Heat-resistant electronic membrane and preparation method thereof

An electronic film, heat-resistant technology, applied in the direction of coating, can solve the problems of difficult to meet engineering technology, high cross-linking density, poor weather resistance and heat and humidity resistance, etc., to achieve good curing effect, good compatibility, compatibility Sex-enhancing effect

Active Publication Date: 2016-01-27
WUJIANG XINTA FORWARD HARDWARE FACTORY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Epoxy resin has excellent adhesion, thermal stability and excellent chemical resistance. As a resin matrix for adhesives, coatings and composite materials, it is widely used in water conservancy, transportation, machinery, electronics, home appliances, automobiles and aerospace However, epoxy

Method used

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  • Heat-resistant electronic membrane and preparation method thereof
  • Heat-resistant electronic membrane and preparation method thereof
  • Heat-resistant electronic membrane and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Mix 9g of di-n-hexylamine and 13g of filler for 1 hour, then add 1.2g of N-formylmorpholine, 10g of N,N-dimethylaniline and 1.8g of sodium iodide, and mix for 2 hours to obtain a mixture; Diepoxide and 6g of 2,6-bis(4-aminophenoxy)benzonitrile were added to the mixture and stirred at 170°C for 5 minutes to obtain a compound; the compound was added to the extruder; then the surface was The polyimide film (thickness is 0.2mm) after the corona treatment passes through the extruder at a speed of 1m / min, and the compound is coated on the treated polyimide film by the extrusion die to prepare the composite polyimide film. Imide film; heat-resistant electronic film obtained after composite polyimide film is formed; thickness is 0.22mm.

Embodiment 2

[0026] Mix 9g of di-n-hexylamine and 14g of filler for 1 hour, then add 1.3g of N-formylmorpholine, 9g of N,N-dimethylaniline and 1.6g of sodium iodide, and mix for 2 hours to obtain a mixture; Diepoxide and 8g of 2,6-bis(4-aminophenoxy)benzonitrile were added to the mixture and stirred at 170°C for 5 minutes to obtain a compound; the compound was added to the extruder; then the surface was The polyimide film after corona treatment passes through the extruder at a speed of 1m / min, and the compound is coated on the treated polyimide film by the extrusion die to prepare a composite polyimide film; The polyimide film is processed to obtain a heat-resistant electronic film.

Embodiment 3

[0028] Mix 9g of di-n-hexylamine and 13g of filler for 1 hour, then add 1.3g of N-formylmorpholine, 9g of N,N-dimethylaniline and 1.8g of sodium iodide, and mix for 2 hours to obtain a mixture; Diepoxide and 8g of 2,6-bis(4-aminophenoxy)benzonitrile were added to the mixture and stirred at 170°C for 5 minutes to obtain a compound; the compound was added to the extruder; then the surface was The polyimide film after corona treatment passes through the extruder at a speed of 1m / min, and the compound is coated on the treated polyimide film by the extrusion die to prepare a composite polyimide film; The polyimide film is processed to obtain a heat-resistant electronic film.

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Abstract

The invention relates to a heat-resistant electronic membrane and a preparation method thereof. The preparation method includes the steps that a mixture of silicon dioxide, ytterbium fluoride, magnesium oxide, calcium carbonate, zirconia and zirconia is subjected to ball milling and calcination, and filler is obtained; amine compound and the filler are mixed for one hour, then N-formyl morpholine, a nitrogen compound and sodium iodide are added and mixed for two hours, and a mixture is obtained; bi-isoprene bicyclo oxide and 2,6-bi-(4-aminophenoxy) cyanobenzene are sequentially added to the mixture and stirred for 5 minutes t the temperature of 170 DEG C, and a compound is obtained; the compound is added to an extruder; then, a polyimide film with the surface subjected to corona treatment passes through the extruder at the speed of 1 m/min, the compound is applied to the polyimide film obtained after treatment through an extrusion die head, and the composite polyimide film is obtained; the heat-resistant electronic membrane is obtained after the composite polyimide film is subjected to forming treatment. The preparation method is wide in raw material source, simple and controllable in preparation process, only conventional operation is needed, and industrialization is facilitated.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to a heat-resistant electronic film and a preparation method thereof. Background technique [0002] Polyimide materials are widely used in wires, cables, petroleum industry, aerospace and other fields due to their excellent high / low temperature resistance, radiation resistance, weather resistance, etc. and excellent electrical properties. In particular, polyimide film is widely used in the connection and support of electronic products due to its good mechanical properties, heat resistance and insulation properties. Due to its own defects, pure polyimide film limits its large-scale application. In order to further improve the application performance of polyimide film, composite film technology is widely used. Composite materials are important basic materials for high-tech fields such as information technology, biotechnology, and energy technology, and for na...

Claims

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Application Information

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IPC IPC(8): C08J7/06C08J3/24C08L79/08
Inventor 杨和荣
Owner WUJIANG XINTA FORWARD HARDWARE FACTORY
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