Electronic paste based on low-melting-point metal micro-nano powders and manufacture method thereof
A low-melting point metal and electronic paste technology, which is applied in the direction of cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve the problems of high melting point and large contact resistance, and achieve low sintering temperature, The effect of small contact resistance and low disconnection rate
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Embodiment 1
[0027] Embodiment 1 sintered slurry
[0028] An electronic paste based on low-melting-point metal micro-nano powder. The components in the paste are shown in Table 1. The bismuth-based alloy powder in Table 1 can have a particle size of 1 nm to 10 microns and is commercially available.
[0029] The preparation method of the electronic paste: select the low-melting-point metal micro-nano powder according to the required melting point value, dissolve the additive in the solvent according to the mass ratio to obtain an organic carrier, mix and roll the low-melting-point metal micro-nano powder, the organic carrier, and the adhesive into a uniform paste. The rolling equipment is a three-roll mill. Process see figure 1 , is the preparation method of organic solvent required for low temperature curing; ingredients can choose bisphenol A type epoxy resin acid, anhydride curing agent, butyl acetate, toluene, polyethylene glycol, silane coupling agent and so on.
Embodiment 2-5
[0031] The composition of each component in the slurry is shown in Table 1. The preparation method is the same as in Example 1.
[0032] Table 1: Composition of Electronic Paste in Examples 1-5
[0033]
[0034] Table 2: Performance of the electronic paste of Examples 1-5
[0035]
[0036]
[0037] The above-mentioned examples are high-temperature sintered bismuth-based electronic pastes. From Example 1 to Example 5, the content of the bismuth-based alloy increases from 55% to 75%, and the electrical conductivity of the electronic paste is improved. It can also be adjusted between 45% and 90% according to actual needs.
[0038] In the above examples, from Example 1 to Example 5, the melting point of the alloy has been increasing. In actual production, the proportion structure of the alloy can be adjusted according to the demand to reach the required melting point value. For example, add or replace one or more of cadmium, lead, zinc, silver, gallium, copper, etc. in...
Embodiment 6-10
[0041] Embodiment 6-10 Low-temperature curable slurry
[0042] The preparation method of the electronic paste: select the low-melting-point metal micro-nano powder according to the required melting point value, dissolve the additive in the solvent according to the mass ratio to obtain an organic carrier, mix and roll the low-melting-point metal micro-nano powder, the organic carrier, and the adhesive into a uniform paste. The rolling equipment is a three-roll mill. Process see figure 2 , for the preparation of organic solvents required for high-temperature sintering; raw materials can choose terpineol, ethyl cellulose, furoic acid, nickel powder, toluene, etc.
[0043] Table 3 Electronic Paste Composition
[0044]
[0045] Table 4 Embodiment 6-10 electronic paste performance
[0046]
[0047]
[0048] The above-mentioned examples are low-temperature curing bismuth-based electronic pastes. From Example 6 to Example 10, the content of the bismuth-based alloy increa...
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