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A modified polybutadiene prepolymer and its preparation method and application

A technology for polybutadiene and epoxidized polybutadiene is applied in the field of modified polybutadiene prepolymer and its preparation, which can solve the problem of poor compatibility and insufficient dielectric properties of polybutadiene. Reflection, low bromine-carbon bond energy, etc.

Active Publication Date: 2019-07-12
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during use, the polybutadiene composition has the following problems: (1) the high viscosity of the prepreg (prepreg), which is not conducive to storage and use; (2) poor compatibility with other resins, in the lamination process Phase separation occurs in the laminate and bleeds out of the laminate, resulting in insufficient performance of the excellent dielectric properties of polybutadiene and a reduction in the heat resistance of the sheet
This method only achieves sufficient curing of polybutadiene and does not improve compatibility with other resins
In addition, the resin composition is a brominated flame retardant. On the one hand, the toxic and highly corrosive hydrogen bromide gas produced during the combustion process will cause harm to human health and the ecological environment; The bromine-carbon bond energy is low, easy to break and lead to relatively low thermal decomposition temperature, so there are deficiencies in the application of high-performance printed board materials

Method used

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  • A modified polybutadiene prepolymer and its preparation method and application
  • A modified polybutadiene prepolymer and its preparation method and application
  • A modified polybutadiene prepolymer and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] Prepare JP100:BMI-1:CE-1:BP=100:40:30:1.5 prepolymer solid 100g (liquid 181.81g) according to the method in the synthesis example, add 10g phosphazene compound (SPB-100, Japan Otsuka Chemical), 8g styrene-butadiene copolymer (D1117, Kraton Polymers), 25DBPH 2g, 80g spherical silica (average particle size 0.7μm, SFP-30M, DENKA) and an appropriate amount of toluene solvent , Stir and mix evenly to obtain a glue solution with a solid content of 65%.

[0059] The glue is dipped and coated on E glass fiber cloth (2116, unit weight is 104g / m 2 ) and baked in an oven at 160°C for 5 minutes to obtain a prepreg with a resin content of 50%.

[0060] The prepared prepreg with a resin content of 50% was placed with a metal copper foil on the upper and lower sides, and pressed in a vacuum hot press to obtain a copper clad laminate. The specific pressing process is pressing at a pressure of 1.5Mpa and a temperature of 220° C. for 2 hours.

[0061] The properties of the obtained co...

Embodiment 2

[0064] Prepare JP100:BMI-2:CE-2:BP=100:50:40:1.5 prepolymer solid 100g (liquid 181.81g) according to the method in the synthesis example, add 9g phosphazene compound (SPB-100, Japan Otsuka Chemical), 8g styrene-butadiene copolymer (D1117, Kraton Polymers), 25DBPH2g, 80g spherical silica (average particle size 0.7μm, SFP-30M, DENKA) and an appropriate amount of toluene solvent, Stir and mix evenly to obtain a glue solution with a solid content of 65%.

[0065] The preparation methods of the prepreg and the copper-clad laminate are the same as in the first embodiment.

[0066] The properties of the obtained copper-clad laminates are shown in Table 2.

[0067] The preparation method of the interlayer insulating film is the same as the first embodiment.

Embodiment 3

[0069] Prepare JP100:BMI-3:CE-2:BP=100:45:45:1.5 prepolymer solid 100g (liquid 181.81g) according to the method in the synthesis example, add 11g phosphazene compound (SPB-100, Japan Otsuka Chemical), 8g styrene-butadiene copolymer (D1117, Kraton Polymers), 25DBPH2g, 80g spherical silica (average particle size 0.7μm, SFP-30M, DENKA) and an appropriate amount of toluene solvent, Stir and mix evenly to obtain a glue solution with a solid content of 65%.

[0070] The preparation methods of the prepreg and the copper-clad laminate are the same as in the first embodiment.

[0071] The properties of the obtained copper-clad laminates are shown in Table 2.

[0072] The preparation method of the interlayer insulating film is the same as the first embodiment.

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Abstract

The invention relates to a modified polybutadiene prepolymer as well as a preparation method and application thereof, resin composition prepared from the modified polybutadiene prepolymer, a prepreg prepared from the resin composition, a metal foil coated laminated board and a layer insulation film. The modified polybutadiene prepolymer is a prepolymer of an epoxy polybutadiene mixture, bismaleimide resin and cyanate ester in the weight ratio being 100: (10-60): (15-80). The problem that polybutadiene is incompatible with other resin is solved, the adhesion performance of a hydrocarbon resin system is improved, the peel strength between copper foil of the laminated board and the resin layer is improved, and the dielectric performance of the resin system is not affected. The brittleness of a maleimide cured product is improved by the aid of epoxy polybutadiene resin, polybutadiene and silica-containing butadiene.

Description

technical field [0001] The invention relates to a prepolymer of modified polybutadiene and a preparation method thereof, a resin composition made of the prepolymer of modified polybutadiene, a prepreg made of the resin composition, and a metal-clad foil Laminates and interlayer insulating films. Background technique [0002] In recent years, information terminals such as personal computers and servers, and communication equipment such as Internet routers and optical communications process large-capacity information at high speeds, and the high-speed and high-frequency electrical signals are advancing. The integrity of high-speed high-frequency products is the focus of attention. The impact of printed circuit board materials on high-speed signal integrity is mainly reflected in signal loss, including reflection, skin effect, and dielectric loss. In addition, due to the development of electronic products and electronic components in the direction of "light, thin, short, and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L51/00C08L79/04C08L53/02C08K7/18C08K5/5399C08F279/02C08F222/40C08J5/24B32B27/20B32B15/092
CPCB32B15/092B32B27/20B32B2305/076B32B2307/204B32B2457/08C08F279/02C08J5/24C08J2351/00C08J2479/04C08K2201/011C08L51/003C08L2201/02C08L2201/08C08L2203/20C08L2205/03C08L2205/04C08L2207/04C08L2312/00C08F222/40C08L79/04C08L53/02C08K7/18C08K5/5399
Inventor 谌香秀季立富任科秘崔春梅陈诚肖升高黄荣辉戴善凯
Owner SHENGYI TECH SUZHOU
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