Copper powder and electrically conductive paste, electrically conductive coating, electrically conductive sheet, and antistatic coating using same

A technology of conductivity and copper powder, which is applied in the direction of conductive coatings, conductive materials, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of unsuitable use of metal fillers, increased viscosity of pastes, and inability to disperse uniformly. Achieve excellent uniform dispersion, suppress viscosity increase, and high electrical conductivity

Inactive Publication Date: 2017-02-22
SUMITOMO METAL MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] As mentioned above, when copper powder is used as a metal filler such as conductive paste, electromagnetic wave shielding resin, antistatic paint, etc., in order to ensure high electrical conductivity, although dendritic copper powder is the best, on the other hand, There is also a problem that the dendritic copper powder is entangled with each other to cause aggregation, and cannot be uniformly dispersed in the resin, or the viscosity of the paste increases due to aggregation, which causes problems when forming wiring by printing
[0018] In addition, even for antistatic applications, it is not suitable to use metal fillers from the viewpoint of colorability.
Therefore, there is no copper powder that satisfies opposite characteristics at the same time

Method used

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  • Copper powder and electrically conductive paste, electrically conductive coating, electrically conductive sheet, and antistatic coating using same
  • Copper powder and electrically conductive paste, electrically conductive coating, electrically conductive sheet, and antistatic coating using same
  • Copper powder and electrically conductive paste, electrically conductive coating, electrically conductive sheet, and antistatic coating using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0118] In an electrolytic cell with a capacity of 100L, a titanium electrode plate with an electrode area of ​​200 mm × 200 mm is used as a cathode, and a copper electrode plate with an electrode area of ​​200 mm × 200 mm is used as an anode. Enter the electrolyte, connect it with direct current, and make the copper powder precipitate on the cathode plate.

[0119] At this time, as the electrolytic solution, an electrolytic solution having a composition having a copper ion concentration of 10 g / L and a sulfuric acid concentration of 100 g / L was used. In addition, polyethylene glycol (PEG) with a molecular weight of 400 (manufactured by Wako Pure Chemical Industries, Ltd.) was added as an additive to the electrolytic solution so that its concentration in the electrolytic solution became 500 mg / L, and further, hydrochloric acid was added A solution (manufactured by Wako Pure Chemical Industries, Ltd.) was prepared so that the concentration of chloride ions (chloride ions) was 50...

Embodiment 2

[0125] In the electrolytic solution, PEG with a molecular weight of 400 was added as an additive so that the concentration became 1000 mg / L, and furthermore, a hydrochloric acid solution was added so that the concentration of chloride ions became 50 mg / L. 1 The same conditions cause copper powder to precipitate on the cathode plate.

[0126] The shape of the obtained electrolytic copper powder was observed by the method based on the scanning electron microscope (SEM). As a result, the deposited copper powder formed a dendritic shape in which elliptical copper particles were aggregated. The elliptical copper particles are elliptical copper particles having a diameter of 0.2 μm to 0.5 μm and an average value of 0.32 μm, and a length of 0.5 μm to 2.0 μm and an average value of 1.4 μm. In addition, the crystallite diameter of the elliptical copper particles is

[0127] In addition, the average particle diameter of the dendritic copper powder formed by aggregating the elliptical...

Embodiment 3

[0129] so that the current density of the cathode becomes 10A / dm 2 In addition, the same conditions as in Example 1 were used to deposit copper powder on the cathode plate.

[0130] Observation of the shape of the obtained electrolytic copper powder by the method based on the above-mentioned scanning electron microscope (SEM) revealed that the precipitated copper powder had a dendritic shape in which elliptical copper particles were aggregated. The copper particles are elliptical copper particles having a diameter of 0.2 μm to 0.5 μm and an average value of 0.48 μm, and a length of 0.5 μm to 2.0 μm and an average value of 1.8 μm. In addition, the crystallite diameter of the elliptical copper particles is

[0131] In addition, the average particle diameter of the dendritic copper powder formed by aggregating the elliptical copper particles was 18.2 μm. In addition, it was confirmed that the dendritic copper powder having a thickness (diameter) of the dendritic portion of 0....

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Abstract

To provide a copper powder exhibiting a high electric conductivity suitable for a metallic filler used in an electrically conductive paste, a resin for electromagnetic shielding, an antistatic coating, etc., and having excellent uniform dispersibility required for forming a paste so as to inhibit an increase in viscosity due to flocculation. This copper powder 1 forms a branch shape having a plurality of branches through the conglomeration of copper particles 2. The copper particles 2 have a spheroidal shape, with diameters ranging from 0.2 -0.5 [mu]m, inclusive, and lengths ranging from 0.5 -2.0 [mu]m, inclusive. The average particle diameter (D50) of the copper powder 1 in which the spheroidal copper particles 2 have conglomerated is 5.0 -20 [mu]m. By mixing this tree-branch-shaped copper powder 1 into a resin, it is possible to produce an electrically conductive paste, etc., exhibiting excellent electric conductivity, for example.

Description

technical field [0001] The present invention relates to a copper powder, and more specifically, the present invention relates to a novel dendritic copper powder composed of aggregates of fine copper particles having a single crystal structure, by using the copper powder as a conductive paste and other materials, which can improve the conductivity. Background technique [0002] When forming wiring layers, electrodes, etc. in electronic devices, pastes using metal fillers such as silver powder and copper powder, such as resin-type pastes and firing-type pastes, are often used. [0003] Silver and copper metal filler pastes are coated or printed on various substrates of electronic equipment, and then subjected to heat curing and heat firing to form conductive films constituting wiring layers, electrodes, and the like. [0004] For example, resin-type conductive paste is composed of metal filler, resin, curing agent, solvent, etc., printed on the conductor circuit pattern or te...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/00C09C1/02C09D5/24C09D201/00C25C5/02H01B1/00H01B1/22H01B5/00B22F1/052B22F1/06C09D7/61
CPCB22F1/00C09D5/24C09C1/02C09D201/00C25C5/02H01B1/22H01B5/00H01B1/026C09D7/68C09D7/70C09D7/61B22F1/052B22F1/06B22F2301/10B22F2304/10C08K7/00C08K2201/001C08K2201/005C09D5/32C09D161/06H05K9/0081
Inventor 冈田浩山下雄
Owner SUMITOMO METAL MINING CO LTD
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