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Adhesive for semiconductor diode assembling

A diode and semiconductor technology, applied in the field of adhesives for semiconductor diode assembly, can solve problems such as poor use effect of adhesives, and achieve the effects of improving the temperature adaptation range, simple process method, and excellent high temperature resistance.

Inactive Publication Date: 2016-11-16
王璐
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the installation of semiconductor diodes, adhesives are needed, and the general adhesives are not effective, so it is necessary to improve them.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] The adhesive for semiconductor diode assembly in this embodiment consists of the following components in parts by mass: 14 parts of sodium alkylbenzenesulfonate azobisisobutylcyanide, 16 parts of sodium antimonate, 12 parts of montmorillonite, 10 parts of polycarbonate, 16 parts of dibutyl phthalate, 12 parts of chlorosulfonated polyethylene, 10 parts of trioctyl trimellitate, 16 parts of triethanolamine borate, 12 parts of nano calcium carbonate, six times 10 parts of methyltetramine, 16 parts of zirconia powder, 12 parts of dibasic lead stearate, 12 parts of polyethylene terephthalate, 10 parts of wollastonite powder, 16 parts of pearl powder, methyl silicone resin 12 parts, 10 parts of sodium melamine phosphate, 16 parts of polypropylene, 12 parts of talcum powder, 10 parts of polyethylene glycol, 16 parts of fatty alcohol polyoxyethylene ether, 12 parts of polyvinyl alcohol, 10 parts of sodium ricinoleate, copper oxalate 16 parts, 12 parts of dibasic lead phthalate,...

Embodiment 2

[0022] The adhesive for semiconductor diode assembly in this embodiment consists of the following components in parts by mass: 16 parts of sodium alkylbenzenesulfonate azobisisobutylcyanide, 18 parts of sodium antimonate, 14 parts of montmorillonite, 12 parts of polycarbonate, 18 parts of dibutyl phthalate, 14 parts of chlorosulfonated polyethylene, 12 parts of trioctyl trimellitate, 18 parts of triethanolamine borate, 14 parts of nano calcium carbonate, six times 12 parts of methyltetramine, 18 parts of zirconia powder, 14 parts of dibasic lead stearate, 14 parts of polyethylene terephthalate, 12 parts of wollastonite powder, 18 parts of pearl powder, methyl silicone resin 14 parts, 12 parts of sodium melamine phosphate, 18 parts of polypropylene, 14 parts of talc, 12 parts of polyethylene glycol, 18 parts of fatty alcohol polyoxyethylene ether, 14 parts of polyvinyl alcohol, 12 parts of sodium ricinoleate, copper oxalate 18 parts, 14 parts of dibasic lead phthalate, 14 parts...

Embodiment 3

[0028]The adhesive for semiconductor diode assembly in this embodiment consists of the following components in parts by mass: 18 parts of sodium alkylbenzenesulfonate azobisisobutylcyanide, 20 parts of sodium antimonate, 16 parts of montmorillonite, 14 parts of polycarbonate, 20 parts of dibutyl phthalate, 16 parts of chlorosulfonated polyethylene, 14 parts of trioctyl trimellitate, 20 parts of triethanolamine borate, 16 parts of nano calcium carbonate, six times 14 parts of methyltetramine, 20 parts of zirconia powder, 16 parts of dibasic lead stearate, 16 parts of polyethylene terephthalate, 14 parts of wollastonite powder, 20 parts of pearl powder, methyl silicone resin 16 parts, 14 parts of sodium melamine phosphate, 20 parts of polypropylene, 16 parts of talcum powder, 14 parts of polyethylene glycol, 20 parts of fatty alcohol polyoxyethylene ether, 16 parts of polyvinyl alcohol, 14 parts of sodium ricinoleate, copper oxalate 20 parts, 16 parts of dibasic lead phthalate, ...

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PUM

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Abstract

The invention relates to an adhesive for semiconductor diode assembly, which is composed of the following components: sodium alkylbenzene sulfonate azobisisobutylcyanide, sodium antimonate, montmorillonite, polycarbonate, dibutyl phthalate Ester, chlorosulfonated polyethylene, trioctyl trimellitate, triethanolamine borate, nano calcium carbonate, hexamethylenetetramine, zirconia powder, dibasic lead stearate, polyethylene terephthalate Diethyl formate, wollastonite powder, pearl powder, methyl silicone resin, sodium melamine phosphate, polypropylene, talc, polyethylene glycol, fatty alcohol polyoxyethylene ether, polyvinyl alcohol, sodium ricinoleate, copper oxalate , lead dibasic phthalate, polyamideimide, phosphite, polyvinyl chloride resin. The raw materials used in the present invention have a synergistic effect, which greatly improves the anti-aging performance of the binder and improves the temperature adaptability range of the binder, and the temperature adaptability range is -80-250°C.

Description

technical field [0001] The invention relates to an adhesive for semiconductor diode assembly, which belongs to the technical field of semiconductor diode assembly. Background technique [0002] Semiconductor diodes are also called crystal diodes, or diodes for short. It is an electronic device capable of conducting electricity in one direction. There is a PN junction and two lead terminals inside the semiconductor diode. This electronic device has unidirectional current conductivity according to the direction of the applied voltage. During the installation process of semiconductor diodes, adhesives are needed, and the general adhesives are not effective, so it is necessary to improve them. Contents of the invention [0003] The object of the present invention is to provide an adhesive for assembling semiconductor diodes, so as to better realize the use function of the adhesive for assembling semiconductor diodes. [0004] In order to achieve the above object, the techni...

Claims

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Application Information

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IPC IPC(8): C09J123/12C09J171/02C09J169/00C09J123/34C09J167/02C09J183/04C09J171/08C09J129/04C09J179/08C09J127/06C09J11/04C09J11/06
CPCC09J123/12C08L2203/20C08L2205/02C08L2205/035C09J11/04C09J11/06C09J171/02
Inventor 王璐
Owner 王璐
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