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High-speed electroless copper plating solution and copper plating process thereof

A technology of electroless copper plating and solution, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of long copper plating time, process bottleneck, complexity of process operation, etc. High copper plating rate, fine and bright crystals

Inactive Publication Date: 2016-11-09
东莞市印和新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in terms of surface treatment of high-speed electroless copper plating, the stability of the chemical solution, the complexity of the process operation, and the lengthy copper plating time in the production process are the bottlenecks of the process.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Embodiment one, a kind of high-speed electroless copper plating solution, comprises the material that following concentration is arranged, specifically:

[0046] Copper chloride dihydrate 10 g / L

[0047] Mixed complexing agent 40 g / L

[0048] Sodium hydroxide 10g / L

[0049] Reductant 5g / L

[0050] Stabilizer 20 mg / L

[0051] Surfactant 20mg / L.

[0052] Among them, the mixed complexing agent is a mixture of two of disodium edetate, triethanolamine, tetrahydroxypropyl ethylenediamine, hydroxyethylidene diphosphoric acid, potassium sodium tartrate or two or more of them The reducing agent is sodium hypophosphite, dimethylamine borane, sodium borohydride, hydrazine, formaldehyde or a mixture of two, and the stabilizer is pyridine, polysulfide, sulfuric acid Potassium, potassium ferrocyanide, and methanol are a mixture of two or more than two of them, and the surfactant is one or two of oligomeric ethylene, sulfides, and fatty acids mixture.

[0053] It should be furt...

Embodiment 2

[0062] Embodiment two, a kind of high-speed electroless copper plating solution, comprises the material of following concentration, specifically:

[0063] Copper chloride dihydrate 20 g / L

[0064] Mixed complexing agent 50 g / L

[0065] Sodium hydroxide 20g / L

[0066] Reductant 10g / L

[0067] Stabilizer 100 mg / L

[0068] Surfactant 50mg / L.

[0069] Among them, the mixed complexing agent is a mixture of two of disodium edetate, triethanolamine, tetrahydroxypropyl ethylenediamine, hydroxyethylidene diphosphoric acid, potassium sodium tartrate or two or more of them The reducing agent is sodium hypophosphite, dimethylamine borane, sodium borohydride, hydrazine, formaldehyde or a mixture of two, and the stabilizer is pyridine, polysulfide, sulfuric acid Potassium, potassium ferrocyanide, and methanol are a mixture of two or more than two of them, and the surfactant is one or two of oligomeric ethylene, sulfides, and fatty acids mixture.

[0070] It should be further pointed ...

Embodiment 3

[0079] Embodiment three, a kind of high-speed electroless copper plating solution, comprises the material of following concentration, specifically:

[0080] Copper chloride dihydrate 5 g / L

[0081] Mixed complexing agent 15 g / L

[0082] Sodium hydroxide 5g / L

[0083] Reductant 2g / L

[0084] Stabilizer 5 mg / L

[0085] Surfactant 2 mg / L.

[0086] Among them, the mixed complexing agent is a mixture of two of disodium edetate, triethanolamine, tetrahydroxypropyl ethylenediamine, hydroxyethylidene diphosphoric acid, potassium sodium tartrate or two or more of them The reducing agent is sodium hypophosphite, dimethylamine borane, sodium borohydride, hydrazine, formaldehyde or a mixture of two, and the stabilizer is pyridine, polysulfide, sulfuric acid Potassium, potassium ferrocyanide, and methanol are a mixture of two or more than two of them, and the surfactant is one or two of oligomeric ethylene, sulfides, and fatty acids mixture.

[0087] It should be further pointed out...

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Abstract

The invention discloses a high-speed electroless copper plating solution and a copper plating process thereof. The high-speed electroless copper plating solution comprises 5-50 g / L of copper chloride dihydrate, 10-80 g / L of mixed complexing agent, 5-20 g / L of sodium hydroxide, 1-15 g / L of reducing agent, 1-200 mg / L of stabilizer and 1-100 mg / L of surface active agent. According to the high-speed electroless copper plating solution, a high copper plating rate, high bath solution stability and high environmental protection property can be maintained, a copper plating layer skin membrane compared to copper electroplating can be provided, the copper plating layer skin membrane is flat, dendritic growth is avoided, crystals are exquisite and bright, moreover, the copper plating production efficiency can be improved, and the copper plating time can be shortened. The copper plating process includes the following steps that a, the high-speed electroless copper plating solution is prepared; b, copper plating pre-treatment is performed; c, soaking in the electroless copper plating solution is performed; and d, cleaning and drying are performed. By means of the copper plating process, copper plating processing can be efficiently achieved through the high-speed electroless copper plating solution.

Description

technical field [0001] The invention relates to the technical field of copper plating, in particular to a high-speed chemical copper plating solution and a copper plating process thereof. Background technique [0002] Due to its unique properties, electroless copper plating is widely used in fields such as electromagnetic shielding, printed circuit boards, radar reflectors, and material surface decoration. [0003] However, in terms of surface treatment of high-speed electroless copper plating, the stability of the chemical solution, the complexity of the process operation, and the lengthy copper plating time in the production process are the bottlenecks of the process. Therefore, it can not only maintain a high copper plating rate, high bath stability, and high environmental protection, but also provide a copper coating film comparable to electroplating copper, a smooth copper coating film, no dendrite growth, and fine and bright crystals. Practitioners' greatest aspiratio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40
CPCC23C18/40
Inventor 蒋春林贺建武丁保美
Owner 东莞市印和新材料科技有限公司
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