Sheet-shaped aluminium oxide-containing aluminium-based dielectric paste and preparation method therefor

A flake alumina, dielectric slurry technology, applied in the direction of metal oxides, electrical components, insulators, etc., can solve the problems of high density of stainless steel substrates, poor machinability, large thermal expansion coefficient of metal aluminum, etc. The effect of corrosion performance, good insulation performance and high breakdown voltage

Inactive Publication Date: 2017-05-31
DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As the substrate of high-power electric heating elements, traditional ceramic materials can no longer meet the heat transfer and heat dissipation requirements of existing electric heating elements, and the ceramic substrate is brittle and has poor machining performance, which is not conducive to large-area printing, cutting and installation.
[0004] In addition, the stainless steel substrate has the advantages of good mechanical properties and good impact resistance, and is increasingly used in thick-film high-power heating elements; however, the high density of stainless steel substrates is not conducive to lightweight products; stainless steel thick-film circuit components High firing temperature is not conducive to energy saving and emission reduction
[0005] The aluminum substrate has the advantages of light weight, better thermal conductivity than stainless steel, and easy processing. It is very suitable for use as a high-power thick-film circuit substrate, which can expand the application field of high-power thick-film heating; but the thermal expansion coefficient of metal aluminum is large. It does not match the currently commonly used thick-film electronic paste, and the melting point of aluminum is only about 660°C. The traditional high-temperature sintering process is not suitable for aluminum substrates

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Embodiment 1, an aluminum-based dielectric slurry containing flaky alumina, including the following materials by mass, specifically:

[0029] Low melting point glass powder 50%

[0030] Flaky alumina powder 10%

[0031] Organic Vehicle 37%

[0032] Colorant 3%.

[0033] Among them, the low melting point glass powder is made of Li 2 CO 3 、K 2 CO 3 , Rb 2 CO 3 , ZnO, SiO 2 、 Bi 2 o 3 , B 2 o 3 , CaO, BaO, SrO, V 2 o 5 ,P 2 o 5 、TiO 2 , Sb 2 o 3 Composition, its mass parts are: 15%, 1%, 1%, 18%, 43%, 3%, 2%, 2%, 1%, 1%, 3%, 1%, 8%, 1%.

[0034] Among them, the particle size of the flaky alumina powder is 0.5-10 μm, and the diameter-thickness ratio is 4:1-20:1.

[0035] In addition, the organic carrier includes the following materials by mass, specifically:

[0036] Ethyl cellulose 5%

[0037] Terpineol 20%

[0038] Butyl Carbitol 20%

[0039] Butyl Carbitol Acetate 35%

[0040] Tributyl Citrate 3%

[0041] 1,4-Butyrolactone 5%

[0042] Hydrogena...

Embodiment 2

[0050] Embodiment 2, an aluminum-based dielectric slurry containing flaky alumina, including the following materials by mass, specifically:

[0051] Low melting point glass powder 50%

[0052] Flaky alumina powder 14%

[0053] Organic Vehicle 33%

[0054] Colorant 3%.

[0055] Among them, the low melting point glass powder is made of Li 2 CO 3 、K 2 CO 3 , Rb 2 CO 3 , ZnO, SiO 2 、 Bi 2 o 3 , B 2 o 3 , CaO, BaO, SrO, V 2 o 5 ,P 2 o 5 、TiO 2 , Sb 2 o 3 Composition, its mass parts are: 15%, 1%, 1%, 18%, 43%, 3%, 2%, 2%, 1%, 1%, 3%, 1%, 8%, 1%.

[0056] Among them, the particle size of the flaky alumina powder is 0.5-10 μm, and the diameter-thickness ratio is 4:1-20:1.

[0057] In addition, the organic carrier includes the following materials by mass, specifically:

[0058] Ethyl cellulose 5%

[0059] Terpineol 20%

[0060] Butyl Carbitol 20%

[0061] Butyl Carbitol Acetate 35%

[0062] Tributyl Citrate 3%

[0063] 1,4-Butyrolactone 5%

[0064] Hydrogena...

Embodiment 3

[0072] Embodiment 3, an aluminum-based dielectric slurry containing flaky alumina, including the following materials by mass, specifically:

[0073] Low melting point glass powder 50%

[0074] Flaky alumina powder 18%

[0075] Organic vehicle 32%.

[0076] Among them, the low melting point glass powder is made of Li 2 CO 3 、K 2 CO 3 , Rb 2 CO 3 , ZnO, SiO 2 、 Bi 2 o 3 , B 2 o 3 , CaO, BaO, SrO, V 2 o 5 ,P 2 o 5 、TiO 2 , Sb 2 o 3 Composition, its mass parts are: 15%, 1%, 1%, 20%, 45%, 2%, 3%, 1%, 2%, 1%, 3%, 1%, 4%, 1%.

[0077] Among them, the particle size of the flaky alumina powder is 0.5-10 μm, and the diameter-thickness ratio is 4:1-20:1.

[0078] In addition, the organic carrier includes the following materials by mass, specifically:

[0079] Ethyl cellulose 7%

[0080] Terpineol 20%

[0081] Butyl Carbitol 30%

[0082] Butyl Carbitol Acetate 30%

[0083] Tributyl Citrate 7%

[0084] 1,4-Butyrolactone 4%

[0085] Hydrogenated castor oil 1%

[...

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Abstract

The invention discloses sheet-shaped aluminium oxide-containing aluminium-based dielectric paste and a preparation method therefor. The aluminium-based dielectric paste comprises the following components based on mass percentages: 40-70% of low-melting-point glass powder, 0-30% (not including 0) of sheet-shaped aluminium oxide powder, 20-40% of organic carrier and 0-3% of coloring agent. The aluminium-based dielectric paste has the following advantages: 1, the thermal expansion coefficient of low-melting-point glass is greater than 16*10<-6>m/K, so that an aluminum substrate can be well matched; the melting point of the low-melting-point glass powder is less than 600 DEG C, so that the low-melting-point glass powder can be sintered at an aluminium melting point; 2, by virtue of the addition of the sheet-shaped aluminium oxide powder, corrosion resistance, oxidization resistance, thermal resistance, heat-conducting property and electrical insulating performance of the dielectric layer are effectively improved; and 3, an insulating dielectric layer prepared from the insulating dielectric paste and the metal aluminium substrate are high in binding force, breakdown voltage and insulating property. The preparation method comprises the steps of preparing the low-melting-point glass powder, preparing the organic carrier and prepparing the dielectric paste.

Description

technical field [0001] The invention relates to the technical field of insulating dielectric paste and insulating encapsulating paste for thick-film circuits, in particular to an aluminum-based dielectric paste containing flaky alumina and a preparation method thereof. Background technique [0002] The insulating dielectric paste is mainly attached to the surface of the metal substrate to insulate the thick film circuit from the metal substrate; the encapsulation dielectric paste is mainly to encapsulate the printed and sintered thick film circuit to prevent the harmful influence of the external environment and It plays the role of making the thick film circuit have stable electrical performance, avoiding the erosion of harmful substances from the outside, preventing mechanical damage and forming an insulating layer with other conductors. [0003] Thick film technology is to apply materials such as insulating dielectric paste, resistor paste, electrode paste and encapsulatio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B3/10H01B19/00
CPCH01B3/10H01B19/00
Inventor 徐方星苏冠贤高丽萍
Owner DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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