Three-component acid bright copper plating additive and application thereof in electroplating process and electrolytic copper foil manufacturing process

An electroplating process and electrolytic copper foil technology, which are applied in the technical field of acid bright copper plating and electrolytic copper foil preparation, can solve the problems that dye additives are not resistant to high temperature, gelatin additives are easy to be hydrolyzed and fail, and achieve excellent mechanical properties, easy to control, The effect of uniform and dense coating

Inactive Publication Date: 2016-01-27
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention mainly aims at the existing problems of acidic bright copper plating, and provides a three-component acidic bright copper plating additive, which avoids the problems that dye additives are not resistant to high temperature and gelatin additives are easily hydrolyzed and ineffective.

Method used

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  • Three-component acid bright copper plating additive and application thereof in electroplating process and electrolytic copper foil manufacturing process
  • Three-component acid bright copper plating additive and application thereof in electroplating process and electrolytic copper foil manufacturing process
  • Three-component acid bright copper plating additive and application thereof in electroplating process and electrolytic copper foil manufacturing process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Equipped with basic electrolyte - 1L aqueous solution of copper sulfate and sulfuric acid, in which Cu 2+ 90g / L, H 2 SO 4 100g / L. Add 40 mg chloride ion, 15 mg sodium phenyldithiopropanesulfonate and 40 mg nonylphenol ethoxylate 15 to 1 L of basic electrolyte.

[0030] Control the temperature of the electrolyte at 50°C, the stirring speed is 30r / min, the copper plate is used as the anode, the electroless copper-plated plastic plate is used as the cathode, and the constant current density is 700mA / cm 2 Electroplating for 0.5min. The copper plating on the surface of the plastic plate is bright and flat, and the surface roughness of the coating is Ra=0.14 μm and Rz=1.48 μm measured by a roughness tester; the brightness of the coating is 132Gs when tested by a metal gloss meter.

Embodiment 2

[0032] Equipped with basic electrolyte - 1L aqueous solution of copper sulfate and sulfuric acid, in which Cu 2+ 90g / L, H 2 SO 4 100g / L. Add 50 mg of chloride ion, 10 mg of sodium phenyldithiopropanesulfonate and 30 mg of nonylphenol ethoxylate 40 to 1 L of basic electrolyte.

[0033] Control the temperature of the electrolyte at 55°C, stir at a speed of 30r / min, use titanium as the anode, and use a titanium roller with a diameter of 10cm as the cathode, keep the rotation speed of the titanium roller at 20r / min, and use a constant current density of 750mA / cm 2 Bright copper foil was obtained by electrolysis. In order to intuitively understand the performance of additives, copper foil without additives was prepared under the same electroplating process, and the morphology of the obtained copper foil was observed with a field emission scanning electron microscope. The density is 750mA / cm2 The SEM image of the prepared electrolytic copper foil is as follows figure 1 As shown;...

Embodiment 3

[0036] Equipped with basic electrolyte - 1L aqueous solution of copper sulfate and sulfuric acid, in which Cu 2+ 90g / L, H 2 SO 4 100g / L. Add 50 mg of chloride ion, 10 mg of sodium phenyldithiopropanesulfonate, 20 mg of nonylphenol ethoxylate 10 and 10 mg of nonylphenol ethoxylate 40 into 1 L of basic electrolyte.

[0037] Control the temperature of the electrolyte at 55°C, stir at a speed of 30r / min, use titanium as the anode, and use a titanium roller with a diameter of 10cm as the cathode, keep the rotation speed of the titanium roller at 20r / min, and use a constant current density of 750mA / cm 2 Electrolysis to obtain bright copper foil. The roughness and brightness of the copper foil were tested with a roughness tester and a metal gloss meter respectively, and the tensile strength and elongation of the copper foil were tested with a universal tensile testing machine. The test results are shown in Table 1.

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Abstract

The invention discloses a three-component acid bright copper plating additive and application thereof in an electroplating process and an electrolytic copper foil manufacturing process. The additive is prepared form the following raw materials: 20-100mg/L of chloridion, 5-50mg/L of organic propane sulfonate and 10-80mg/L of alkylphenol polyoxyethylene ether, and is applied to a CuSO4-H2SO4 electrolyte system, wherein Cu<2+> is 70-120g/L; H2SO4 is 80-150g/L; the temperature of a plating solution is kept at 40-70 DEG C; the plating solution is in a stirring state; 600-900mA/cm<2> of current density is exerted to the cathode; the cathode rotating speed is controlled to obtain the bright smooth copper foil with a target thickness. The additive can be applied to high-temperature and high-concentration electrolyte; the production efficiency of the electrolytic copper foil is significantly improved; in addition, the three-component acid bright copper plating additive is simple in component, and convenient to regulate and control; preparation of the copper foils with the brightness from matte to mirror brightness under the condition of smooth surfaces can be ensured; the requirements of different applications are met.

Description

technical field [0001] The invention belongs to the technical field of acidic bright copper plating and the technical field of electrolytic copper foil preparation, and specifically relates to a three-component acidic bright copper plating additive (also called electrolytic copper foil additive when used in the manufacture of electrolytic copper foil) and its application in the electroplating process. And the application in the electrolytic copper foil manufacturing process. Background technique [0002] Copper-clad laminates and printed circuit boards are the most widely used fields of electrolytic copper foil. In addition, electrolytic copper foil has also become the material of choice for lithium-ion negative electrode collectors due to its advantages in conductivity and cost. In recent years, the miniaturization and intelligence of electronic equipment and the development of power batteries and energy storage batteries have urgently required the improvement of the perfor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
Inventor 张震黄金豆朱圣容
Owner SOUTH CHINA UNIV OF TECH
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