Metal foil laminate

A metal foil and laminate technology, applied in the direction of metal layered products, layered products, synthetic resin layered products, etc., can solve the problems of reduced folding resistance, abnormality, difficulty in obtaining molded products, etc., and achieves excellent flexibility Effect

Active Publication Date: 2015-11-25
TOYOBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, problems such as "chip bump depression" occur due to deformation of the polyimide resin layer at the chip mounting temperature
Or, with fine patterning, there is a problem that the folding resistance is lowered
In addition, due to the miniaturization, weight reduction, and thinning of electronic equipment, when they are assembled into final products, they are mounted in more compact shapes such as U-shaped and U-shaped. The original force) increases, and failures such as abnormalities occur on the joints with final products such as panels
However, the current situation is that it is difficult to obtain a strong molded article with any of the resin compositions, and it is difficult to balance the mountability and the tradeoffs of bending resistance, folding resistance, flexibility, and low resilience.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0257] Under nitrogen flow, 211.3 g (1.10 mol) of trimellitic anhydride, 132.1 g (0.05 mol) of o-tolidine diisocyanate, 125.3 g (0.05 mol) of 4,4'-diphenylmethane diisocyanate, and fluorine were added to the reaction vessel under nitrogen flow. 0.6 g of potassium sulfide and 2500 g of N-methyl-2-pyrrolidone (purity: 99.9%) were heated to 100°C and reacted directly for 5 hours. Then, it was made to react at 130 degreeC for 3 hours, N-methyl-2-pyrrolidone was added to adjust the concentration so that the solution viscosity became 400 dPa·s, and it was cooled to room temperature. The obtained polyamideimide resin (denoted as polyamideimide composition A) was dissolved in a polymerization solvent, and the characteristics of each resin of logarithmic viscosity, acid value, and number average molecular weight are shown in Table 1.

[0258] Then, 24 g of a phenol novolak type epoxy resin (JER154 manufactured by Mitsubishi Chemical Corporation) (6% by mass relative to the total solid con...

Embodiment 2

[0260] Only trimellitic anhydride which is an acid component of Example 1 was changed to 1.02 mol, and it adjusted to the logarithmic viscosity and molecular weight of Table 1 suitably, and the polyamide-imide resin varnish was produced. The polyamideimide resin varnish obtained in Example 2 was all dissolved in the solvent, and the resin characteristics of the resin varnish obtained are shown in Table 1.

[0261] Then, 12 g of a phenol novolak type epoxy resin (JER154 manufactured by Mitsubishi Chemical Corporation) (3% by mass relative to the total solid content) was mixed to produce a casting varnish. Then, the prepared casting varnish was used to produce a metal foil laminate, and a flexible printed wiring board for evaluation of folding resistance, as well as insolubility, Gurley-style bending stiffness (an index of low resilience), and evaluation of mounting properties were produced. Evaluation of the characteristics of each substrate film. The characteristic evaluation re...

Embodiment 3

[0266] Under nitrogen flow, 161.4 g (0.84 moles) of trimellitic anhydride, 50.8 g (0.16 moles) of 3,3',4,4'-benzophenone tetracarboxylic dianhydride, 3,3' were added to the reaction vessel, 4,4'-biphenyltetracarboxylic dianhydride 15.5g (0.05mol), o-tolidine diisocyanate 264.3g (1.00mol), potassium fluoride 0.6g, and N-methyl-2-pyrrolidone (purity 99.9 %) 2230, the temperature was raised to 100°C, and it was directly reacted for 6 hours. Then, it was made to react at 130 degreeC for 4 hours, and N-methyl-2-pyrrolidone was added to adjust the concentration so that the solution viscosity became 300 dPa·s, and it was cooled to room temperature. The obtained polyamideimide resin (denoted as polyamideimide composition B) was dissolved in a solvent, and the resin characteristics of logarithmic viscosity, acid value, and number average molecular weight are shown in Table 1.

[0267] Then, 12 g of a phenol novolak type epoxy resin (JER154 manufactured by Mitsubishi Chemical Corporation)...

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Abstract

To attain simultaneously the prevention of a tip from sinking into a substrate film layer in bonding the tip to metal wiring (namely mountability) and properties which have a trade-off relationship therewith, namely, flex resistance, folding endurance, pliability, and reduction in spring back which is seen as a problem in mounting a circuit board in a bent state or the like. A metal foil laminate composed of a metal foil and a substrate film which is made of a heat-resistant resin composition that comprises a polyimide-based resin crosslinked with an epoxy resin and which is laminated on at least one surface of the metal foil, characterized by satisfying the requirements (a) and (b): (a) when the total amount of the polyimide-based resin and the epoxy resin is taken as 100 mass%, the amount of the epoxy resin is 0.1 to 10 mass%; and (b) the insoluble matter rate of a base film which has been prepared by removing the metal foil from the metal foil laminate is 40% or more as determined by adding N-methyl-2-pyrrolidone to the base film in such an amount as to adjust the base film concentration to 0.5 mass% and heating the resulting mixture at 100ºC for 2 hours.

Description

Technical field [0001] The present invention relates to a metal foil laminate in which a polyimide resin is laminated on at least one surface of a metal foil, and a flexible printed board using the metal foil laminate. In particular, the present invention relates to a metal foil laminate suitable for use as a substrate for Chipon Film (hereinafter referred to as COF) on which electronic components such as IC (Integrated Circuit) or LSI (Large Scale Integrated Circuit) are mounted. Background technique [0002] Generally, polyimide-based resins are widely used as insulating materials for electric and electronic devices due to their excellent heat resistance, insulating properties, chemical resistance, and the like. In particular, it is widely used as a raw material for flexible printed wiring boards, and is widely used in circuit board materials and mounting substrate materials for various electronic equipment, such as liquid crystal displays, plasma displays, organic EL displays,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/088B32B15/08C08G59/40C08G73/14C08L63/00C08L79/08H05K1/03
CPCC08L79/08B32B15/092B32B27/281B32B2457/08C08G59/40C08G73/1067C08G73/14C08L63/00H05K1/032H05K1/0393H05K2201/0154C08G59/4042C08L63/04
Inventor 多田谦太栗田智晴
Owner TOYOBO CO LTD
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