Heat-conducting silicone rubber composite material and preparation method thereof

A technology of heat-conducting silicone rubber and composite materials, which is applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of limited amount of heat-conducting fillers, complex processing procedures, affecting the thermal conductivity of materials, etc., and achieve effective dispersion and excellent mechanical properties. Performance, the effect of improving thermal conductivity

Active Publication Date: 2017-06-09
SIIICO TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of unfilled silicone rubber is very poor, and the thermal conductivity is generally only 0.165 W/(m﹐K). It can be improved by filling thermal conductive materials (aluminum trioxide, aluminum nitride, boron nitride, etc.). Some solutions to improve the thermal conductivity of silicone rubber are basically adding thermal conductive fillers to the silicone rubber matrix to achieve the purpose of improving thermal conductivity. The existing problems are: (1) The viscosity of the resin polymer used is relatively high, and the viscosity is greater after adding fillers ; (2) The filler is prone to agglomeration and settlement, and the amount of thermally conductive filler added is limited, which affects the improvement of the therm

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] The following weight percentages are taken for each material: 36% silicone rubber matrix (TPSIV3040, Shore hardness A 50), 60% alumina thermal conductive powder (a-alumina > 95%, average particle size 10μm), 2% silicone oil (500mPa. S, 25°C), 1% vulcanizing agent, 1% coupling agent, add to the mixer in turn for pre-mixing and stirring, the mixing temperature is 30°C, the speed of the mixer is 500 rpm, and the mixing time is 5 minutes;

[0043] Put the pre-mixed materials into the elongational rheological plastic extrusion equipment for extrusion and granulation. During extrusion, the processing temperature of each section of the elongational rheological plastic extrusion equipment is set to 200°C for the first section and 220°C for the second section. ℃, the third section is 220℃, the die head temperature is 215℃, the length-to-diameter ratio of the rotor is 22, the rotor speed is 100 rpm, the feeder speed is 30 rpm, and the strands are granulated through water.

[0044...

Embodiment 2

[0046] The following weight percentages are taken for each material: 36% silicone rubber matrix (TPSIV3040, Shore hardness A 60), 60% magnesium oxide thermal conductive powder (content > 99%, average particle size 40μm), 2% silicone oil (500mPa.S, 25 ℃), 1% vulcanizing agent, 1% coupling agent, add to the mixer in turn for pre-mixing and stirring, the mixing temperature is 30 ℃, the speed of the mixer is 500 rpm, and the mixing time is 5 minutes;

[0047]Put the pre-mixed materials into the elongational rheological plastic extrusion equipment for extrusion and granulation. During extrusion, the processing temperature of each section of the elongational rheological plastic extrusion equipment is set to 200°C for the first section and 220°C for the second section. ℃, the third section is 220℃, the die head temperature is 215℃, the length-to-diameter ratio of the rotor is 22, the rotor speed is 100 rpm, the feeder speed is 30 rpm, and the strands are granulated through water.

[...

Embodiment 3

[0050] The following weight percentages are taken for each material: 36% silicone rubber matrix (TPSIV3451, Shore A hardness 80), 60% zinc oxide thermal conductive powder (content > 99%, average particle size 60μm), 2% silicone oil (500mPa.S, 25 ℃), 1% vulcanizing agent, 1% coupling agent, add to the mixer in turn for pre-mixing and stirring, the mixing temperature is 30 ℃, the speed of the mixer is 500 rpm, and the mixing time is 5 minutes;

[0051] Put the pre-mixed materials into the elongational rheological plastic extrusion equipment for extrusion and granulation. During extrusion, the processing temperature of each section of the elongational rheological plastic extrusion equipment is set to 200°C for the first section and 220°C for the second section. ℃, the third section is 220℃, the die head temperature is 215℃, the length-to-diameter ratio of the rotor is 22, the rotor speed is 100 rpm, the feeder speed is 30 rpm, and the strands are granulated through water.

[0052...

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Abstract

The invention relates to a heat-conducting silicone rubber composite material and a preparation method thereof. The heat-conducting silicone rubber composite material comprises, by weight, 20-80 parts of silicone rubber matrix, 20-80 parts of inorganic heat-conducting powder, 0.5-5 parts of silicone oil, 0.2-2 parts of cross-linking agent and 0.2-2 parts of coupling agent. The preparation method includes: 1, premixing: adding the silicone rubber matrix, the inorganic heat-conducting powder after being pretreated and auxiliaries like the cross-linking agent into a highly-mixing machine for premixing; 2, extruding and granulating: adding premixed materials into extensional rheological plasticizing and extruding equipment for extruding and granulating, wherein temperature of the extensional rheological plasticizing and extruding equipment at each stage of extrusion is 150-250 DEG C, rotating speed of a rotor is 10-150rpm, and rotating speed of a feeder is 10-100rpm. By the preparation method, the injection-molding-grade heat-conducting silicone rubber composite material which is high in heat conductivity and excellent in mechanical performance can be prepared to be widely applied in the heat-radiating field of electronic appliances, space flight and aviation and military industry.

Description

technical field [0001] The invention relates to the field of thermally conductive polymer composite materials, in particular to a high thermally conductive injection molding grade composite material and a preparation method thereof. Background technique [0002] With the development of modern electronics industry, information industry and high-tech, especially the rapid development of microelectronics integration technology, the problem of heat dissipation of devices has become increasingly important. High thermal conductivity composite materials can not only provide safe and reliable heat dissipation channels for electronic components, but also play the role of insulation, shock absorption, moisture resistance and corrosion resistance. The thermal conduction path formed by thermal conductive fillers in thermal conductive composite materials greatly affects the composite material thermal conductivity. [0003] Silicone rubber is a kind of special synthetic rubber, which is ...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08L83/07C08K9/00C08K3/22C08K5/14C08K5/5425C08K5/544C08K3/28C08K3/38C08K3/34C09K5/14B29C47/40B29C47/92B29B9/06B29C48/92
CPCC09K5/14C08L83/04B29B9/06B29C48/40B29C48/92B29C2948/92704C08L2205/025C08K2201/003C08K9/00C08K2003/2227C08K2003/222C08K2003/2296C08K5/14C08K5/5425C08K5/544C08K2003/282C08K2003/385C08K3/34B29B7/7495B29B7/823B29B7/7485B29B7/7461B29B7/002B29B7/88B29B7/94B29B9/12
Inventor 张伟明
Owner SIIICO TECH CO LTD
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