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Modified nanometer SiO2 reinforced and toughened PBT (polybutylece terephthalate) high-heat-conduction flame retardant plastic for LED (light emitting diode) and preparation method of flame retardant plastic

A nano-silica, strengthening and toughening technology, applied in the field of composite materials, can solve the problems of insufficient thermal conductivity and lack of flame retardancy, and achieve the effects of good mechanical properties, high phosphorus content, and excellent thermal conductivity

Inactive Publication Date: 2017-05-10
铜陵市铜峰光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In her master's thesis "Research on Thermally Conductive Plastics for LED Lamps", Ma Jieling used polybutylene terephthalate (PBT) as the matrix, magnesium oxide and boron nitride as thermally conductive fillers, and ethylene-vinyl acetate copolymer. Reinforced and toughened with EVA and glass fibers, and prepared a thermally conductive composite material using a twin-screw extruder, which improves the thermal conductivity and mechanical properties of the thermally conductive composite material, but has insufficient thermal conductivity and does not have flame retardancy. performance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0022] A modified nano-silica reinforced and toughened PBT high thermal conductivity flame-retardant plastic for LEDs, prepared from the following raw materials in parts by weight (g):

[0023] Magnesium oxide 7, boron nitride 8, PBT 25, EVA 10, glass fiber 9, 107 glue 2, dibutyltin dilaurate 3, ethyl orthosilicate 1, melamine cyanurate 3, zinc borate 2, hypophosphorous acid Aluminum 4, Bamboo Charcoal 1, Nano SiO 2 5. Dihydroxybutyl tin chloride 1, graphene oxide 4, carbon fiber 10, KH550 1, tetraoctyl ammonium bromide 3, isocyanate propyl triethoxysilane 3, ethanol, acetone, NaOH solution, distilled water, distilled water Appropriate amount of toluene.

[0024] A method for preparing modified nano-silica reinforced and toughened PBT high thermal conductivity flame-retardant plastics for LEDs, characterized in that the steps are as follows:

[0025] a. Mix KH550 with ethanol, heat it in a water bath to 80-90°C, add magnesium oxide and boron nitride, stir for 30 minutes, tak...

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PUM

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Abstract

The invention discloses a modified nanometer SiO2 reinforced and toughened PBT (polybutylece terephthalate) high-heat-conduction flame retardant plastic for LEDs (light emitting diodes) and a preparation process of the plastic. The plastic is characterized by being prepared by using magnesium oxide, boron nitride, PBT, EVA, glass fiber, 107 glue, dibutyltin dilaurate, ethyl orthosilicate, melamine cyanurate, zinc borate, aluminum hypophosphite, bamboo charcoal, nanometer SiO2, butyltin chloride dihydroxide, graphene oxide, carbon fiber, tetra-n-octylammonium bromide, 3-isocyanatopropyltriethoxysilane and the like as raw materials. Heat conduction silicone rubber subjected to KH550 surface treatment is prepared; the nanometer SiO2 is used for performing reinforcing and toughening treatment on the PBT by using the butyltin chloride dihydroxide as a catalyst; the aluminum hypophosphite and the melamine cyanurate are used for preparing a composite flame retardant; the modified nanometer SiO2 reinforced and toughened PBT high-heat-conduction flame retardant plastic for the LED is obtained.

Description

technical field [0001] The invention relates to the field of composite materials, in particular to a modified nano-silicon dioxide-reinforced and toughened PBT high-thermal-conduction flame-retardant plastic for LEDs, and a preparation process thereof. Background technique [0002] As an excellent photoelectric device, LED has the advantages of small size, long life, low-carbon environmental protection, energy saving and stability, etc. It is expected to become a new generation of ideal general lighting sources in the next few years. With the development of LED to high light intensity and high power, its heat dissipation problem is becoming more and more prominent, which seriously affects the light output characteristics of LED and the life of the device, and has become a key problem that must be solved for high-power LED packaging. As a housing for LED lamps, thermally conductive composite materials have the advantages of light weight, easy processing and molding, and low c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L67/02C08L23/08C08L83/06C08K13/06C08K9/06C08K9/04C08K3/36C08K5/3492C08K3/38C08K3/32C08K3/04C08K7/06C09K5/14
CPCC08K2201/011C08K2201/014C08L67/02C08L2201/02C08L2203/20C08L2205/03C09K5/14C08L23/0853C08L83/06C08K13/06C08K9/06C08K9/04C08K3/36C08K5/34928C08K2003/387C08K2003/385C08K3/32C08K3/04C08K7/06
Inventor 安东升郭昊夏金鑫肖建平赖存发
Owner 铜陵市铜峰光电科技有限公司
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