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Electronic paste based on low-melting-point metal micro-nano powders and manufacture method thereof

A low-melting point metal and electronic paste technology, which is applied in the direction of cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve the problems of high melting point and large contact resistance, and achieve low sintering temperature, The effect of small contact resistance and low disconnection rate

Active Publication Date: 2017-10-20
YUNNAN KEWEI LIQUID METAL VALLEY R & D CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is not difficult to see that the melting point of the metal component of the above-mentioned conductive paste is relatively high. After sintering, the conductive phase is still in contact with the particles, so the contact resistance is relatively large.

Method used

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  • Electronic paste based on low-melting-point metal micro-nano powders and manufacture method thereof
  • Electronic paste based on low-melting-point metal micro-nano powders and manufacture method thereof
  • Electronic paste based on low-melting-point metal micro-nano powders and manufacture method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Embodiment 1 sintered slurry

[0028] An electronic paste based on low-melting-point metal micro-nano powder. The components in the paste are shown in Table 1. The bismuth-based alloy powder in Table 1 can have a particle size of 1 nm to 10 microns and is commercially available.

[0029] The preparation method of the electronic paste: select the low-melting-point metal micro-nano powder according to the required melting point value, dissolve the additive in the solvent according to the mass ratio to obtain an organic carrier, mix and roll the low-melting-point metal micro-nano powder, the organic carrier, and the adhesive into a uniform paste. The rolling equipment is a three-roll mill. Process see figure 1 , is the preparation method of organic solvent required for low temperature curing; ingredients can choose bisphenol A type epoxy resin acid, anhydride curing agent, butyl acetate, toluene, polyethylene glycol, silane coupling agent and so on.

Embodiment 2-5

[0031] The composition of each component in the slurry is shown in Table 1. The preparation method is the same as in Example 1.

[0032] Table 1: Composition of Electronic Paste in Examples 1-5

[0033]

[0034] Table 2: Performance of the electronic paste of Examples 1-5

[0035]

[0036]

[0037] The above-mentioned examples are high-temperature sintered bismuth-based electronic pastes. From Example 1 to Example 5, the content of the bismuth-based alloy increases from 55% to 75%, and the electrical conductivity of the electronic paste is improved. It can also be adjusted between 45% and 90% according to actual needs.

[0038] In the above examples, from Example 1 to Example 5, the melting point of the alloy has been increasing. In actual production, the proportion structure of the alloy can be adjusted according to the demand to reach the required melting point value. For example, add or replace one or more of cadmium, lead, zinc, silver, gallium, copper, etc. in...

Embodiment 6-10

[0041] Embodiment 6-10 Low-temperature curable slurry

[0042] The preparation method of the electronic paste: select the low-melting-point metal micro-nano powder according to the required melting point value, dissolve the additive in the solvent according to the mass ratio to obtain an organic carrier, mix and roll the low-melting-point metal micro-nano powder, the organic carrier, and the adhesive into a uniform paste. The rolling equipment is a three-roll mill. Process see figure 2 , for the preparation of organic solvents required for high-temperature sintering; raw materials can choose terpineol, ethyl cellulose, furoic acid, nickel powder, toluene, etc.

[0043] Table 3 Electronic Paste Composition

[0044]

[0045] Table 4 Embodiment 6-10 electronic paste performance

[0046]

[0047]

[0048] The above-mentioned examples are low-temperature curing bismuth-based electronic pastes. From Example 6 to Example 10, the content of the bismuth-based alloy increa...

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Abstract

The invention provides an electronic paste based on low-melting-point metal micro-nano powders. The electronic paste is composed of low-melting-point metal micro-nano powders, a binder, a solvent and an auxiliary agent. The mass proportion of the low-melting-point metal micro-nano powders in the electronic paste is 45 to 90%. The melting point of low-melting-point metal is -78 to 232 degree centigrade. The electronic paste is suitable for traditional printing methods such as silk screen printing and can be widely used in printing electronic industry, such as front and back electrodes of solar panels, RFID tags, cell phone antennas, non-contact IC card antenna lines, and the like. The electronic paste has the advantages of high printing precision, low sintering temperature, no diffusion after sintering, low breaking rate, small contact resistance and low cost.

Description

technical field [0001] The invention belongs to the technical field of printed electronics, and in particular relates to an electronic paste containing low melting point metal powder and a manufacturing method thereof. Background technique [0002] Printed electronics is an emerging process technology that applies traditional printing (or coating) processes to the manufacture of electronic components and products. Although the current printed electronic components and products have not yet reached the level of traditional silicon-based microelectronic devices in terms of resolution, integration, and information capacity, the printed electronic process technology has the potential to save resources, be green, low-cost, and flexible. Large-area production and other remarkable features have very broad development prospects. [0003] Electronic paste is one of the basic materials in the printed electronics industry. It is made of solid conductive powder, binder and organic solv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/16H01B1/22H01B13/00
CPCH01B1/16H01B1/22H01B13/00
Inventor 邓中山耿成都蔡昌礼杜旺丽刘静
Owner YUNNAN KEWEI LIQUID METAL VALLEY R & D CO LTD
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