Method for preparing chip ceramic PTC thermistor surface protection layer

A thermistor and protective layer technology, which is applied in the field of preparation of the surface protective layer of the chip ceramic PTC thermistor, can solve the problems of poor matching, resistance to plating solution corrosion, etc.
CN104529434AActive Publication Date: 2015-04-22SHENZHEN SUNLORD ELECTRONICS
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
SHENZHEN SUNLORD ELECTRONICS
Publication Date
2015-04-22

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Abstract

The invention discloses a method for preparing a chip ceramic PTC thermistor surface protection layer. The method comprises the following steps: S1. mixing and ball-milling inorganic powder, an organic solvent and a dispersing agent according to a proportion of 100: (60-100): (0.6-1) to obtain a slurry precursor used for preparing the surface protection layer, wherein the inorganic powder comprises 70.0-90.0% of barium titanate, 2.0-10.0% of silicon dioxide, 2.0-10.0% of aluminum oxide, 2.0-5.0% of calcium oxide, 0.5-5.0% of lithium carbonate and 0.5-2.0% of bismuth trioxide; S2. adding an adhesive into the slurry precursor for mixing and ball-milling to obtain protection layer slurry, wherein the mass ratio of the adhesive to the inorganic powder is (6-10):100; S3. coating the protection layer slurry on the surface of a chip ceramic PTC thermistor blank, and sintering the chip ceramic PTC thermistor blank coated with the protection layer slurry at 1150-1250 DEG C to obtain the surface protection layer which is dense, high in insulation resistance and resistant to acid and alkali and is suitable for subsequent plating treatment of chip ceramic PTC.
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Description

technical field

[0001] The invention relates to the technical field of preparation of ceramic electronic components, in particular to a method for preparing a surface protection layer of a chip-type ceramic PTC thermistor. Background technique

[0002] Today, with the rapid development of electronic technology, the whole machine is developing in the direction of lightness, thinness, small size and high reliability. mainstream. High-precision, high-reliability chip PTC has become the focus of research at home and abroad. At present, in order to ensure the soldering performance of chip electronic components, the following two methods are used: 1. Nickel plating and tin plating are performed on the terminal electrodes after the terminal electrodes are formed. However, PTC is a semiconductor material with low surface resistance. At the same time of nickel plating and tin plating, nickel and tin will also adhere to the surface of the PTC ceramic body, causing an electrical shor...

Claims

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