Electroless Tin Plating Solutions for Printed Circuit Boards
A printed circuit board, chemical tin plating technology, applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of easy permeation, high storage conditions, and inconspicuous crystallization, etc., to reduce Adverse effects, high deoxidation efficiency, and excellent compatibility
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0054] Stannous ion: 10g / L;
[0055] Thiourea: 70g / L;
[0056] Methanesulfonic acid: 70g / L;
[0057] Citric acid: 30g / L;
[0058] Tetrasodium iminodisuccinate: 50g / L;
[0059] Carbohydrazide: 30g / L;
[0060] Sodium dodecylbenzenesulfonate: 10mg / L;
[0061] Bismuth acetate: 0.15g / L;
[0062] Polyamino polyether methylene phosphonic acid: 20g / L;
[0063] The bath temperature is 65°C; the time is 15 minutes;
[0064] The thickness of the obtained coating is 0.84 μm, and the surface morphology of the coating is as follows figure 1 shown, from figure 1 It can be seen from the figure that the industry generally requires the thickness of the electroless tin coating to be above 0.8 microns. The thickness of the coating under this formula and parameter conditions meets the requirements of the industry, and the crystallization of the coating is clear and dense.
Embodiment 2
[0066] Stannous ion: 30g / L;
[0067] Thiourea: 130g / L;
[0068] Methanesulfonic acid: 30g / L;
[0069] Citric acid: 60g / L;
[0070] Tetrasodium iminodisuccinate: 20g / L;
[0071] Carbohydrazide: 10g / L;
[0072] Sodium dodecylbenzenesulfonate: 50mg / L;
[0073] Bismuth acetate: 0.05g / L;
[0074] Polyamino polyether methylene phosphonic acid: 40g / L;
[0075] The bath temperature is 70°C; the time is 15 minutes;
[0076] The thickness of the obtained coating is 1.34 μm, and the surface morphology of the coating is as follows figure 2 shown, from figure 2 It can be seen from the figure that the industry generally requires the thickness of the electroless tin coating to be above 0.8 microns, and the thickness of the coating under this formula and parameter conditions meets the requirements of the industry, and the crystallization of the coating is clear and dense.
Embodiment 3
[0078] Stannous ion: 20g / L;
[0079] Thiourea: 100g / L;
[0080] Methanesulfonic acid: 45g / L;
[0081] Citric acid: 50g / L;
[0082] Tetrasodium iminodisuccinate: 35g / L;
[0083] Carbohydrazide: 15g / L;
[0084] Sodium lauryl sulfate: 45mg / L;
[0085] Bismuth acetate: 0.1g / L;
[0086] Polyamino polyether methylene phosphonic acid: 30g / L;
[0087] The bath temperature is 75°C; the time is 15 minutes;
[0088] The thickness of the coating is 1.28 μm, and the surface morphology of the coating is as follows image 3 shown, from image 3 It can be seen from the figure that the industry generally requires the thickness of the electroless tin coating to be above 0.8 microns. The thickness of the coating under this formula and parameter conditions meets the requirements of the industry, and the crystallization of the coating is clear and dense.
[0089] As a comparative example: use a commercially available chemical tin plating solution to carry out chemical tin plating, the tem...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com