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Epoxy resin pouring sealant with excellent mechanical properties

A technology of epoxy resin and fluoroepoxy resin, applied in the direction of epoxy resin glue, novolac epoxy resin adhesive, adhesive, etc., can solve the problems of poor impact toughness, insufficient heat resistance, and poor mechanical properties and other problems, to achieve the effect of fast curing speed, smooth surface and small shrinkage

Inactive Publication Date: 2017-05-10
安徽浩丰特种电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, pure epoxy resin has a high cross-linked structure, so it has disadvantages such as brittleness, fatigue, poor heat resistance, and poor impact toughness. However, the existing epoxy resin potting adhesives have poor mechanical properties, poor impregnation, and short storage time, which need to be solved urgently.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] An epoxy resin potting glue with excellent mechanical properties, its raw materials include by weight: 40 parts of phenolic modified epoxy resin, 10 parts of organic fluorine epoxy resin, 35 parts of E-44 epoxy resin, modified cotton 20 parts of short fiber, 8 parts of attapulgite, 5 parts of carboxy-terminated nitrile rubber, 3 parts of epoxidized SBS, 1 part of trimethylhexamethylenediamine, 2 parts of polyether diamine, 1 part of triethanolamine, hydroxypropyl 4 parts of cellulose, 20 parts of diglycidyl ether.

Embodiment 2

[0018] An epoxy resin potting glue with excellent mechanical properties, its raw materials include by weight: 20 parts of phenolic modified epoxy resin, 20 parts of organic fluorine epoxy resin, 25 parts of E-44 epoxy resin, modified cotton 30 parts of short fiber, 2 parts of attapulgite, 15 parts of carboxy-terminated nitrile rubber, 1 part of epoxidized SBS, 3 parts of trimethylhexamethylene diamine, 1 part of polyether diamine, 2 parts of triethanolamine, hydroxypropyl 2 parts of cellulose, 50 parts of diglycidyl ether.

Embodiment 3

[0020] An epoxy resin potting glue with excellent mechanical properties, its raw materials include by weight: 34 parts of phenolic modified epoxy resin, 14 parts of organic fluorine epoxy resin, 32 parts of E-44 epoxy resin, modified cotton 26 parts of short fiber, 6 parts of attapulgite, 10 parts of carboxy-terminated nitrile rubber, 2.2 parts of epoxidized SBS, 1.5 parts of trimethylhexamethylene diamine, 1.6 parts of polyether diamine, 1.2 parts of triethanolamine, hydroxypropyl 3.2 parts of cellulose, 30 parts of diglycidyl ether.

[0021] The modified cotton staple fiber is prepared by the following process: 5 parts by weight of N, N, N-trimethyl chitosan are dissolved in 30 parts of 2.6% acetic acid solution, and 1 part of 0.6% acetic acid solution is added dropwise under stirring. mol / L silver nitrate solution, continue to stir for 5 minutes after the dropwise addition, add 2 parts of sodium borohydride solution with a concentration of 0.3mol / L dropwise, continue to sti...

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PUM

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Abstract

The present invention discloses an epoxy resin pouring sealant with excellent mechanical properties. The pouring sealant comprises, by weight, 20-40 parts of phenol aldehyde modified epoxy resin, 10-20 parts of organic fluorine epoxy resin, 25-35 parts of E-44 epoxy resin, 20-30 parts of modified short cotton fiber, 2-8 parts of attapulgite clay, 5-15 parts of carboxyl-terminated nitrile rubber, 1-3 parts of epoxidized SBS, 1-3 parts of trimethyl hexamethylenediamine, 1-2 parts of polyethenoxyamine, 1-2 parts of triethanolamine, 2-4 parts of hydroxypropyl cellulose, 20-50 parts of diglycidyl ether. The epoxy resin pouring sealant has the advantages of good mechanical properties and permeability, and can be stored for a long period.

Description

technical field [0001] The invention relates to the technical field of epoxy resin potting glue, in particular to an epoxy resin potting glue with excellent mechanical properties. Background technique [0002] Epoxy resin is a thermosetting resin with excellent chemical stability and corrosion resistance. It has good bonding performance, high mechanical strength, and strong electrical insulation. It has been widely used in industry, especially in electronic devices and transformers. It is widely used in the pouring and packaging of devices and other devices. However, pure epoxy resin has a high cross-linked structure, so it has disadvantages such as brittleness, fatigue, poor heat resistance, and poor impact toughness. However, the existing epoxy resin potting adhesives have poor mechanical properties, poor impregnation, and short storage time, which need to be solved urgently. Contents of the invention [0003] The invention provides an epoxy resin potting glue with exc...

Claims

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Application Information

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IPC IPC(8): C09J163/04C09J163/00C09J113/00C09J153/02C09J101/28C09J101/02C09J11/04C09J11/06
CPCC09J163/04C08K2201/011C08L2201/08C08L2205/02C08L2205/025C08L2205/035C08L2205/16C09J11/04C09J11/06C09J163/00C08L63/00C08L13/00C08L53/025C08L1/284C08L1/02C08K9/12C08K2003/0806C08K3/346C08L63/04
Inventor 凡来权
Owner 安徽浩丰特种电子材料有限公司
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