High temperature resistant BAHPFP (2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane) wire enamel and preparation method thereof
A technology of enameled wire paint and high temperature resistance, which is applied in coatings, epoxy resin coatings, polyether coatings, etc., can solve the problems of high price, high cost of polyetherimide resin, and unfavorable large-scale popularization and application.
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Embodiment 1
[0046] Put 73.2 grams (0.2 moles) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP) and 840 grams of N,N-dimethylacetamide into the reactor, stir and dissolve , cooled to below 5°C, added 124.0 grams (0.4 moles) of 3,3',4,4'-tetracarboxydiphenyl ether dianhydride (ODPA), stirred for 2 hours, added 22.6 grams (0.1 moles) of 3,3 '-Dimethyl-4,4' diaminodiphenylmethane, continue to stir for 1 hour, add 660 grams of acetic anhydride and 2.2 grams of triethylamine, heat up to 100°C for dehydration imidization reaction for 2 hours, cool to room temperature Afterwards, add 1680 gram methyl alcohols, stir and separate out solid resin, filter, 840 gram acetone rinses 2-3 time, vacuum-dried 3 hours under 90 ℃, obtained 205.9 gram BAHPFP type containing phenolic hydroxyl polyimide resins (theoretical yield 209.0 gram), denoted as HFPI-1, yield 98.5%.
Embodiment 2
[0048] 73.2 grams (0.2 moles) of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP), 1090 grams of N-methyl-2-pyrrolidone and 1000 grams of N,N-dimethyl Put formamide into the reactor, stir to dissolve, cool to below 5°C, add 186.0 g (0.6 moles) of 3,3',4,4'-tetracarboxydiphenyl ether dianhydride (ODPA), and stir for 1 hour , add 41.0 g (0.1 mol) of 2,2-bis[4-(3-aminophenoxy)phenyl]propane, 20.0 g (0.1 mol) of 3,4'-diaminodiphenyl ether and 29.2 g (0.1 mol) 1,3-bis(3-aminophenoxy)benzene, continue to stir and react for 2 hours, add 2090 grams of acetic anhydride, 4.0 grams of triethylamine and 30.9 grams of lutidine, heat up to 80 ° C to dehydrate imine React for 5 hours, after cooling to room temperature, add 2450 grams of ethanol and 8000 grams of methanol, stir to precipitate solid resin, filter, rinse with 4180 grams of acetone for 2-3 times, and vacuum dry at 90 ° C for 4 hours to obtain 329.1 grams of BAHPFP type The polyimide resin containing phenolic hydroxyl ...
Embodiment 3
[0050] Add 50.0 grams of HFPI-1 BAHPFP type phenolic hydroxyl-containing polyimide resin and 200 grams of N,N-dimethylacetamide into the reaction kettle, heat to reflux, stir and dissolve, cool to below 60°C, and add 2.0 grams Diphenylmethane diisocyanate (MDI) and 2.0 grams of isophorone diisocyanate, heated to reflux, stirred for 1 hour, cooled to below 60 ° C, added 1.5 grams of N,N,N',N'-tetraglycidyl Base-3,3'-dimethyl-4,4'-diaminodiphenylmethane epoxy resin, heated to 80° C. and stirred for 0.5 hour to obtain 255.5 g of component A.
[0051] Add 10.0 grams of polyphenylene ether resin, 10 grams of methyl tetrahydrofuran and 30 grams of xylene into the reaction kettle, heat to reflux, stir and dissolve, cool to below 60 ° C, add 4.0 grams of diphenylmethane diisocyanate (MDI) and 2.0 grams Toluene diisocyanate, heat up to reflux, stir for 1 hour, cool to below 60°C, add 3.5 grams of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy The resin was heated to 80° C. ...
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