Ultrathin copper clad laminate and production method thereof

Abstract

The invention relates to the technical field of copper clad laminates and particularly relates to an ultrathin copper clad laminate suitable for high-frequency and high-speed transmission. The ultrathin copper clad laminate comprises a copper foil, a piece of setting cloth and an insulating layer which is arranged between the copper foil and the setting cloth, wherein the insulating layer is formed by curing resin glue liquid which comprises the following components in parts by weight: 50-100 parts of first epoxy resin, 0-50 parts of second epoxy resin, 1-35 parts of a cross-linking curing agent, 0-5 parts of a cross-linking curing accelerator and 0-100 parts of filler; the first epoxy resin is dicyclopentadienephenol epoxy resin and/or biphenyl epoxy resin; and the second epoxy resin is bisphenol A epoxy resin and/or AF epoxy resin. According to the invention, by adopting the setting cloth, the defects such as warping and instable size frequently occurring in an ultrathin copper clad laminate are solved; the copper clad laminate is produced by pressing the setting cloth and the copper foil coated with the resin glue liquid and has relatively low dielectric constant and causes relatively low dielectric loss; and the invention also relates to a production method of the ultrathin copper clad laminate.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminates, in particular to an ultra-thin copper-clad laminate suitable for high-frequency and high-speed transmission and a manufacturing method thereof. Background technique [0002] Glass fiber (glassfiber or fiberglass), also known as glass filament, is an inorganic non-metallic material with excellent performance, and its components are silica, alumina, calcium oxide, boron oxide, magnesium oxide, sodium oxide, etc. It uses glass balls or waste glass as raw materials to make glass fiber cloth through high-temperature melting, wire drawing, winding, weaving and other processes, and finally forms various products. Among them, the diameter of glass fiber monofilament ranges from several microns to More than 20 microns, which is equivalent to 1 / 20 to 1 / 5 of a hair, and each bundle of fiber precursors consists of hundreds or even thousands of single filaments. Fiberglass cloth is usually used...

AI Technical Summary

Problems solved by technology

[0003] When glass fiber cloth is applied to printed circuit boards, the existing process is to glue and cure the glass fiber cloth to form a bonding sheet, which can be made into a copper clad laminate by covering the bonding sheet with copper foil; process, after sizing and weaving the glass filaments, the glass fiber cloth obtained by desizing and sintering the glass fiber cloth blank, especially the thin glass fiber cloth, has the following defects when it is applied to the printed circuit board: the glass fiber cloth is due to Its own weaving structure, when gluing, the glass fiber in it is easy to suffer from the slight unevenness of the tension, resulting in weft skew phenomenon after gluing the glass fiber cloth, which makes the dimensional stability of the glass fiber cloth after gluing poor. , serious warping and uneven appearance, the above defects have brought great difficulties to the production of PCBs, especially thin PCBs and ultra-fine circuit PCBs; Migration (CAF) performance requires sufficient resin glue filling, which increases the difficulty of making ultra-thin PCB and ultra-fine line PCB

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