High-efficiency environment-friendly LED chip cleaning agent and application method

Abstract

The invention relates to a high-efficiency environment-friendly LED chip cleaning agent and an application method, belonging to the field of electronic cleaning of photoelectron devices. The cleaning agent is prepared from the following components by weight percent: 1 to 10 percent of alkynediols surfactants, 0.1 to 5 percent of fluorocarbon surfactants, 2 to 10 percent of imidazoline ampholytic surfactants, 3 to 20 percent of emulsifiers, 0.5 to 5 percent of corrosion inhibitors, 1 to 5 percent of chelating agents, 1 to 5 percent of solubilizers, and 40 to 91.8 percent of ultrapure water. The cleaning agent contains the alkynediols surfactants, so that the moisturizing capacity is extremely high, and dirt such as polishing wax, grinding cream and the like on the surface of a chip can be rapidly stripped and dissolved. The cleaning agent contains the imidazoliine ampholytic surfactants, so that a layer of molecular film can be formed on the surface of the chip so as to protect the surface of a chip electrode, and to prevent the electrode from being secondarily polluted or corroded. The cleaning agent is mainly used for cleaning residues such as the polishing wax, the grinding cream, organic contaminants, solid particles and the like, on the surface of the polished LED chip, contains no phosphate, and can completely substitute the existing acid pickling process. The cleaning agent is also suitable for cleaning other workpieces.

Description

technical field [0001] The invention relates to a high-efficiency and environment-friendly LED chip cleaning agent and a use method thereof, which belong to the field of electronic cleaning of optoelectronic devices. Background technique [0002] LED chips are the core components of LED lights, and their main function is to convert electrical energy into light energy. The manufacturing process of LED chips includes grinding, polishing, etching, evaporation, cutting, cleaning and other processes. For chips used in device manufacturing and integrated circuit manufacturing, chemical mechanical polishing technology is generally used to smooth the chip surface. In the polishing process of the chip, due to the thin thickness of the chip, the commonly used polishing method is wax polishing. Wax polishing is to completely fix the chip on the substrate, and it is not easy to break during the polishing process. This is the main polishing method at present. After the chip is polishe...

AI Technical Summary

Problems solved by technology

The strong acid cleaning effect is good, but it is harmful to the human body and seriously pollutes the environment. It needs special treatment before it can be discharged.

Chinese Invention Patent Application Publication CN101661869 discloses a gallium arsenide wafer cleaning method after polishing. The main process steps are concentrated sulfuric acid cleaning and strong alkali cleaning, which can effectively clean wax spots, dust, and dirty spots on the wafer surface. The acid and lye used are harmful to the environment and human body, and special treatment is required during the discharge process, which increases the production cost

Chinese Invention Patent Application Publication CN102703238 discloses a wax removal cleaning agent, the main component of which contains a large amount of phosphate, which will cause eutrophication of the water body and cause environmental hazards if discharged into the river water

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