Unlock instant, AI-driven research and patent intelligence for your innovation.

Polyphenylene oxide resin adhesive for preparing copper-clad plate and preparation method of polyphenylene oxide resin adhesive

A technology of polyphenylene ether resin and copper clad board, applied in the direction of polyether adhesive, adhesive type, polymer adhesive additive, etc., can solve the problem of difficult reaction, large steric hindrance of terminal hydroxyl groups, and dielectric properties and heat resistance, etc., to achieve the effects of good mechanical processing performance, excellent heat and humidity resistance, and excellent comprehensive performance

Inactive Publication Date: 2018-06-01
NANYA NEW MATERIAL TECH CO LTD
View PDF4 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, thermoplastic macromolecular PPE has disadvantages such as high melt viscosity and difficult processing and molding. Therefore, the use of small molecular PPE, small molecular PPE (Mw: 1000-5000), can meet the processing characteristics of CCL
However, there are still problems in the direct application of small molecule PPE to high-performance copper-clad laminates. The terminal hydroxyl group has large steric hindrance, low activity, difficult reaction, and easy incomplete reaction, which will adversely affect the dielectric properties and heat resistance properties.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polyphenylene oxide resin adhesive for preparing copper-clad plate and preparation method of polyphenylene oxide resin adhesive
  • Polyphenylene oxide resin adhesive for preparing copper-clad plate and preparation method of polyphenylene oxide resin adhesive
  • Polyphenylene oxide resin adhesive for preparing copper-clad plate and preparation method of polyphenylene oxide resin adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3 and comparative example 1～3

[0039] A polyphenylene ether resin composition and the adhesive prepared by using the main raw materials are multifunctional epoxy resin, low dielectric epoxy resin, cyanate ester, active ester, polyphenylene ether, flame retardant, inorganic filler, Composed of organic solvents and toughening agents.

[0040] Table 1

[0041]

[0042]

[0043] 1. The specific preparation process is as follows:

[0044] a. Add organic solvent and silane in the mixing tank in sequence according to the formula amount, turn on the high-speed agitator at a speed of 1000-1500 rpm, keep stirring continuously and control the temperature of the tank at 20-50°C, then add inorganic filler and flame retardant agent, after adding, keep stirring for 20-60 minutes;

[0045] b. Add multifunctional epoxy resin, low-dielectric epoxy resin, cyanate ester, active ester, polyphenylene ether, and toughening agent in sequence according to the formula amount in the stirring tank, and stir at a speed of 1000-...

Embodiment 4

[0052] A polyphenylene ether resin adhesive for preparing copper-clad laminates, using the following components and raw materials in parts by weight: multifunctional epoxy resin 1, low dielectric epoxy resin 10, cyanate ester 5, and active ester curing Agent 10, polyphenylene ether 10, flame retardant 5, silane 0.01, metal curing accelerator 0.005, imidazole accelerator 0.01, inorganic filler 10, toughening agent 1.

[0053] The multifunctional epoxy resin used is 1,1,2,2-tetra(p-hydroxyphenyl)ethane tetraglycidyl ether epoxy resin, and the low dielectric epoxy resin is biphenyl epoxy resin, cyanate ester It is a bisphenol type cyanate, and the active ester curing agent is an active ester curing agent containing a naphthalene ring structure. The weight average molecular weight of polyphenylene ether is less than 2000, and the end group has a phenolic hydroxyl group. The electrical properties are good. In this embodiment, decabromodiphenyl ether is used, and the silane is γ-(2,...

Embodiment 5

[0059] A polyphenylene ether resin adhesive for preparing copper-clad laminates, using the following components and raw materials in parts by weight: multifunctional epoxy resin 10, low dielectric epoxy resin 20, cyanate ester 30, active ester curing Agent 20, polyphenylene ether 50, flame retardant 30, silane 1, metal curing accelerator 0.1, imidazole accelerator 0.2, inorganic filler 40, toughening agent 15.

[0060] The polyfunctional epoxy resin that adopts is the epoxy resin of following structure:

[0061]

[0062] The low-dielectric epoxy resin is polyphenylene ether epoxy resin, and the cyanate ester is Primaset from Lonza, Switzerland. TM BA-3000S resin. The active ester curing agent adopts the active ester containing dicyclopentadiene biphenol structure. The weight-average molecular weight of polyphenylene ether is less than 2000, and the terminal group has phenolic hydroxyl groups. The polyphenylene ether resin of the following structural formula is used in thi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention relates to a polyphenylene oxide resin adhesive for preparing a copper-clad plate and a preparation method of the polyphenylene oxide resin adhesive. The adhesive comprises the followingraw materials components in parts by weight: 1 to 20 parts of polyfunctional epoxy resin, 10 to 50 parts of low-dielectric epoxy resin, 5 to 50 parts of cyanate ester, 10 to 30 parts of an active ester curing agent, 10 to 60 parts of polyphenyl ether, 5 to 40 parts of a flame retardant, 0.01 to 3 parts of silane, 0.005 to 0.3 part of a metal series curing accelerator, 0.01 to 0.3 part of an imidazole accelerant, 10 to 60 parts of an inorganic filler, and 1 to 20 parts of a flexibilizer. Compared with the prior art, the polyphenylene oxide resin adhesive can ensure that a formed copper-clad plate has low water absorption, low dielectric loss and excellent humidity resistance.

Description

technical field [0001] The invention relates to an adhesive and a preparation method thereof, in particular to a polyphenylene ether resin adhesive for preparing copper clad boards and a preparation method thereof. Background technique [0002] The 21st century has entered a highly informationized society, and the IT industry has become a typical and representative industry in the 21st century. The important technical basis for the development of the IT industry is high-speed, high-frequency, and large-capacity signal transmission. Therefore, the manufacturing technology of electronic components and electronic products that support the development of the IT industry has also entered a new revolution. This means that the printed circuit board (PCB), as the key basic material of electronic components and electronic products, must develop in the direction of "high frequency and high speed". At the same time, it has the functions of signal transmission and strengthening the hig...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J171/12C09J163/00C09J11/04C09J11/06C09J11/08
CPCC08K2003/282C08L2205/025C08L2205/035C08L2205/06C08L2207/53C09J11/04C09J11/06C09J11/08C09J163/00C09J171/12C08L63/00C08L51/04C08K13/02C08K3/28C08K5/06C08L71/12C08K7/26C08K5/50C08K7/18C08K3/24C08K5/03
Inventor 密亚男粟俊华席奎东包欣洋
Owner NANYA NEW MATERIAL TECH CO LTD