Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Ultrathin copper clad laminate and production method thereof

A manufacturing method and technology of copper clad laminates, applied in chemical instruments and methods, lamination auxiliary operations, lamination and other directions, can solve the problems of poor dimensional stability of glass fiber cloth, skewed weft of glass fiber cloth, uneven tension, etc. The effect of smooth view, ensuring product quality and good stability

Active Publication Date: 2016-03-30
GUANGDONG SHENGYI SCI TECH
View PDF6 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When glass fiber cloth is applied to printed circuit boards, the existing process is to glue and cure the glass fiber cloth to form a bonding sheet, which can be made into a copper clad laminate by covering the bonding sheet with copper foil; process, after sizing and weaving the glass filaments, the glass fiber cloth obtained by desizing and sintering the glass fiber cloth blank, especially the thin glass fiber cloth, has the following defects when it is applied to the printed circuit board: the glass fiber cloth is due to Its own weaving structure, when gluing, the glass fiber in it is easy to suffer from the slight unevenness of the tension, resulting in weft skew phenomenon after gluing the glass fiber cloth, which makes the dimensional stability of the glass fiber cloth after gluing poor. , serious warping and uneven appearance, the above defects have brought great difficulties to the production of PCBs, especially thin PCBs and ultra-fine circuit PCBs; Migration (CAF) performance requires sufficient resin glue filling, which increases the difficulty of making ultra-thin PCB and ultra-fine line PCB

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ultrathin copper clad laminate and production method thereof
  • Ultrathin copper clad laminate and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] An ultra-thin copper-clad laminate suitable for high-frequency and high-speed propagation, the manufacturing method of which comprises the following steps:

[0048] First prepare resin glue and copper foil, wherein the resin glue includes: 100 parts of dicyclopentadiene phenol epoxy resin, 10 parts of dicyandiamide, 2 parts of crosslinking curing accelerator, 5 parts of silicon micropowder and Appropriate amount of solvent; the copper foil is 9μm electrolytic copper foil;

[0049] Then make the shaped cloth and resin-coated copper foil: the shaped cloth is made by the first method of making the shaped cloth; the resin glue is coated on the rough surface of the copper foil, dried and semi-cured to obtain a copper-coated Foil resin, wherein the thickness of the resin layer is controlled within the range of 10-70 μm;

[0050] Pressing and curing: the copper foil coating resin and the sizing cloth are pressed together at a temperature of 80-160°C by lamination, and cured. ...

Embodiment 2

[0052] An ultra-thin copper-clad laminate suitable for high-frequency and high-speed transmission, the manufacturing method of which comprises the following steps:

[0053] First prepare resin glue and copper foil, wherein the resin glue includes: 80 parts of mixtures of dicyclopentadiene phenol epoxy resin and biphenyl type epoxy resin, 10 parts of bisphenol A type epoxy resin, 15 parts of imidazole, 20 parts of silicon micropowder and an appropriate amount of solvent; the copper foil is a rolled copper foil of 12 μm;

[0054] Then make the shaped cloth and resin-coated copper foil: the shaped cloth is made by the second method of making the shaped cloth; the resin glue is coated on the rough surface of the copper foil, dried and semi-cured to obtain a copper-coated Foil resin, wherein the thickness of the resin layer is controlled within the range of 10-68 μm;

[0055] Pressing and curing: the copper foil coated resin and the sizing cloth are rolled together at a temperatur...

Embodiment 3

[0057] An ultra-thin copper-clad laminate suitable for high-frequency and high-speed transmission, the manufacturing method of which comprises the following steps:

[0058] First prepare the resin glue and copper foil, wherein the resin glue is calculated in parts by weight, including: 60 parts of dicyclopentadiene phenol epoxy resin, 20 parts of AF type epoxy resin, 15 parts of imidazole, and 30 parts of hollow silica microspheres. part and appropriate amount of solvent; the copper foil is a rolled copper foil of 12 μm;

[0059] Then make the shaped cloth and resin-coated copper foil: the shaped cloth is made by the second method of making the shaped cloth. The resin glue is coated on the rough surface of the copper foil, dried and semi-cured to obtain a copper-coated copper foil. Foil resin, wherein the thickness of the resin layer is controlled within the range of 10-68 μm;

[0060] Pressing and curing: the copper foil coated resin and the sizing cloth are laminated togeth...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to the technical field of copper clad laminates and particularly relates to an ultrathin copper clad laminate suitable for high-frequency and high-speed transmission. The ultrathin copper clad laminate comprises a copper foil, a piece of setting cloth and an insulating layer which is arranged between the copper foil and the setting cloth, wherein the insulating layer is formed by curing resin glue liquid which comprises the following components in parts by weight: 50-100 parts of first epoxy resin, 0-50 parts of second epoxy resin, 1-35 parts of a cross-linking curing agent, 0-5 parts of a cross-linking curing accelerator and 0-100 parts of filler; the first epoxy resin is dicyclopentadienephenol epoxy resin and / or biphenyl epoxy resin; and the second epoxy resin is bisphenol A epoxy resin and / or AF epoxy resin. According to the invention, by adopting the setting cloth, the defects such as warping and instable size frequently occurring in an ultrathin copper clad laminate are solved; the copper clad laminate is produced by pressing the setting cloth and the copper foil coated with the resin glue liquid and has relatively low dielectric constant and causes relatively low dielectric loss; and the invention also relates to a production method of the ultrathin copper clad laminate.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminates, in particular to an ultra-thin copper-clad laminate suitable for high-frequency and high-speed transmission and a manufacturing method thereof. Background technique [0002] Glass fiber (glassfiber or fiberglass), also known as glass filament, is an inorganic non-metallic material with excellent performance, and its components are silica, alumina, calcium oxide, boron oxide, magnesium oxide, sodium oxide, etc. It uses glass balls or waste glass as raw materials to make glass fiber cloth through high-temperature melting, wire drawing, winding, weaving and other processes, and finally forms various products. Among them, the diameter of glass fiber monofilament ranges from several microns to More than 20 microns, which is equivalent to 1 / 20 to 1 / 5 of a hair, and each bundle of fiber precursors consists of hundreds or even thousands of single filaments. Fiberglass cloth is usually used...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/20B32B15/14B32B17/06B32B17/04B32B27/04B32B37/24B32B38/08B32B38/00B32B37/10B32B37/06
CPCB32B15/14B32B15/20B32B17/04B32B17/061B32B37/06B32B37/10B32B37/24B32B38/00B32B38/08B32B2037/243B32B2038/0076B32B2260/021B32B2260/046B32B2262/101
Inventor 胡启彬伍宏奎茹敬宏刘东亮王克峰
Owner GUANGDONG SHENGYI SCI TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com