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Flotation separation method for copper in waste mobile phone circuit board

A separation method and circuit board technology, applied in flotation, solid separation, solid waste removal, etc., can solve the problems of unsatisfactory metal separation effect and inability to separate, and achieve low cost, low secondary pollution, and recycling. high rate effect

Active Publication Date: 2016-11-09
LANZHOU UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main process of the mechanical physical recycling method includes: dismantling, crushing, and sorting. The sorting process also includes: electric separation, magnetic separation, re-election, flotation and other separation methods. Small or non-differential metals cannot be separated, gravity separation is not ideal for finer particle size metals, they have certain limitations

Method used

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  • Flotation separation method for copper in waste mobile phone circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Remove the surface components of the waste circuit board, crush and sieve the mobile phone circuit board with the surface components removed to obtain a crushed product with a particle size of 0.45-0.30mm; moisten the crushed product with a particle size of 0.30-0.45mm with absolute ethanol to prevent agglomeration, and then Make a slurry with a concentration of 100g / L, and use a flotation machine to go through one roughing, two refining and one sweeping without adding any flotation agent, and separate the metal enrichment. Operating conditions: rotation speed 2000rpm, gas filling rate 100L / h; the obtained metal enrichment is classified first, and metal flotation materials in 4 different particle size ranges are obtained: 0.3mm~0.15mm, 0.15mm~0.125mm, 0.125mm~0.074 mm, -0.074mm, ball mill the metal concentrates of the first three particle sizes to a particle size of 0.074mm and below; the obtained metal concentrates with a particle size of 0.074mm and below are subjected...

Embodiment 2

[0026] Remove the surface components of waste circuit boards, and crush the mobile phone circuit boards from which the surface components have been removed to a particle size of 0.45 mm or below; wet the obtained circuit board crushed products with a particle size of 0.45 mm or below to prevent agglomeration, and prepare a concentration of 150g / L slurry, at room temperature, the amount of No. 2 oil added is 150g / t, using a flotation machine to go through 1 roughing, 3 refining and 1 sweeping to obtain metal enrichment, of which flotation The operating conditions of the machine are: rotating speed 2200rpm, gas filling rate 120L / h; direct ball milling of the obtained metal enrichment to a particle size of 0.15mm and below; manual magnetic separation of the metal enrichment obtained by ball milling with a particle size of 0.15mm and below , and then wet with absolute ethanol to prevent agglomeration, and make a slurry with a concentration of 100g / L, the addition of sodium sulfide ...

Embodiment 3

[0028]Disassemble the used mobile phone to obtain the circuit board, and then remove the surface components of the obtained circuit board, and crush the mobile phone circuit board with the removed surface components to a particle size of 0.45mm or below; the crushed circuit board with a particle size of 0.45mm or below The crushed product is wetted with ethylene glycol to prevent agglomeration, and the pulp concentration is made into a solution of 100g / L. Secondary sweeping and separation to obtain metal enrichment, the operating conditions of the flotation machine are: rotating speed 2500rpm, gas filling rate 80L / h; the obtained metal enrichment is directly ball milled to a particle size of 0.074mm or below; the particle size obtained by ball milling The metal enrichment of 0.074mm and below is subjected to manual magnetic separation, then wetted with ethylene glycol to prevent agglomeration, and made into a pulp solution with a concentration of 100g / L. At room temperature, 15...

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Abstract

The invention discloses a flotation separation method for copper in a waste mobile phone circuit board. The flotation separation method comprises the steps that 1, crushing of the waste mobile phone circuit board is conducted, specifically, the circuit board of a component with a surface component disassembled is crushed with the particle size being 0.45 mm or less, so that metal and nonmetal are completely dissociated; flotation separation of the metal and the nonmetal in a crushed product is conducted, specifically, the crushed product is prepared into slurry, the hydrophilicity difference of the metal and the nonmetal is utilized, an appropriate quantity of foaming agents is added to conduct reverse flotation, and a metal enriched product is obtained; and flotation of copper in the metal enriched product is conducted, specifically, the metal enriched product subjected to ball milling with the particle size being 0.15 mm or less is prepared into slurry, factors such as the slurry concentration, the stirring speed, the aeration quantity and the magnitude of the reagent dosage which affect flotation are adjusted through change of the surface properties of all the matters under the action of flotation reagents, direct flotation is adopted, a copper flotation product is obtained and subjected to elutriation and drying, and the copper is obtained.

Description

technical field [0001] The invention relates to the recycling and reuse technology of electronic waste, in particular to the flotation and separation technology of copper in waste mobile phone circuit boards. Background technique [0002] With the rapid development of electronic information technology, economic growth and the improvement of material living standards, the production, use, update and elimination of mobile phone products are also getting higher and higher. The circuit boards of used mobile phones are a kind of dangerous solid waste. They contain many toxic and harmful substances such as lead, cadmium, arsenic, and polychlorinated biphenyls. , soil, water quality, and human health cause serious harm. For example: lead can damage human digestion, blood, reproduction, and nervous system; arsenic can cause respiratory system, liver, kidney and other functional failures and neuropathy; PCB combustion will produce dioxins, furans and other carcinogenic and teratogen...

Claims

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Application Information

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IPC IPC(8): B03D1/02B03D1/018B03D1/08B09B3/00B03D101/00B03D101/04
CPCB03D1/018B03D1/025B03D1/087B03D2201/005B03D2201/04B09B3/00Y02W30/82
Inventor 刘洪军祁正栋李亚敏
Owner LANZHOU UNIVERSITY OF TECHNOLOGY
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