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High-precision circuit and preparation method thereof

A high-precision, circuit technology, applied in printed circuit manufacturing, printed circuits, chemical/electrolytic removal of conductive materials, etc., can solve problems such as large investment and difficulty in large-scale use

Inactive Publication Date: 2017-01-11
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method uses laser interference wiring to form a conductive circuit with high precision, but the line width is affected by the wavelength and energy of the laser, and can only form parallel metal lines with a fixed period. At the same time, the laser spot diameter is relatively high, and it is extremely dependent on laser interference equipment. Accuracy, the higher the accuracy, the greater the investment, it is difficult to use on a large scale

Method used

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  • High-precision circuit and preparation method thereof
  • High-precision circuit and preparation method thereof

Examples

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Effect test

Embodiment 1

[0033]Prepare the dimethylformamide solution of polymethyl methacrylate resin for high-voltage electrospinning, and use the high-voltage electrospinning machine to spin the resin solution on the surface of a PET copper-clad foil board with a thickness of 1 μm. The technical parameters are that the nozzles are relatively The moving speed of the copper foil plate is 800mm / s; the hole diameter of the nozzle is 0.2mm; the temperature at the material bin, pipeline and nozzle is 50°C during operation. The working voltage is 2.75kv; the distance between the nozzle and the copper foil plate is 1mm; after near-field high-voltage electrospinning, an orderly narrow-linewidth anti-etching layer grid can be formed. After heating at 60°C for drying and curing, use an etchant containing copper chloride to restore the bare copper foil to an ionic state and dissolve it in the etching solution. Wash the copper foil surface twice with secondary water, and dry it with hot air at 40°C. Soak the c...

Embodiment 2

[0035] Prepare monomer vinyl acetate for high-voltage electrospinning, and use a high-voltage electrospinning machine to spin the monomer on the surface of silver foil with a thickness of 1 μm. The technical parameters are that the moving speed of the nozzle relative to the silver foil plate is 200mm / s; the aperture of the nozzle It is 0.08mm; the temperature of the material bin, pipeline and nozzle is normal temperature during operation. The working voltage is 2.5kv; the distance between the nozzle and the copper foil plate is 0.6mm; near-field high-voltage electrospinning can form a regular, orderly and controllable narrow line width structure, which is cured by ultraviolet light to form an anti-etching layer. Use an etchant containing potassium monopersulfate to reduce the bare silver foil to an ionic state and dissolve it in the etching solution. Clean the surface of the silver foil three times with secondary water, and dry it with hot air at 80°C. Soak the silver foil wi...

Embodiment 3

[0037] Prepare polyphenylene sulfide resin particles for high-voltage electrospinning, and prepare polyethylene terephthalate metal-clad aluminum foil plates; spray poly(ethylene terephthalate) on the surface of polyethylene terephthalate metal-clad aluminum foil plates through high-voltage electrospinning nozzles Phenylsulfide resin, high-voltage electrospinning technical parameters are: the moving speed of the nozzle relative to the metal foil-clad plate is 100mm / s; the aperture of the nozzle is 0.1mm; the temperature of the material bin, pipeline and nozzle is 180°C during operation. The working voltage is 5kv, and the distance between the nozzle and the metal clad plate is 0.5mm. The polyphenylene sulfide resin forms an anti-etching layer with a narrow line width on the surface of the metal aluminum foil; the metal aluminum foil not covered by the anti-etching layer is reduced with an etchant solution containing sodium persulfate, and dissolved in the solution. Then use se...

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PUM

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Abstract

The invention discloses a method for preparing a high-precision circuit based on the high-voltage electrostatic spinning technique. The method is characterized by forming a refined anti-etching layer through the high-voltage electrostatic spinning technique, and then, through wet chemical etching, obtaining a high-precision circuit. Line width of the high-precision circuit prepared through the method can be controlled to be equal to or smaller than 10 microns, and preparation of a submicron and nanometer scale narrow linewidth circuit can be realized by controlling spray hole size and electrospinning solution; the circuit formed based on common electrostatic spinning is a disordered crisscross circuit; near-field electrostatic spinning has a direct-writing feature and controllability, and finally, a regular and ordered circuit can be formed; and the high-precision circuit has a potential application value in the fields of an integrated circuit plate, a TFT electrode, a touch screen and a transparent conductive film and the like.

Description

technical field [0001] The invention belongs to the technical field of electronic circuit manufacturing, and in particular relates to a method and circuit for preparing high-precision circuits based on high-voltage electrospinning. Background technique [0002] As the functions of electronic products become more and more abundant, the integrated components are showing a trend of becoming smaller and smaller. The improvement of the integration of electronic products and components has put forward higher requirements and requirements for the processing and manufacturing technology and precision of electronic circuits. Challenges, such as applications such as integrated circuit boards, printing and preparation of TFT narrow line width electrodes, peripheral leads of narrow-frame touch screens, and transparent conductive films prepared by grid method, require extremely fine and high-precision circuits. The precision of electronic circuits printed by traditional screen printing t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06
CPCH05K3/06H05K2203/0502H05K2203/1383
Inventor 张兴业王锴宋延林
Owner INST OF CHEM CHINESE ACAD OF SCI
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