuum chamber. The distance between the FTO target and the quartz substrate was 60 mm.
[0048] (3) Pump the background vacuum of the magnetron sputtering system to ...
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