Heat-proof insect preventing modified polyurethane thermal insulation composite board
A thermal insulation composite board and polyurethane technology, which is applied in building components, climate change adaptation, construction, etc., can solve problems such as deformation, general performance of ordinary polyurethane and insufficient production efficiency to meet market needs, and potential safety hazards of external thermal insulation systems for external walls.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0017] A heat-resistant and insect-proof modified polyurethane thermal insulation composite board proposed by the present invention includes a gypsum board layer, a thermal insulation board layer and a cement board layer arranged in sequence from the inside to the outside;
[0018] The raw materials of the insulation board layer include by weight: 100 parts of modified polyurethane, 40 parts of styrene-acrylic emulsion, 20 parts of acrylate, 10 parts of polyvinylidene fluoride resin, 5 parts of silicone resin, 6 parts of microcrystalline stone, light weight 6.5 parts of calcium carbonate, 5 parts of diatomaceous earth, 3 parts of chlorinated paraffin, 4 parts of talcum powder, 2 parts of zeolite, 3 parts of titanium dioxide, 3 parts of talcum powder, 3.5 parts of cellulose powder, 4 parts of magnesium oxide, nano calcium carbonate 6.5 parts, 4 parts of mica powder, 3.5 parts of glass fiber, 3.5 parts of carbon cellulose, 2.5 parts of quicklime, 5 parts of quartz sand, 3 parts o...
Embodiment 2
[0021] A heat-resistant and insect-proof modified polyurethane thermal insulation composite board proposed by the present invention includes a gypsum board layer, a thermal insulation board layer and a cement board layer arranged in sequence from the inside to the outside;
[0022] Among them, the raw materials of the insulation board layer include by weight: 80 parts of modified polyurethane, 60 parts of styrene-acrylic emulsion, 10 parts of acrylate, 15 parts of polyvinylidene fluoride resin, 2 parts of silicone resin, 9 parts of microcrystalline stone, light weight 4 parts of calcium carbonate, 8 parts of diatomaceous earth, 1 part of chlorinated paraffin, 6 parts of talcum powder, 1 part of zeolite, 4 parts of titanium dioxide, 1 part of talc powder, 4 parts of cellulose powder, 2 parts of magnesium oxide, nano calcium carbonate 9 parts, 2 parts of mica powder, 4 parts of glass fiber, 2 parts of carbon cellulose, 4 parts of quicklime, 4 parts of quartz sand, 5 parts of acti...
Embodiment 3
[0025] A heat-resistant and insect-proof modified polyurethane thermal insulation composite board proposed by the present invention includes a gypsum board layer, a thermal insulation board layer and a cement board layer arranged in sequence from the inside to the outside;
[0026] Among them, the raw materials of the insulation board layer include by weight: 120 parts of modified polyurethane, 20 parts of styrene-acrylic emulsion, 30 parts of acrylate, 5 parts of polyvinylidene fluoride resin, 8 parts of silicone resin, 3 parts of microcrystalline stone, light weight 9 parts of calcium carbonate, 2 parts of diatomaceous earth, 5 parts of chlorinated paraffin, 2 parts of talcum powder, 3 parts of zeolite, 2 parts of titanium dioxide, 5 parts of talc powder, 3 parts of cellulose powder, 6 parts of magnesium oxide, nano calcium carbonate 4 parts, 6 parts of mica powder, 3 parts of glass fiber, 5 parts of carbon cellulose, 1 part of quicklime, 6 parts of quartz sand, 1 part of act...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com