Silicon wafer cleaning agent and method for preparing same

Abstract

The invention discloses a silicon wafer cleaning agent. The silicon wafer cleaning agent comprises, by weight, 3-9 parts of sodium hydroxide, 2-8 parts of anhydrous sodium carbonate, 3-9 parts of sodium metasilicate, 5-8 parts of ethylene diamine tetraacetic acid, 2-6 parts of sodium diethylhexyl sulfosuccinate, 2-5 parts of OP-10, 4-9 parts of sodium dodecyl benzene sulfonate, 3-9 parts of total-fluorine hexylacetic acid salt surfactants, 2-7 parts of 10-trifluoromethoxy sodium 1-decanesulfonate, 1-4 parts of total-fluorine hexyl ethyl methyl dihydroxy ethyl ammonium iodide, 4-9 parts of Tween-80, 3-6 parts of polyethylene glycol, 1-3 parts of triethanolamine, 2-5 parts of butanol, 1-4 parts of isopropyl alcohol and 10-20 parts of deionized water. The invention further provides a method for preparing the silicon wafer cleaning agent. The silicon wafer cleaning agent and the method have the advantage of excellent cleaning effects.

Description

technical field [0001] The invention relates to a cleaning agent, in particular to a silicon wafer cleaning agent and a preparation method thereof. Background technique [0002] Silicon wafer has good photoelectric effect and is the main material of solar cells. However, in the process of processing, some organic matter often adheres to the surface of the silicon wafer as metal impurities, affecting its working performance and reducing the conversion efficiency of solar energy, so the surface of the silicon wafer must be kept clean. Traditional cleaning agents for silicon wafers use strong corrosive chemical reagents such as strong acids or strong alkalis. A single strong acid or strong alkali cannot achieve a good cleaning effect. Therefore, it is urgent to develop a silicon wafer cleaning agent with excellent cleaning effects. agent to satisfy. Contents of the invention [0003] In order to solve the technical problems existing in the background technology, the present...

AI Technical Summary

Problems solved by technology

However, in the process of processing, some organic substances are often attached to the surface of the silicon wafer as metal impurities to affect its working performance and reduce the conversion efficiency of solar energy, so the surface of the silicon wafer must be kept clean

Traditional cleaning agents for silicon wafers use strong corrosive chemical reagents such as strong acids or strong alkalis. A single strong acid or strong alkali cannot achieve a good cleaning effect. Therefore, it is urgent to develop a silicon wafer cleaning agent with excellent cleaning effects. agent to satisfy