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Waterborne epoxy modified phenolic resin emulsion, preparation method thereof and adhesive prepared by using same as raw material

A phenolic resin emulsion, water-based epoxy technology, used in epoxy resin adhesives, adhesives, aldehyde/ketone condensation polymer adhesives, etc., can solve the problems of high brittleness and low bonding strength, and achieve increased flexibility, low Effects of VOC content and high adhesive properties

Inactive Publication Date: 2015-09-02
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to solve the problems of high brittleness and low bonding strength of the existing water-based phenolic resin emulsion after curing, and provides water-based epoxy modified phenolic resin emulsion, its preparation method and an adhesive prepared from it

Method used

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Examples

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specific Embodiment approach 1

[0017] Specific embodiment one: the water-based epoxy modified phenolic resin emulsion of this embodiment consists of 100 parts by mass of thermosetting phenolic resin, 10 to 30 parts of epoxy resin, 10 to 30 parts of co-solvent, 1 to 10 parts of protective colloid, 1 ~5 parts reactive nonionic emulsifier and 140~170 parts deionized water.

specific Embodiment approach 2

[0018] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the preparation method of the thermosetting phenolic resin is:

[0019] Add phenol and formaldehyde into the reactor at a molar ratio of 1:(1.1~2.0), start stirring, raise the temperature to 80~100°C, add a basic catalyst according to 0.2%~3% of the amount of phenol, and keep the reaction The temperature of the liquid is 80-100°C, react for 2-10 hours to obtain the reactant, then dehydrate the reactant under negative pressure, and when the gel time of the reactant at 150°C reaches 90-600s, lower the reactant to room temperature to obtain Thermosetting phenolic resin; the basic catalyst is barium hydroxide, ammonia water, sodium hydroxide or zinc oxide. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0020] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: the epoxy resin is bisphenol A epoxy resin E-51, bisphenol A epoxy resin E-44, bisphenol A Type epoxy resin E-20, novolac epoxy resin F-51, novolac epoxy resin F-44 or bisphenol S type epoxy resin. Others are the same as in the first or second embodiment.

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Abstract

The invention relates to a waterborne epoxy modified phenolic resin emulsion, a preparation method thereof and an adhesive prepared by using same as a raw material and aims at solving the problem that an existing waterborne epoxy modified phenolic resin emulsion is large in brittleness and low in adhesion strength after being cured. The waterborne epoxy modified phenolic resin emulsion consists of thermosetting phenolic resin, epoxy resin, common solvent, protective colloid, a non-ionic emulsifier and deionized water. The preparation method comprises the steps of solving the thermosetting phenolic resin and the epoxy resin in the common solvent and perform even stirring to obtain a resin solution; solving the protective colloid and the non-ionic emulsifier in the deionized water to obtain an emulsion water solution, mixing the resin solution and the emulsion water solution and performing emulsification and stirring to obtain the waterborne epoxy modified phenolic resin emulsion. The adhesive consists of the waterborne epoxy modified phenolic resin emulsion, a curing agent, an inorganic filler, a coupling agent and an inhabitation corrosive. The waterborne epoxy modified phenolic resin emulsion is small in brittleness and high in adhesion strength after being cured and is used for the field of adhesives.

Description

technical field [0001] The invention relates to a phenolic resin emulsion, its preparation method and an adhesive prepared from it. Background technique [0002] In recent years, with the increasingly urgent requirements for environmental protection, no volatile organic compounds (VOC) or low VOC systems have become the research direction of new materials. Traditional phenolic resin structural adhesives are widely used in friction materials, abrasives, military thermal protection materials, aerospace industry and other fields due to their advantages of high bonding strength, water resistance, heat resistance, and chemical corrosion resistance. However, such products in many applications are mainly solvent-based products, which have environmental protection problems. Therefore, the research on water-based high-performance phenolic resin adhesive is of great significance. [0003] There have been studies on water-based phenolic resin emulsions. Disclosed a kind of preparati...

Claims

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Application Information

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IPC IPC(8): C08L61/10C08L63/00C08J3/03C08J3/24C08G8/10C09J161/10C09J163/00
Inventor 荣立平刘晓辉赵颖李欣张大勇王刚朱金华
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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