Bismuth-plating electroplating liquid and pulse plating method for bismuth thin film

A technology of pulse electroplating and electroplating solution, which is applied in the field of bismuth plating electroplating solution to achieve the effects of stable performance, good stability and long service life

Inactive Publication Date: 2015-10-28
WUXI QIAOYANG MACHINERY MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are almost no reports on the preparation method of bismuth thin films. Therefore, research on the preparation of ...

Method used

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Examples

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Embodiment 1

[0022] A method for preparing a bismuth film by a pulse electroplating process, comprising the following steps:

[0023] a. Prepare electroplating solution, mainly according to bismuth sulfate 40g / L, potassium sodium tartrate 100g / L, sodium citrate 30g / L, antimony potassium tartrate 0.15g / L, sodium gluconate 40g / L, sodium lauryl sulfate 0.008 The composition and content of g / L, stabilizing agent 5ml, get each component, mix with solvent A water, with potassium hydroxide aqueous solution (may percentage concentration can be the potassium hydroxide aqueous solution of 40%, hereinafter the same) adjust the mixed solution The pH value is 7.5-8.5, and the electroplating solution is prepared;

[0024] The stabilizer in the electroplating solution is according to the composition and content of polyethylene glycol 2g / L, vitamin C 2g / L, and sodium hypophosphite 15g / L, and each component is mixed with solvent B water; and the stabilizer is prepared by the following ste...

Embodiment 2

[0028] A method for preparing a bismuth film by a pulse electroplating process, comprising the following steps:

[0029] a, preparation of electroplating solution, mainly according to the composition and content of bismuth sulfate 60g / L, potassium sodium tartrate 130g / L, sodium citrate 35g / L, antimony potassium tartrate 0.18g / L, sodium gluconate 45g / L, stabilizer 6ml , taking each component, mixing with solvent A water, adjusting the pH value of the mixed solution with potassium hydroxide aqueous solution to 8.5-9.5, and preparing the electroplating solution;

[0030] Stabilizer in electroplating solution is according to the composition and content of polyethylene glycol 3.5g / L, vitamin C3.0g / L, sodium hypophosphite 18g / L, gets each component, mixes with solvent B water; And stabilizer passes through It is prepared as follows: Dissolve sodium hypophosphite in water, add vitamin C under stirring; dissolve polyethylene glycol in hot water, then cool to room tempe...

Embodiment 3

[0034] A method for preparing a bismuth film by a pulse electroplating process, comprising the following steps:

[0035] a, preparation of electroplating solution, mainly by bismuth sulfate 80g / L, potassium sodium tartrate 150g / L, sodium citrate 40g / L, sodium gluconate 50g / L, EDTA (disodium ethylenediaminetetraacetic acid) 0.2g / L, The composition and content of stabilizer 7ml, take each component, mix with solvent A water, adjust the pH value of the mixed solution with potassium hydroxide aqueous solution to 9.5-11.5, and prepare the electroplating solution;

[0036] The stabilizer in the electroplating solution is according to the composition and content of polyethylene glycol 5g / L, vitamin C4g / L, and sodium hypophosphite 20g / L, and each component is mixed with solvent B water; and the stabilizer is prepared by the following steps To obtain, dissolve sodium hypophosphite in water, add vitamin C under stirring; dissolve polyethylene glycol in hot water, then co...

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Abstract

The invention discloses a bismuth-plating electroplating liquid and a pulse plating method for a bismuth thin film. The bismuth-plating electroplating liquid comprises components in concentration as follows: 40-80 g/L of bismuth sulfate, 100-150 g/L of sodium potassium tartrate tetrahydrate, 30-40 g/L of sodium citrate, 0.15-0.20 g/L of antimony potassium tartrate or ethylenediamine tetraacetic acid disodium salt, 40-50 g/L of sodium gluconate, 5-7 ml/L of a stabilizer and the balance of a solvent A, wherein the solvent A is water; the stabilizer comprises 2-5 g/L of polyethylene glycol, 2-4 g/L of vitamin C, 15-20 g/L of sodium hypophosphite and the balance of a solvent B which is water. Compared with the prior art, the bismuth-plating electroplating liquid is better in stability and long in service life and has higher dispersion and covering capacity as well as high conduction performance, concentration polarization is reduced due to use of a pulsed power supply, and the current efficiency is improved.

Description

technical field [0001] The invention relates to a bismuth plating electroplating solution, and also relates to a pulse electroplating method for a bismuth thin film. Background technique [0002] The rapid development of pulse electroplating technology in recent years has fully demonstrated the incomparable advantages of many traditional electroplating methods. The pulse electroplating process can make the coating crystallization finer, denser in arrangement, less in pores, and higher in hardness. In view of the above advantages, it is widely used in the electrochemical preparation of various single metal or alloy coating films. [0003] The electroplating solution is divided into cyanide-containing plating solution and cyanide-free plating solution. Among them, the cyanide-containing plating solution is stable and reliable, has high current efficiency, good dispersion ability and covering ability, and the obtained plating layer is crystallized fine and bright, and is widely...

Claims

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Application Information

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IPC IPC(8): C25D3/54C25D5/18
Inventor 沈秋
Owner WUXI QIAOYANG MACHINERY MFG
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