Weather-proof high environment-friendly epoxy resin based heat dissipation powder coating and making method thereof

Abstract

The invention discloses a weather-proof high environment-friendly epoxy resin based heat dissipation powder coating. Bisphenol A and epoxy chloropropane serve as raw materials, carbon nano-tubes serve as heat conducting fillers, modified epoxy resin is obtained by an in-situ polymerization method, so that the carbon nano-tubes and epoxy groups form acting force far higher than Van der Waals force, stress transmission between the carbon nano-tubes and the epoxy groups is facilitated, interface bonding force and consistency between the carbon nano-tubes and the epoxy groups are improved, storage stability of the coating is improved, chitosan, modified assist materials and the like serve as reinforcing fillers and are added, stretching vibration intensity of carbon chlorine bond in composite materials is weakened, binding force of C-Cl (carbon chlorine) atoms and circumference atoms are enhanced, dispersity of components in the coating is improved, so that the carbon nano-tubes sufficiently contact with the coating, actions of extra physical crossing points are played, heat dissipation channels are formed, and heat emission is facilitated. The powder coating is simple in production and use method, free in toxicity, good in environmental protection property, mechanical strength and weather resistance, low in construction cost and high in impact resistance.

Description

Technical field [0001] The invention relates to the technical field of powder coatings, in particular to a weather-resistant and high-environment-friendly epoxy resin-based heat dissipation powder coating and a manufacturing method thereof. Background technique [0002] With the rapid development of modern technology, the high frequency and high speed of electronic devices and the density and miniaturization of integrated circuits have greatly increased the total power density and heat generation of electronic devices per unit volume, thereby making the cooling problem of electronic devices More and more prominent. The cooling capacity that can be achieved by conventional cooling systems is greatly challenged, especially in the fields of energy, automobiles, air-conditioning, agriculture, chemical industry, heating, aerospace, microelectronics, and information, etc., to enhance heat transfer and improve heat dissipation efficiency. Put forward higher requirements. The heat diss...

AI Technical Summary

Problems solved by technology

However, due to the poor dispersion of carbon nanotubes in composite powder coatings and easy agglomeration, when the content of carbon nanotubes continues to increase, the performance of the composite material will deteriorate again, and the composite powder coatings prepared by using the production process and formula in this paper The function is relatively single, and the product structure is single and featureless, which cannot meet the requirements of special environments and needs to be improved