Polyimide and molded body thereof

A technology of polyimide and polyimide film, applied in the direction of coating, etc., can solve the problems of low hygroscopic solvent solubility, undiscovered polyimide, low linear thermal expansion coefficient, etc., and achieve high solution stability, The effect of excellent transparency and low linear thermal expansion coefficient

Active Publication Date: 2015-05-20
HONSHU CHEM INDAL +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, film formation from polyimide varnishes derived from amide-based solvents often presents significant problems
[0019] That is, when continuous coating lasts for a long time, due to the high hygroscopicity of the amide solvent, the polyimide sometimes absorbs moisture in the atmosphere, and the viscosity of the polyimide solution, the polyimide Precipitation causes pore clogging of coating equipment, which often poses a major obstacle to continuous coating
Therefore, from the viewpoint of solution processability, polyimides having high solubility in low hygroscopicity solvents are preferred, but polyimides soluble in solvents less polar than amide solvents have not been found so far. heat-expandable polyimide
[0020] As mentioned above, conventionally, it is extremely difficult to design the molecule of a wholly aromatic polyimide that fully satisfies solution processability (low hygroscopic solvent solubility), low linear thermal expansion coefficient, high heat resistance, and high transparency. It has not yet been found that the physical properties required as substrates for liquid crystal displays, substrates for organic electroluminescence (EL) displays, substrates for electronic newspapers, and other imaging devices, as well as transparent substrates such as solar cell substrates, and transparent protective film materials , Practical transparent plastic substrate material

Method used

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  • Polyimide and molded body thereof
  • Polyimide and molded body thereof
  • Polyimide and molded body thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0090] Regarding the preparation method of the polyimide of the present invention, taking the polyimide containing the structural unit shown in the following formula (2) when all R in the above formula (1) is a methyl group as an example, further Detailed explanation. In addition, even when R is another alkyl group or a hydrogen atom, it can still be prepared in the same way as polyimide containing the structural unit represented by formula (2).

[0091] Formula (2)

[0092]

[0093] The polyimide represented by the above formula (2) can be produced from tetracarboxylic dianhydride represented by the following formula (9).

[0094] Formula (9)

[0095]

[0096] The tetracarboxylic dianhydride shown in the above formula (9) can use diols shown in the following formula (10), that is, 2,2',3,3',5,5'-hexamethyl-biphenyl-4, 4'-diol (hereinafter sometimes abbreviated as HM44BP) or its diacetate body is prepared by a known esterification reaction with trimellitic acid.

[0...

Embodiment

[0143] The following examples illustrate the present invention, but are not limited to these examples. In addition, the physical property value in the following example was measured by the following method.

[0144] (Evaluation method)

[0145] The material property values ​​and the like described in this specification are obtained by the following evaluation methods.

[0146]

[0147] The infrared absorption spectrum of tetracarboxylic dianhydride was measured by the KBr method using Fourier transform infrared spectrophotometer FT / IR350 (made by JASCO Corporation). In addition, the infrared absorption spectrum of polyimide was measured by preparing a thin film sample (about 5 micrometers thick).

[0148] 1 H-NMR spectrum>

[0149] Using Fourier transform nuclear magnetic resonance JNM-ECP400 (manufactured by JEOL), measure tetracarboxylic dianhydride in deuterated dimethyl sulfoxide and chemically imidized polyimide powder. 1 H-NMR spectrum. Tetramethylsilane was used ...

Synthetic example 1

[0175] Synthesis of tetraformic dianhydride shown in formula (9)

[0176] (synthesis)

[0177] The synthesis|combination of tetracarboxylic dianhydride (TAHMBP) represented by formula (9) is as follows. 8.8493 g (42.0 mmol) of trimellitic anhydride was added to an eggplant-shaped flask, dissolved in 30 mL of dehydrated tetrahydrofuran (THF) at room temperature, and a septum was sealed to prepare solution A (solute concentration: 24.9% by weight). Then, in another flask, 5.4044g (20.0mmol) of 2,2',3,3',5,5'-hexamethyl-biphenyl-4,4'-diol (HM44BP) was dissolved at room temperature Solution B was prepared by adding 3.9 mL (48 mmol) of pyridine to 38 mL of dehydrated THF (solute concentration: 14.5% by weight), and sealing the septum.

[0178] Cool in an ice bath, slowly add solution B to solution A dropwise with a syringe while stirring, and then stir at room temperature for 24 hours. After the reaction, the white precipitate was filtered off and washed with THF and deionized w...

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Abstract

The present invention addresses the problem of providing: a polyimide which has excellent transparency, high heat resistance and low linear thermal expansion coefficient at the same time, while exhibiting solvent workability (excellent solubility and film formation performance) by means of a low moisture-absorbing solvent; and a method for producing this polyimide. In order to solve the above-mentioned problem, the present invention provides a polyimide that contains a constituent unit represented by formula (1). (In the formula, each R independently represents a hydrogen atom or an alkyl group having 1-6 carbon atoms, provided that at least one of two R groups bonded to a same benzene ring is an alkyl group.)

Description

technical field [0001] This invention relates to polyimides. Background technique [0002] In the fields of liquid crystal displays, organic electroluminescence (EL) displays, and electronic newspapers, etc., electrodes such as transparent electrodes (ITO; Indium Tin Oxide) and thin-film transistors (TFT; Thin-Film Transistor) are formed on glass substrates during the preparation process. and electronic components. In order to form such elements, high heat resistance and excellent dimensional stability (low linear thermal expansion coefficient) are required, and therefore, it is difficult to apply transparent materials other than glass substrates in the prior art. [0003] On the other hand, the demand for weight reduction and flexibility of such displays has increased in recent years, and conventional glass substrates have been difficult to cope with. Therefore, lighter and more flexible resin substrates are attracting attention as substrates replacing glass substrates. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/16C08J5/18
CPCC08G73/1039C08G73/1067C08G73/16C08J5/18C08J2379/08C08L79/08C09D179/08
Inventor 石井淳一长谷川匡俊
Owner HONSHU CHEM INDAL
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