Pouring sealant used for power electronic device and preparation method of pouring sealant

A technology for power electronic devices and potting glue, which is applied in the field of potting glue to achieve the effects of reducing the generation of black substances, improving interface performance, excellent hydrophobicity and antifouling ability

Inactive Publication Date: 2017-10-03
HEFEI TONGYOU ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The encapsulant has good fluidity, is easy to use, and can be cured at room temperature or high temperature. The cured product has excellent flame retardancy and thermal conductivity, and can be widely used in the fields of electronic appliances, chip packaging, LED packaging, etc.; strengthen

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A potting compound for power electronic devices in this embodiment includes the following raw materials in parts by weight:

[0030] Component A: 70 parts of vinyl silicone oil, 28 parts of brominated epoxy resin, 3 parts of hydrogen-containing silicone oil, 1 part of coupling agent, 6 parts of epoxyacetyl ricinoleic acid methyl ester;

[0031] Component B: 90 parts of vinyl silicone oil, 1 part of platinum catalyst, 5 parts of antimony trioxide, 20 parts of magnesium hydroxide, 8 parts of boron carbide, 15 parts of calcium carbonate, 2 parts of carbon black, 11 parts of polysiloxane resin , 7 parts of tributyl citrate, 0.5 part of antistatic agent.

[0032] In this embodiment, the vinyl silicone oil is a mixture of vinyl-terminated polydimethylvinylsiloxane and vinyl-terminated polymethylvinylsiloxane, and the weight ratio between the two is 6:1.

[0033] In this embodiment, the hydrogen-containing silicone oil is hydrogen-containing silicone oil with a hydrogen conte...

Embodiment 2

[0045] A potting compound for power electronic devices in this embodiment includes the following raw materials in parts by weight:

[0046] Component A: 75 parts of vinyl silicone oil, 30 parts of brominated epoxy resin, 4 parts of hydrogen-containing silicone oil, 2 parts of coupling agent, 7 parts of methyl epoxyacetyl ricinoleate;

[0047] Component B: 90-100 parts of vinyl silicone oil, 4 parts of platinum catalyst, 6 parts of antimony trioxide, 22 parts of magnesium hydroxide, 9 parts of boron carbide, 16 parts of calcium carbonate, 3 parts of carbon black, polysiloxane resin 13 parts, 8 parts of tributyl citrate, 0.8 parts of antistatic agent.

[0048] In this embodiment, the vinyl silicone oil is a mixture of vinyl-terminated polydimethylvinylsiloxane and vinyl-terminated polymethylvinylsiloxane, and the weight ratio between the two is 6:1.

[0049] In this embodiment, the hydrogen-containing silicone oil is hydrogen-containing silicone oil with a hydrogen content of 1...

Embodiment 3

[0061] A potting compound for power electronic devices in this embodiment includes the following raw materials in parts by weight:

[0062] Component A: 80 parts of vinyl silicone oil, 32 parts of brominated epoxy resin, 5 parts of hydrogen-containing silicone oil, 3 parts of coupling agent, 8 parts of epoxyacetyl ricinoleic acid methyl ester;

[0063] Component B: 100 parts of vinyl silicone oil, 6 parts of platinum catalyst, 7 parts of antimony trioxide, 24 parts of magnesium hydroxide, 10 parts of boron carbide, 17 parts of calcium carbonate, 4 parts of carbon black, 15 parts of polysiloxane resin , 9 parts of tributyl citrate, 1 part of antistatic agent.

[0064] In this embodiment, the vinyl silicone oil is a mixture of vinyl-terminated polydimethylvinylsiloxane and vinyl-terminated polymethylvinylsiloxane, and the weight ratio between the two is 6:1.

[0065] In this embodiment, the hydrogen-containing silicone oil is hydrogen-containing silicone oil with a hydrogen con...

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PUM

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Abstract

The invention discloses a pouring sealant used for a power electronic device, and belongs to the technical field of pouring sealants. The pouring sealant comprises the following raw materials in parts by weight: a component A: 70-80 parts of vinyl silicone oil, 28-32 parts of brominated epoxy resin, 3-5 parts of hydro-silicone oil, 1-3 parts of a coupling agent and 6-8 parts of epoxidized methyl acetorieinoleate; and a component B: 90-100 parts of vinyl silicone oil, 1-6 parts of a platinum catalyst, 5-7 parts of antimonous oxide, 20-24 parts of magnesium hydroxide, 8-10 parts of boron carbide, 15-17 parts of calcium carbonate, 2-4 parts of carbon black, 11-15 parts of polysiloxane, 7-9 parts of tributyl citrate and 0.5-1 part of an antistatic agent. The invention also discloses a preparation method of the pouring sealant used for the power electronic device. The pouring sealant is strong in mechanical property, comparatively high in high temperature resistance and inflaming retarding capability and long in service life.

Description

technical field [0001] The invention relates to the technical field of potting glue, in particular to a potting glue for power electronic devices and a preparation method thereof. Background technique [0002] With the further realization of high performance, high reliability and miniaturization in electronic components, power circuit modules, large integrated circuit boards, LED and other high-tech fields, and the harsher working environment, it is required that the potting parts must be between low temperature and high temperature, Operating under conditions such as high-speed rotation requires potting materials not only to have excellent high and low temperature resistance, mechanical properties, electrical insulation properties, etc., but also to have good thermal conductivity and flame retardancy. [0003] At present, the most widely used potting materials are various synthetic polymers, among which epoxy resin, polyurethane and synthetic rubber are widely used. Silico...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L63/00C08L83/05C08L83/04C08K13/02C08K5/1515C08K3/22C08K3/38C08K3/26C08K5/11C08K3/04
CPCC08L83/04C08K2003/2224C08K2003/265C08K2201/003C08L2201/02C08L2201/04C08L2201/08C08L2203/206C08L2205/025C08L2205/035C08L63/00C08K13/02C08K5/1515C08K3/2279C08K3/22C08K3/38C08K3/26C08K5/11C08K3/04
Inventor 李丹丹
Owner HEFEI TONGYOU ELECTRONICS TECH CO LTD
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