Nanometer material and preparation method and application thereof

A nanometer and raw material technology, applied in the field of nanomaterials and its preparation, can solve the problems of insufficient matching of efficiency and space requirements, and achieve the effects of low production cost, efficient heat dissipation, and high thermal conductivity

Inactive Publication Date: 2017-10-03
GUANGZHOU JINYUANDA ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, traditional cooling fin tubes or cooling fins are still obviously insufficient in terms of efficiency and space requirements.

Method used

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  • Nanometer material and preparation method and application thereof
  • Nanometer material and preparation method and application thereof
  • Nanometer material and preparation method and application thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0022] Preferably, the preparation method of the water-based epoxy modified resin comprises the following steps: adding a monomer and an initiator to the epoxy resin E-51, and reacting at 72-80°C for 7-8 hours to obtain a modified water-based epoxy resin; wherein , the monomer is α-methacrylic acid, the initiator is potassium persulfate, and the mass ratio of epoxy resin, monomer and initiator is (220-250):100:(1.5-1.8).

[0023] Preferably, the raw material components of the diamond-like carbon compound include, in parts by weight, 40-45 parts by weight of carbon, 15-18 parts by weight of silicon and 22-25 parts by weight of germanium.

[0024] Preferably, the raw material components of the silicon-based compound, in parts by weight, include: 10-15 parts by weight of silicon carbonate, 20-30 parts by weight of potassium silicate, 16-20 parts by weight of silicon carbide and 8-10 parts by weight of silicon nitride .

[0025] Preferably, the raw material components of the solv...

Embodiment 1

[0030] This embodiment provides a nanometer material, the raw material components are calculated by weight, including: 40 parts by weight of polymer resin, 30 parts by weight of solvent, 10 parts by weight of titanium dioxide, 8 parts by weight of silicon dioxide, and 15 parts by weight of silicon-based compound and diamond-like carbon compound 25 parts by weight;

[0031]Among them, the raw material components of the polymer resin include 15 parts by weight of acrylate silicone, 30 parts by weight of water-based epoxy modified resin, 5 parts by weight of polyvinyl chloride resin, trihydroxymethylpropane trimethacrylic acid 4 parts by weight of ester and 7 parts by weight of 2-lauryl acrylate; acrylate silicone is made of methyl methacrylate (acrylic acid monomer), vinyl-terminated polydimethylsiloxane (functional group polysilicon oxane), vinyltrimethoxysilane (organosilicon monomer) obtained by emulsion polymerization with a mass ratio of 25:12:1; the preparation method of w...

Embodiment 2

[0038] This embodiment provides a nanometer material, the raw material components are calculated by weight, including: 50 parts by weight of polymer resin, 25 parts by weight of solvent, 12 parts by weight of titanium dioxide, 6 parts by weight of silicon dioxide, and 20 parts by weight of silicon-based compound and 20 parts by weight of diamond-like carbon compound;

[0039] Among them, the raw material components of the polymer resin include 20 parts by weight of acrylate silicone, 20 parts by weight of water-based epoxy modified resin, 10 parts by weight of polyvinyl chloride resin, trimethylolpropane trimethacrylic acid 2 parts by weight of ester and 9 parts by weight of 2-lauryl acrylate; acrylate silicone is made of methyl methacrylate (acrylic acid monomer), vinyl-terminated polydimethylsiloxane (functional group polysilicon) oxane), vinyltrimethoxysilane (organosilicon monomer) are obtained by emulsion polymerization with a mass ratio of 30:15:1; the preparation method...

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Abstract

The invention relates to a nanometer material and a preparation method and application thereof. The nanometer material comprises 40 to 50 parts by weight of a polymer resin, 25 to 30 parts by weight of a solvent, 10 to 12 parts by weight of titanium dioxide, 6 to 8 parts by weight of silicon dioxide, 15 to 20 parts by weight of a silicon-based compound and 20 to 25 parts by weight of a diamond-like carbon compound. The nanometer material has the function of quickly exchanging hot and cold and can be widely used in preparation of the surface coating of the heat dissipation device. The nanometer material can utilize a simple spray-coating, smearing-coating or immersion-coating method, completely replace an expensive vacuum coating film and solve the problem of 3D curved surfaces. The nanometer coating film has excellent characteristics.

Description

technical field [0001] The invention relates to the field of material technology, in particular to a nanometer material and its preparation method and application. Background technique [0002] There are only three ways to conduct heat, namely conduction, convection and radiation. Traditionally, heat dissipation is solved by conduction and convection, because at normal temperature, radiation heat dissipation is not obvious, and the effect of radiation is only significant when it is above 300°C. Radiation heat dissipation is a phenomenon in which heat is not conducted through objects, nor is it carried by liquid and gas, and the heat source is directly transmitted to various places in a non-linear 360° manner. Unlike traditional convection, the heat energy of radiation is released in the form of electromagnetic waves (full wavelength), so there is no need for physical contact between high-temperature objects and low-temperature environments, and there is no need for a medium...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D151/00C09D7/12C08F291/06C08F291/10C08F291/04C08F222/14C08F220/18C09K5/14B82Y30/00
CPCC09D151/003C09K5/14B82Y30/00C08F259/04C08F285/00C08K2003/2241C08K2003/023C08L2205/03C08L2205/025C08L51/003C08K3/22C08K3/26C08K3/24C08K3/14C08K3/28C08K3/04C08K3/02C08K3/08C08F220/1812C08F222/103
Inventor 杨明文
Owner GUANGZHOU JINYUANDA ELECTRONICS TECH CO LTD
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