A kind of preparation method of high thermal conductivity alumina ceramic copper clad laminate
A technology of alumina ceramics and copper clad laminates, which is applied in the field of copper clad laminates, can solve the problems affecting the thermal conductivity of IGBT circuit boards and the quality of IGBT circuit boards, and achieve the effects of reducing void defects, reducing equipment requirements, and high reaction efficiency
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Embodiment 1
[0032] A method for preparing a high thermal conductivity alumina ceramic copper clad laminate, comprising the following steps:
[0033] 1) Pretreatment of waste copper and aluminum alloys: the waste copper and aluminum alloys are crushed in a crusher in turn, screened materials and other impurities are removed, washed in deionized water and alcohol solution to remove dust, and dried in a 150°C drying oven for 6 hours;
[0034] 2) Water mist powdering treatment: melting in a vacuum induction furnace at a melting temperature of 1100°C and a holding time of 4 hours, and then spraying water mist powder at 950°C with an atomization pressure of 30 MPa and a spray angle of 45 degrees to obtain powder;
[0035] 3) hydrogen peroxide oxidation treatment: add 40% hydrogen peroxide solution to the powder obtained in step 2), and the reaction time is 4 hours to obtain a mixed slurry;
[0036] 4) Centrifugal dehydration treatment: the mixed slurry obtained in step 3) is subjected to centr...
Embodiment 2
[0043] A method for preparing a high thermal conductivity alumina ceramic copper clad laminate, comprising the following steps:
[0044] 1) Pretreatment of waste copper and aluminum alloys: the waste copper and aluminum alloys are crushed in a crusher in turn, screened materials and other impurities are removed, washed in deionized water and alcohol solution to remove dust, and dried in a 200°C drying oven for 6 hours;
[0045] 2) Water mist powdering treatment: melting in a vacuum induction furnace at a melting temperature of 1150°C and a holding time of 4 hours, and then spraying water mist powder at 960°C with an atomization pressure of 20 MPa and a spray angle of 50 degrees to obtain powder;
[0046] 3) hydrogen peroxide oxidation treatment: add 50% hydrogen peroxide solution to the powder obtained in step 2), and the reaction time is 4 hours to obtain a mixed slurry;
[0047] 4) Centrifugal dehydration treatment: the mixed slurry obtained in step 3) is subjected to centrif...
Embodiment 3
[0054] A method for preparing a high thermal conductivity alumina ceramic copper clad laminate, comprising the following steps:
[0055] 1) Pretreatment of waste copper and aluminum alloys: the waste copper and aluminum alloys are crushed in a crusher in turn, screened materials and other impurities are removed, washed in deionized water and alcohol solution to remove dust, and dried in a 180°C drying oven for 2 hours;
[0056] 2) Water mist powdering treatment: Melting in a vacuum induction furnace at a melting temperature of 1100°C and holding time of 4 hours, then spraying water mist powder at 960°C with an atomization pressure of 35MPa and a spray angle of 47 degrees to obtain powder;
[0057] 3) hydrogen peroxide oxidation treatment: add 55% hydrogen peroxide solution to the powder obtained in step 2), and the reaction time is 4 hours to obtain a mixed slurry;
[0058] 4) Centrifugal dehydration treatment: the mixed slurry obtained in step 3) is subjected to centrifugal ...
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